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Patent EP0198928A1 successfully refreshed from Google Patents.
EP0198928A1
Expired / Lapsed
EP
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Fabrication of a printed circuit board with metal-filled channels
Assignee: EIDP Inc
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Filing: 1985-03-26
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Granted: —
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Expires: 2005-03-26
Abstract
Abstract A plastic substrate (20) is injection molded to provide a pattern of channels (22). The substrate is metallized through one or more steps of flame spraying, electroless plating, electroplating, gas plating or vacuum deposition. The resulting metallization is abraded down to the non-channel surfaces, leaving a conductive pattern of metal-filled channels. In another form of the invention, the non-channel surfaces of the substrate are first coated with a suitable resist. The portions of the substrate may then be chemically removed.
Inventors
- 👤 Vito D. Elarde
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 18:25
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/045; H05K3/10; H05K3/107; H05K3/108; H05K3/14; H05K3/18; H05K3/181; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0376; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09118; H05K2203/00; H05K2203/02; H05K2203/025; H05K2203/13; H05K2203/1333; H05K2203/1344; H05K3/06; H05K3/061; H05K3/062; H05K3/38; H05K3/388; H05K3/40; H05K3/42; H05K3/425; H05K3/427; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/4916
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
54 words
A process of fabricating a circuit board, comprising the steps of: injection molding a plastic substrate having a pattern of channels; and depositing a metal in the channels according to a method selected from the group consisting of flame spraying, electroless plating, electroplating, gas plating and vacuum deposition to thereby delineate a conductive circuit.
Claim 2
Dependent Claim
54 words
A process of fabricating a circuit board, comprising the steps of: injection molding a plastic substrate having a pattern of channels; and depositing a metal in the channels according to a method selected from the group consisting of flame spraying, electroless plating, electroplating, gas plating and vacuum deposition to thereby delineate a conductive circuit.
Claim 3
Dependent Claim
31 words
A process according to Claim 1 wherein the plastic is selected from the group consisting of polyimides, modified polyimides, polyether sulfone, polyphenylene sulfied resins, PET type polyester, polyetherimide, modified polysulfone'and NYLON.
Claim 4
Dependent Claim
91 words
A process according to Claim 1 wherein a first metal layer is electroless plated over the channels and over a plurality of non-channel surfaces of the substrate between the channels, a layer of a resist is thereafter applied over the portions of the first metal layer which overlie the non-channel surfaces, a second metal layer is thereafter electroplated over the portions of the first metal layer which overlie the channels, and the layer of the resist and the portions of the first metal layer which overlie the non-channel surfaces are removed.
Claim 5
Dependent Claim
28 words
A process according to Claim 3 wherein the layer of the resist and the portions of the first metal layer which overlie the non-chemical surfaces are chemically removed.
Claim 6
Dependent Claim
29 words
A process according to Claim 3 wherein the layer of the resist and the portions of the first metal layer which overlie the non-channel surfaces are removed by abrading.
Claim 7
Dependent Claim
41 words
A process according to Claim 1 wherein the substrate is roughened prior to depositing the metal in the channels, the roughening being performed according to a method selected from the group consisting of sandblasting, plasma blasting, plasma etching and chemical etching.
Claim 8
Dependent Claim
37 words
A process according to Claim 1 wherein a layer of a resist is applied to a plurality of non-channel surfaces of the substrate between the channels so that the metal thereafter deposited is confined to the channels.
Claim 9
Dependent Claim
24 words
A process according to Claim 1 wherein the substrate is first treated with an activator before having the metal deposited thereon by electroless plating.
Claim 10
Dependent Claim
37 words
A process according to Claim 1 wherein a first bond enhancing metal layer is deposited in the channels by flame spraying or electroless plating, and a second metal layer is deposited on the first layer by electroplating.
Claim 11
Dependent Claim
66 words
A process according to Claim 1 wherein a first metal layer is deposited in the channels and over a plurality of non-channel surfaces of the substrate by electroless plating, the portions of the first metal layer above the non-channel surfaces are removed by abrading, and a second metal layer is deposited by electroless plating over the remaining portions of the first metal layer in the channels.
Claim 12
Dependent Claim
54 words
A process according to Claim 1 wherein the surfaces of the channels and the non-channel surfaces of the substrate therebetween are first roughened and then treated with an electroless plating sensitizer, a layer of resist is applied over the treated non-channel surfaces, and the metal is electroless plated over the surfaces of the channels.
Claim 13
Dependent Claim
51 words
A process according to Claim 1 wherein the surfaces of the channels and the non-channel surfaces of the substrate therebetween are first roughened and then treated with an electroless plating sensitizer, the portions of the sensitizer above the non-channel surfaces are removed, and the metal is electroless plated in the channels.
Claim 14
Dependent Claim
70 words
A process according to Claim 1 wherein the surfaces of the channels and the non-channel surfaces of the substrate therebetween are roughened, a layer of a resist is applied over the non-channel surfaces, a layer of a bond enhancing metal is flame sprayed over the channel surfaces, a layer of a second metal is electroless plated over the bond enhancing metal layer in the channels, and the resist is stripped.
Claim 15
Dependent Claim
74 words
A process according to Claim 1 wherein the surfaces of the channels and the non-channel surfaces of the substrate therebetween are roughened, a layer of a bond enhancing metal is flame sprayed over the channel surfaces and the non-channel surfaces, the portions of the bond enhancing layer of metal which overlie the non-channel surfaces are removed, and a layer of a second metal is electroless plated over the bond enhancing metal in the channels.
Claim 16
Dependent Claim
65 words
A process according to Claim 1 wherein the surfaces of the channels and the non-channel surfaces of the substrate therebetween are roughened, a layer'of a resist is applied over the non-channel surfaces, a layer of a bond enhancing metal is flame sprayed over the channel surfaces, and a layer of a second metal is electroless plated over the bond enhancing metal layer in the channels.
Claim 17
Dependent Claim
9 words
The product made by the process of Claim 1.
Claim 18
Dependent Claim
9 words
The product made by the process of Claim 3.
Claim 19
Dependent Claim
9 words
The product made by the process of Claim 10.
Claim 20
Dependent Claim
9 words
The product made by the process of Claim 14.
Claim 21
Dependent Claim
9 words
The product made by the process of Claim 15.
Claim 22
Dependent Claim
78 words
A process according to Claim 1 wherein the surfaces c5 the channels and the non-channel surfaces of the substrate t1 rebetween are roughened and treated with a catalyst, a layer o a resist is applied over the non-channel surfaces, a layer o bond enhancing metal is flame sprayed over the channel suaiaces, a layer of a second metal is electroless plated over the bond enhancing metal layer in the channels, and the layer oi " esist is removed.
Claim 23
Dependent Claim
82 words
A process according to Claim 1 wherein the surfaces of the channels and the non-channel surfaces of the substrate therebetween are roughened and treated with a catalyst, a layer of a bond enhancing metal is flame sprayed over the channel surfaces and the non-channel surfaces, the portions of the bond enhancing metal layer over the non-channel surfaces are removed and a layer of a second metal is electroless plated over the portions of the bond enhancing metal layer remaining in the channels.
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