Patent US3256959A successfully refreshed from Google Patents.
Patent EP0137385A1 successfully refreshed from Google Patents.
EP0137385A1
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EP
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Integrated circuit package (1111111)
Assignee: Hitachi Ltd
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Filing: 1984-09-21
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Granted: —
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Expires: 2004-09-21
Abstract
Abstract An integrated circuit package produced by bonding a rear surface of an insulating substrate (4) enclosed in the package to a heat sink such as a cooling fin (9) by a resinous adhesive, which may include one or more fillers, having a Young's modulus of 500 kg/cm 2 or less when formed into a film (10), has high reliability at the bonding portion and withstands without damages even if subjected to thermal shocks.
Inventors
- 👤 Satoru Ogihara
- 👤 Hironori Kodama
- 👤 Nobuyuki Ushifusa
- 👤 Kanji Otsuka
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 14:11
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W40/00; H10W40/20; H10W40/22; H10W40/25; H10W40/251; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/737; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
129 words
In an integrated circuit package comprising an insulating substrate (4), a cap (5) and a sealing glass (6) sealing the cap (5) with the insulating substrate (4) to form a hermetic casing which encloses at least one semiconductor element (1) mounted on a front surface of the insulating substrate (4), lead members (3) introduced from the outside of the casing and wires (2) electrically connecting the semiconductor element (1) with end portions of the lead members (3), and a heat sink bonded to a rear surface of the insulating substrate (4), the improvement wherein the heat sink is bonded to the rear surface of the insulating substrate (4) by using a resinous adhesive having a Young's modulus of 500 kg/cm 2 or less when formed into a film (10).
Claim 2
Dependent Claim
129 words
In an integrated circuit package comprising an insulating substrate (4), a cap (5) and a sealing glass (6) sealing the cap (5) with the insulating substrate (4) to form a hermetic casing which encloses at least one semiconductor element (1) mounted on a front surface of the insulating substrate (4), lead members (3) introduced from the outside of the casing and wires (2) electrically connecting the semiconductor element (1) with end portions of the lead members (3), and a heat sink bonded to a rear surface of the insulating substrate (4), the improvement wherein the heat sink is bonded to the rear surface of the insulating substrate (4) by using a resinous adhesive having a Young's modulus of 500 kg/cm 2 or less when formed into a film (10).
Claim 3
Dependent Claim
20 words
An integrated circuit package according to Claim 1, wherein the insulating substrate (4) is made of a silicon carbide ceramic.
Claim 4
Dependent Claim
64 words
An integrated circuit package according to Claim 2, wherein the silicon carbide ceramic is a sintered body containing 0.05 to 5% by weight of at least one member selected from the group consisting of beryllium and beryllium compounds in terms of the weight of beryllium and the balance being substantially silicon carbide and having a density of 90% or more of the theoretical density.
Claim 5
Dependent Claim
16 words
An integrated circuit package according to Claim 1, wherein the heat sink has a fin structure(9),
Claim 6
Dependent Claim
16 words
An integrated circuit package according to Claim 1, wherein the resinous adhesive is a silicone resin.
Claim 7
Dependent Claim
23 words
An integrated circuit package according to Claim 1, wherein the resinous adhesive comprises a silicone resin and one or more thermal conductive fillers.
Claim 8
Dependent Claim
29 words
An integrated circuit package according to Claim 5, wherein the silicon resin is a dimethyl silicone resin, a methylvinyl silicone resin, a methylphenyl silicone resin, or a mixture thereof.
Claim 9
Dependent Claim
23 words
An integrated circuit package according to Claim 6, wherein the filler is alumina, beryllia, silicon carbide, silica, boron nitride, or a mixture thereof.
References Cited (Backward Citations)
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