Patent EP0237151A1 successfully refreshed from Google Patents.
EP0237151A1
Expired / Lapsed
EP
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Infrared process and apparatus for infrared soldering components on circuit boards
Assignee: Nortel Networks Ltd
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Filing: 1987-01-21
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Granted: —
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Expires: 2007-01-21
Abstract
Abstract In infrared soldering of components onto circuit boards, where components such as leaded components are first soldered on one surface and then the circuit boards have additional components to be soldered on the other surface, it is a problem that the solder joints of the first arrangement of components can become melted during the second soldering step. Also, heat is reflected from the apparatus and can raise the temperature of components above a defined maximum, In the invention, a heat sink (33) is provided for absorbing heat from the infrared heat source (30) when no circuit board is present, and for absorbing heat from components already soldered, during the second soldering step. Usually the infrared heat source (30) is above the path of the circuit boards and the heat sink (33) is below the path.
Inventors
- 👤 Stanley Donald Entwistle
- 👤 Gabriel Marcantonio
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 12:21
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; B; B23; B23K; B23K1/00; B23K1/005; B23K1/0053; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3494; H05K2203/00; H05K2203/11; H05K2203/1121; H05K2203/30; H05K2203/304; H05K3/341; H05K3/3415
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
94 words
Apparatus for the infrared soldering of components on circuit boards, including a furnace; conveyor means passing through the furnace, and including two spaced apart conveyor members spaced to support circuit boards at their opposite edges; and infrared radiation means mounted on one side of the conveyor means; characterized by a heat sink 33 mounted on the other side of the conveyor means 11; the heat sink 33 abstracting heat from a surface of a circuit board 16 remote from the infrared radiation means 30 and also from any components mounted on the surface 16.
Claim 2
Dependent Claim
94 words
Apparatus for the infrared soldering of components on circuit boards, including a furnace; conveyor means passing through the furnace, and including two spaced apart conveyor members spaced to support circuit boards at their opposite edges; and infrared radiation means mounted on one side of the conveyor means; characterized by a heat sink 33 mounted on the other side of the conveyor means 11; the heat sink 33 abstracting heat from a surface of a circuit board 16 remote from the infrared radiation means 30 and also from any components mounted on the surface 16.
Claim 3
Dependent Claim
50 words
Apparatus as claimed in claim 1, for soldering components on a top surface of a circuit board, characterized by the heat sink 33 being mounted below the conveyor means 11 to abstract heat from the bottom surface of the circuit board 16 and any components mounted on the bottom surface.
Claim 4
Dependent Claim
43 words
Apparatus as claimed in claim 1 or 2, the furnace including a preheat zone, a heat stabilizing zone and a soldering zone, infrared radiation means being mounted in each said zone, characterized by the heat sink 33 mounted in the soldering zone 14.
Claim 5
Dependent Claim
20 words
Apparatus as claimed in claim 2 or 3, characterized by a heat sink 33 mounted in said preheat zone 12.
Claim 6
Dependent Claim
89 words
A process for infrared soldering of components on a surface of a circuit board, including: feeding circuit boards successively through a preheat zone, a heat stabilizing zone and a soldering zone of a furnace; heating one surface of each of said circuit boards and components on said one surface by infrared radiation, characterized by abstracting heat from the other surface of each of the circuit boards and from any components mounted on the other surface of each board by a heat sink 33 in at least the soldering zone.
Claim 7
Dependent Claim
89 words
A process for infrared soldering of components on a surface of a circuit board, including: feeding circuit boards successively through a preheat zone, a heat stabilizing zone and a soldering zone of a furnace; heating one surface of each of said circuit boards and components on said one surface by infrared radiation, characterized by abstracting heat from the other surface of each of the circuit boards and from any components mounted on the other surface of each board by a heat sink 33 in at least the soldering zone.
Claim 8
Dependent Claim
39 words
A process as claimed in claim 11, characterized by abstracting heat from the other surface of each circuit board and components mounted on the other surface by a heat sink 33 in the preheat zone and the soldering zone.
Claim 9
Dependent Claim
18 words
A process as claimed in claim 11, characterized by passing a cooling fluid through the heat sink 33.
Claim 10
Dependent Claim
40 words
Apparatus characterized by the heat shield 18 mounted on the side of the conveyor means remote from the radiation means 30 and a window 31 in the heat shield 18, the heat sink 33 being aligned with the window 31.
Claim 11
Dependent Claim
40 words
Apparatus characterized by the heat shield 18 mounted on the side of the conveyor means remote from the radiation means 30 and a window 31 in the heat shield 18, the heat sink 33 being aligned with the window 31.
Claim 12
Dependent Claim
24 words
Apparatus as claimed in claim 5, characterized by the heat shield 18 being mounted between the conveyor means 11 and the heat sink 33.
Claim 13
Dependent Claim
37 words
Apparatus as claimed in any one of the preceding claims, characterized by heat shields 35, 36 mounted between the infrared radiation means 30 and the conveyor means 11 to shield the conveyor members 11 from infrared radiation.
Claim 14
Dependent Claim
49 words
Apparatus as claimed in any one of the preceding claims, characterized by the heat sink 33 including a finned body of heat absorbent material and a cooling plate 34, the finned body positioned on the cooling plate 34 between the infrared radiation means 30 and the cooling plate 34.
Claim 15
Dependent Claim
29 words
Apparatus as claimed in claim 8, characterized by the cooling plate 34 being of hollow construction and including means 35 for circulating a cooling fluid through the plate 34.
Claim 16
Dependent Claim
24 words
Apparatus as claimed in any one of the preceding claims, characterized by means for circulating a gas through at least the soldering zone 14.
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EP0118091A1
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GB2149708A
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