US4500945A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Directly sealed multi-chip module
Assignee: International Business Machines Corp
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Filing: 1982-07-23
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Granted: 1985-02-19
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Expires: 2002-07-23
Abstract
Abstract A hermetic compression sealing system with a semi-conductor, multi-chip thermal conduction module, involving a ceramic substance which includes interconnected semi-conductor chips containing integrated circuits defining the module; an arrangement is provided for directly sealing the module involving a compression seal which is in direct bearing contact with the substrate, a cover in direct bearing contact with the compression seal, and a clamping plate for holding the cover, compression seal and ceramic substrate in sealing arrangement, thereby forming a sealed chamber surrounding the module; a gas charge, such as of helium or the like, within the chamber enables conducting heat from the semi-conductor chips of the ambient.
Inventors
- 👤 Lewis D. Lipschutz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 05:39
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/0091; H05K5/0095; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W40/70; H10W40/77; H10W40/774; H10W40/20; H10W40/231; H10W40/233; H10W40/242
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
175 words
A hermetic compression sealing system with a semiconductor, multi-chip, thermal conduction module comprising: (a) a ceramic substrate having a main portion of predetermined thickness and a marginal portion which has a thickness less than said predetermined thickness and including interconnected semiconductor chips containing integrated circuits defining said module; (b) means for directly sealing said module, said means including: 1. a unitary metallic compression seal in direct bearing contact with the marginal portion of the upper surface of said substrate for providing hermetic sealing of a gas charge; 2. a cover in contact with said compression seal; 3. a clamping plate holding the cover, compression seal and the ceramic substrate in sealing engagement, thereby forming a unitary sealed chamber surrounding said module; said clamping plate having a flange in overlapping relationship with the marginal portion of the lower surface of said substrate; (c) means for conducting heat from the semiconductor chips to the ambient, including a gas charge within said chamber, the means for directly sealing said module preventing leakage of the gas to the ambient.
Claim 2
Dependent Claim
175 words
A hermetic compression sealing system with a semiconductor, multi-chip, thermal conduction module comprising: (a) a ceramic substrate having a main portion of predetermined thickness and a marginal portion which has a thickness less than said predetermined thickness and including interconnected semiconductor chips containing integrated circuits defining said module; (b) means for directly sealing said module, said means including: 1. a unitary metallic compression seal in direct bearing contact with the marginal portion of the upper surface of said substrate for providing hermetic sealing of a gas charge; 2. a cover in contact with said compression seal; 3. a clamping plate holding the cover, compression seal and the ceramic substrate in sealing engagement, thereby forming a unitary sealed chamber surrounding said module; said clamping plate having a flange in overlapping relationship with the marginal portion of the lower surface of said substrate; (c) means for conducting heat from the semiconductor chips to the ambient, including a gas charge within said chamber, the means for directly sealing said module preventing leakage of the gas to the ambient.
Claim 3
Dependent Claim
23 words
A system as defined in claim 1, in which said compression seal is in the form of a C-ring constituted of lead-plated steel.
Claim 4
Dependent Claim
19 words
A system as defined in claim 1, in which a sealing glass film is present at the marginal portion.
Claim 5
Dependent Claim
25 words
A system as defined in claim 3, in which a lead cushion is present between the bottom surface of said substrate and the clamping plate.
Claim 6
Dependent Claim
28 words
A system as defined in claim 1, in which said substrate main portion has a total area of 116 mm. 2 , and a thickness of 5.5 mm.
Claim 7
Dependent Claim
21 words
A system as defined in claim 1, in which a cold plate abuts the cover for conducting heat from said module.
Claim 8
Dependent Claim
27 words
A system as defined in claim 1, in which said means for conducting heat from said module includes pistons which are spring-biased to contact said individual chips.
Claim 9
Dependent Claim
27 words
A system as defined in claim 1, in which helium at approximately 1.6 atmospheres is the gas for aiding in the conduction of heat from said module.
Claim 10
Dependent Claim
28 words
A system as defined in claim 1 in which said clamping plate has a ring shape so as to clamp or hold said substrate only at its periphery.
References Cited (Backward Citations)
US4381032A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-02-19 | 1988-08-20 | 1989-02-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-02-19 | 1992-08-20 | 1993-02-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-02-19 | 1996-08-20 | 1997-02-19 | $7700.00 | Window Closed / Lapsed |