Patent EP0225108A1 successfully refreshed from Google Patents.
EP0225108A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Liquid cooling system for integrated circuit chips
Assignee: NEC Corp
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Filing: 1986-11-18
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Granted: —
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Expires: 2006-11-18
Abstract
Abstract A cooling system for integrated circuit chips comprises a substrate, a plurality of integrated circuit chips (2) mounted on a first surface of the substrate (3) and a second surface opposite to the first surface thereof, a heat conductive means (8) having a first surface and a second, flat surface opposite to the first surface, a layer of thermally conductive bonding material (9) between the second surface of the substrate and the first surface of the heat conductive means, and a heat exchanger (16) having a flat surface and provided with inlet (18) and outlet (19) means to permit liquid coolant to flow through the heat exchanger in contact with the flat surface. The heat exchanger is removably mounted to the heat conductive means with the flat surface thereof being in close proximity to the second surface of the heat conductive means. The thermally conductive bonding material allows a low thermal resistance contact to be made between the substrate and the heat conductive means and allows the latter to present a flat plane to the heat exchanger so that a low thermal resistance contact can also be established therebetween.
Inventors
- 👤 Mitsuo C/O Nec Corporation Komoto
- 👤 Youichi C/O Nec Corporation Matsuo
- 👤 Toshifumi C/O Nec Corporation Sano
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 07:22
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/40; H10W40/47
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
140 words
A cooling system for an electronic system comprising: a substrate; a plurality of integrated circuit chips mounted on a first surface of said substrate and a second surface opposite to the first surface thereof; a heat conductive means having a first surface and a second, flat surface opposite to the first surface; a layer of thermally conductive bonding material between the second surface of said substrate and the first surface of said heat conductive means; a heat exchanger having a flat surface and provided with inlet and outlet means to permit liquid coolant to flow through said heat exchanger in contact with said flat surface; and mounting means for removably mounting said heat exchanger to said heat conductive means with said flat surface of said heat exchanger being in close proximity to said second surface of said heat conductive means.
Claim 2
Dependent Claim
140 words
A cooling system for an electronic system comprising: a substrate; a plurality of integrated circuit chips mounted on a first surface of said substrate and a second surface opposite to the first surface thereof; a heat conductive means having a first surface and a second, flat surface opposite to the first surface; a layer of thermally conductive bonding material between the second surface of said substrate and the first surface of said heat conductive means; a heat exchanger having a flat surface and provided with inlet and outlet means to permit liquid coolant to flow through said heat exchanger in contact with said flat surface; and mounting means for removably mounting said heat exchanger to said heat conductive means with said flat surface of said heat exchanger being in close proximity to said second surface of said heat conductive means.
Claim 3
Dependent Claim
64 words
A cooling system as claimed in claim l, wherein said heat conductive means has a plurality of screw thread holes on said second surface thereof, and said heat exchanger has a plurality of throughbores in positions corresponding to said screw thread holes, wherein said mounting means comprises a plurality of screws extending through said throughbores and being threadably engaged with said screw thread holes.
Claim 4
Dependent Claim
76 words
A cooling system as claimed in claim 2, wherein said heat conductive means is formed with a plurality of first parallel slits on said first surface thereof and a plurality of second parallel slits on said second surface thereof, said second parallel slits being staggered relative to said first parallel slits so that said heat conductive means can be divided into a plurality of segments when said heat conductive means is subject to a bending force.
Claim 5
Dependent Claim
114 words
A cooling system as claimed in claim 2, wherein said heat conductive means comprises a plurality of heat conductive elements each having a first end face and a second end face opposite to the first end face, the first end faces of said heat conductive elements being cemented to said second surface of said substrate with said layer of thermally conductive bonding material and the second end faces of said heat conductive elements lying on a common flat plane which corresponds to said second, flat surface of said heat conductive means, each of said heat conductive elements having a screw thread hole on said second end face thereof for threadably engaging with said screws.
Claim 6
Dependent Claim
23 words
A cooling system as claimed in claim 4, wherein said heat conductive elements are provided in one-to-one correspondence to said integrated circuit chips.
Claim 7
Dependent Claim
19 words
A cooling system as claimed in claim 4, wherein said heat conductive elements are arranged in a matrix array.
Claim 8
Dependent Claim
14 words
A cooling system as claimed in claim l, wherein said liquid coolant is water.
Claim 9
Dependent Claim
163 words
A cooling system for an electronic system comprising a panel; a connector mounted on said panel; a micropackage including a substrate having a first surface and a second surface opposite to the first surface, and a plurality of integrated circuit chips mounted on said first surface of the substrate, said micropackage being removably mounted on said connector; a heat conductive means having a first surface and a second, flat surface opposite to said first surface; a layer of thermally conductive bonding material between said second surface of said substrate and said first surface of said heat conductive means; a heat exchanger having a flat surface and provided with inlet and outlet means to permit a liquid coolant to flow through said heat exchanger in contact with said flat surface; and means for removably fastening said heat exchanger to said heat conductive means with said flat surface of said heat exchanger being in close proximity to said second surface of said heat conductive means.
Claim 10
Dependent Claim
163 words
A cooling system for an electronic system comprising a panel; a connector mounted on said panel; a micropackage including a substrate having a first surface and a second surface opposite to the first surface, and a plurality of integrated circuit chips mounted on said first surface of the substrate, said micropackage being removably mounted on said connector; a heat conductive means having a first surface and a second, flat surface opposite to said first surface; a layer of thermally conductive bonding material between said second surface of said substrate and said first surface of said heat conductive means; a heat exchanger having a flat surface and provided with inlet and outlet means to permit a liquid coolant to flow through said heat exchanger in contact with said flat surface; and means for removably fastening said heat exchanger to said heat conductive means with said flat surface of said heat exchanger being in close proximity to said second surface of said heat conductive means.
Claim 11
Dependent Claim
64 words
A cooling system as claimed in claim l, wherein said heat conductive means has a plurality of screw thread holes on said second surface thereof, and said heat exchanger has a plurality of throughbores in positions corresponding to said screw thread holes, wherein said fastening means comprises a plurality of screws extending through said throughbores and being threadably engaged with said screw thread holes.
Claim 12
Dependent Claim
49 words
l0. A cooling system as claimed in claim 9, wherein said heat conductive means comprises a plurality of heat conductive elements corresponding to said integrated circuit chips, each of said heat conductive elements being provided with a screw thread hole for engaging with a corresponding one of said screws.
References Cited (Backward Citations)
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