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US3710069A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of and apparatus for selective solder reflow

Assignee: International Business Machines Corp
•
Filing: 1970-07-06
•
Granted: 1973-01-09
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Expires: 1990-07-06
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Abstract

Abstract A method of selective solder reflow in which an article to be reflowed is heated for a period of time sufficient to melt the solder, and at least one solder deposit which is not to be reflowed is cooled to prevent that solder from melting. In order to reduce temperature gradients in the article, the cooling is delayed until the heating has been applied.

Inventors

  • 👤 J Papadopoulos
  • 👤 D Prince
  • 👤 R Reilly

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 22:56
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/005; B23K1/018; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3494; H05K2203/00; H05K2203/11; H05K2203/1121; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07152; H10W72/072; H10W72/07231; H10W72/07236

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 66 words
A method of selectively reflowing solder deposits on an article comprising the steps of: heating the article to melt at least one solder deposit on the article; cooling, during at least part of the heating step, at least a second solder deposit on the article due to said heating which would melt in the absence of the cooling to prevent the second solder deposit from melting.
Claim 2
Independent Claim 66 words
A method of selectively reflowing solder deposits on an article comprising the steps of: heating the article to melt at least one solder deposit on the article; cooling, during at least part of the heating step, at least a second solder deposit on the article due to said heating which would melt in the absence of the cooling to prevent the second solder deposit from melting.
Claim 3
Dependent Claim 14 words
The method of claim 1 wherein the cooling is by the flow of fluid.
Claim 4
Dependent Claim 14 words
The method of claim 2 wherein the cooling is by the flow of gas.
Claim 5
Dependent Claim 19 words
The method of claim 3 wherein the cooling step is delayed until after the beginning of the heating step.
Claim 6
Dependent Claim 18 words
The method of claim 3 wherein the cooling is increased after the solder to be melted has melted.
Claim 7
Dependent Claim 68 words
Apparatus for selectively reflowing solder deposits on an article comprising: heating means for heating at least one solder deposit on said article; cooling means for cooling at least a second solder deposit on said articLe in a zone substantially affected by said heating means to prevent reflow of that solder deposit; and means for controlling the activation of the cooling means to reduce temperature gradients in the apparatus.
Claim 8
Dependent Claim 68 words
Apparatus for selectively reflowing solder deposits on an article comprising: heating means for heating at least one solder deposit on said article; cooling means for cooling at least a second solder deposit on said articLe in a zone substantially affected by said heating means to prevent reflow of that solder deposit; and means for controlling the activation of the cooling means to reduce temperature gradients in the apparatus.
Claim 9
Dependent Claim 15 words
The apparatus of claim 6 wherein the heating means is a source of radiant energy.
Claim 10
Dependent Claim 18 words
The apparatus of claim 6 wherein the article is positioned between the heating means and the cooling means.
Claim 11
Dependent Claim 16 words
The apparatus of claim 6 wherein the cooling means directs a cooling fluid onto the article.
Claim 12
Dependent Claim 31 words
The apparatus of claim 9 wherein isolation means for isolating the solder to be reflowed from the cooling fluid is disposed between the cooling means and the solder to be reflowed.
Claim 13
Dependent Claim 31 words
The apparatus of claim 10 wherein the isolation means is a portion of the article which forms a barrier to prevent the cooling gas from cooling the solder to be reflowed.
Claim 14
Dependent Claim 16 words
The apparatus of claim 6 wherein the cooling means directs a cooling gas onto the article.
Claim 15
Dependent Claim 30 words
The apparatus of claim 6 wherein the means for controlling the activation of the cooling means operates to delay the activation of the cooling means until after the heating starts.
Claim 16
Dependent Claim 42 words
The apparatus of claim 6 wherein the cooling means has at least two cooling rates, a first cooling rate being used during a first portion of the cooling step, and the second being applied during a second portion of the cooling step.

References Cited (Backward Citations)

US2332368A Cited
US2768595A Cited
US3283124A Cited
US3465116A Cited
US3562481A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-01-09 1976-07-10 1977-01-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-01-09 1980-07-10 1981-01-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-01-09 1984-07-10 1985-01-09 $7700.00 Window Closed / Lapsed

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