Textured metallic compression bonding

Claim 2

In combination (a) a semiconductor integrated circuit chip having an integrated circuit connected to a plurality of metallic chip pads located on a major surface of the chip; (b) a carrier upon which are located metallic wiring interconnections having metallic carrier pads that are .Iadd.compression .Iaddend.bonded to the chip pads, each of .Iadd.either .Iaddend.the carrier pads.[.,.]. .Iadd.or the .Iaddend.chip pads, .[.or.]. .Iadd.but not .Iaddend.both.Iadd., .Iaddend.having at least a portion thereof that is textured .Iadd.prior to bonding .Iaddend.with indentations whose depths are.[., or protrusions whose heights are,.]. of the order of one micrometer.

Claim 3

The combination described in claim 1 in which each chip pad has a portion that is separated from the major surface of the chip by a portion of a localized layer of an insulating material, and in which each carder pad has a portion, underlying a complementary portion of the layer of insulating material, that is indented in the vertical direction and is smooth, the insulating material having relatively little or no adhesive tendency with respect to the chip pad.

Claim 4

The combination of claim 2 in which the carrier comprises a silicon wafer and in which the pads are bonded such that a tensile force of about 1 kg per mm 2 or more of pad area is required to pull them apart.

Claim 5

The combination of claim 3 in which the silicon wafer has a plurality of V-grooves at each of such portions thereof underlying the carrier pads.

Claim 6

The combination of claim 2 in which surfaces of the chip pads are essentially gold.

Claim 7

The combination of claim 5 in which surfaces of the carrier pads are essentially gold and in which the chip pads are nondestructively detachable from the carrier pads by means of a mechanical pulling apart.

Claim 8

The combination of claim 1 in which the chip carrier comprises a silicon wafer which is textured at the portions thereof .[.underlying.]. .Iadd.bonded to .Iaddend.the carrier pads.

Claim 9

The combination of claim 7 in which the silicon wafer has a plurality of V-grooves at each of such portions thereof .[.underlying.]. .Iadd.bonded to .Iaddend.the carrier pads.

Claim 10

The combination of claim 1 in which areas of the carrier pads to be bonded to chip pads are essentially gold and in which the chip pads are nondestructively detachable from the carrier pads by means of a mechanical pulling apart.

Claim 11

The combination of claim .[.10.]. .Iadd.9 .Iaddend.in which the surfaces of the chip pads are essentially .[.gold.]. .Iadd.gold.Iaddend..

Claim 12

The combination of claim 1 in which surfaces of the chip pads are essentially gold.

Claim 13

The combination of claim 1 in which the indentations .[.or protrusions.]. have widths, as measured at the tops .[.of the protrusions.]. or bottoms of the indentations, of about 1 micrometer or less. .Iadd.13. In combination: a first body having a first metallic layer located contiguous with a first surface of the first body; and a second body having a second metallic layer being compression bonded to the second metallic layer, either the first metallic layer or the second metallic layer, but not both the first and second metallic layers, having at least a portion thereof that is textured prior to bonding with indentations whose depths are of the order of one micrometer or less. .Iaddend. .Iadd.14. The combination of claim 13 in which the second body comprises a wafer and in which the first and second metallic layers are bonded such that a tensile force of about 1 kg per mm 2 or more of metallic area is required to pull them apart. .Iaddend. .Iadd.15. The combination of claim 13 in which a surface of the first metallic layer is essentially gold. .Iaddend. .Iadd.16. The combination of claim 15 in which a surface of the second metallic layer is essentially gold and in which the first metallic layer is nondestructively detachable from the second metallic layer by means of a mechanical pulling apart. .Iaddend. .Iadd.17. The combination of claim 13 in which the second body comprises a wafer which is textured at the portion thereof bonded to the second metallic layer. .Iaddend. .Iadd.18. The combination of 17 in which the wafer has a plurality of V-grooves at the portion thereof bonded to the second metallic layer. .Iaddend. .Iadd.19. The combination of claim 13 in which areas of the second metallic layer that are bonded to the first metallic layer are essentially gold, and in which the first metallic layer is nondestructively detachable from the second metallic layer by means of a

Claim 14

mechanical pulling apart. .Iaddend. .Iadd.20. The combination of claim 19 in which the surface of the first metallic layer is essentially gold. .Iaddend. .Iadd.21. The combination of claim 13 in which a surface of the

Claim 15

first metallic layer is essentially gold. .Iaddend. .Iadd.22. The combination of claim 13 in which the indentations have widths, as measured at the tops or at the bottoms of the indentations, of about 1 micrometer or less. .Iaddend.