Solder stripping solution

Claim 2

Solution for the removal of tin or tin-lead alloy solder from a copper or nickel base, said solution comprising: (a) 20-150 g/l of a m-nitro substituted aromatic compound; .[.(b) 0.5-10 g/l of a thiourea selected from a group of thiourea per se, an alkyl thiourea or an aromatic thiourea;.]. .[.(c).]. .Iadd.b. .Iaddend.0.1-50 percent by volume of an inorganic acid selected from a group including fluoboric acid, fluosilicic acid, sulfamic acid, or nitric acid; and, .[.(d).]. .Iadd.c. 0.1-50.0 g/l of a hydroxyphenol providing extended life to the stripping solution.

Claim 3

Solution of claim 1 where the inorganic acid is nitric acid.

Claim 4

Solution of claim 1 which also contains an ammonium ion of the formulation NH 4 X in the range of 0.1-300 g/l, X being an ion consisting of either nitrate, fluoborate, acetate, halogen, or hydroxide.

Claim 5

Solution of claim 1 which also contains a fluoborate ion of the formulation RBF 4 in the range of 0.1-750 g/l, R being a cation consisting of either a hydrogen, ammonium, sodium or potassium ion.

Claim 6

Non-peroxide solder stripper solution comprising: (a) nitro-substituted aromatic compound of 20-150 g/l; (b) fluoborate compound of 0.1-750 g/l; (c) hydroxyphenol of 0.1-50 g/l; (d) ammonium compound of 0.1-300 g/l; (e) inorganic acid of 0.1-400 g/l; (f) thiourea of 0.1-30 g/l; (g) boric acid of 2-60 g/l; and (h) water to one liter.

Claim 7

Non-peroxide solder stripper solution comprising: (a) nitro-substituted aromatic compound of 20-150 g/l; (b) fluoborate compound of 0.1-750 g/l; (c) hydroxyphenol of 0.1-50 g/l; (d) ammonium compound of 0.1-300 g/l; (e) inorganic acid of 0.1-400 g/l; (f) thiourea of 0.1-30 g/l; (g) boric acid of 2-60 g/l; and (h) water to one liter.

Claim 8

Solution of claim 5 wherein said nitro-substituted aromatic compound is selected from o, m, or p-nitrochlorobenzenes, o, m, or p-nitrobenzenes, sulfonic acids, and o, m, or p-nitrobenzonic acids.

Claim 9

Solution of claim 6 comprising sodium meta-nitrobenzenesulfonate.

Claim 10

Solution of claim 5 wherein said ammonium compound is selected from ammonium nitrate, ammonium halides, ammonium acetate, or ammonium hydroxide in combination with sodium fluoborate, potassium fluoborate, or fluoboric acid.

Claim 11

Solution of claim 8 comprising ammonium fluoborate.

Claim 12

Solution of claim 5 wherein said inorganic acid is selected from fluoboric, fluosilic, sulfamic, or nitric acid.

Claim 13

Solution of claim 10 comprising nitric acid.

Claim 14

Solution of claim 5 wherein said hydroxyphenol comprises 3-hydroxyphenol.

Claim 15

Solution of claim 5 wherein said thiourea is selected from alkyl and aromatic thiourea.

Claim 16

Non-peroxide solder stripping solution comprising: (a) sodium m-nitrobenzenesulfonate of 80 g/l; (b) fluoboric acid of 276 g/l; (c) boric acid of 8 g/l; (d) 3-hydroxyphenol of 8 g/l; (e) ammonium nitrate of 36 g/l; (f) nitric acid of 90 ml/l; (g) thiourea of 14 g/l; .Iadd.and, .Iaddend. (h) to one liter of water.

Claim 17

Non-peroxide solder stripping solution comprising: (a) sodium m-nitrobenzenesulfonate of 80 g/l; (b) fluoboric acid of 276 g/l; (c) boric acid of 8 g/l; (d) 3-hydroxyphenol of 8 g/l; (e) ammonium nitrate of 36 g/l; (f) nitric acid of 90 ml/l; (g) thiourea of 14 g/l; .Iadd.and, .Iaddend. (h) to one liter of water.

Claim 18

Solution of claim 14 for stripping solder or tin in an SMOBC process.

Claim 19

Solution of claim 14 for stripping solder or tin from printed circuit boards in a nickel-gold process. .Iadd.

Claim 20

Solution of claim 1 comprising 0.5-10 g/l of a thiourea selected from a group of thiourea per se, an alkyl thiourea or an aromatic thiourea. .Iaddend. .Iadd.18. Solution for the removal of tin or tin-lead alloy solder from a copper or nickel base, said solution comprising: a. 20-150 g/l of a m-nitro substituted aromatic compound; b. 0.5-10 g/l of a thiourea selected from a group of thiourea per se, an alkyl thiourea or an aromatic thiourea; and, c. 0.1-50 percent by volume of nitric acid. .Iaddend. .Iadd.19. Solution of claim 18 including 0.1-50 g/l of a hydrophenol providing extended life to the stripping solution. .Iaddend. .Iadd.20. Non-peroxide solder stripper solution comprising: a. nitro-substitute aromatic compound of 20-150 g/l; b. fluoborate compound of 0.1-750 g/l; c. nitric acid of 0.1-400 g/l; d. boric acid of 2-60 g/l; and, e. water to one liter. .Iaddend. .Iadd.21. Solution of claim 20 including hydroxyphenol of 0.1-50 g/l. .Iaddend. .Iadd.22. Solution of claim 20 wherein said nitro-substituted aromatic compound is selected from o, m, or p-nitrochlorobenzenes, o, m, or p-nitrobenzenes, sulfonic acids, and o, m

Claim 21

or p-nitrobenzonic acids. .Iaddend. .Iadd.23. Solution of claim 22 comprising sodium metanitrobenzenesulfonate. .Iaddend. .Iadd.24. Solution of claim 21 wherein said hydroxyphenol comprises 3-hydroxyphenol. .Iaddend. .Iadd.25. Non-peroxide solder stripping solution comprising: a. sodium m-nitrobenzenesulfonate of 80 g/l; b. fluoboric acid of 276 g/l; c. boric acid of 8 g/l; d. 3-hydroxyphenol of 8 g/l; e. nitric acid of 90 ml/l; and, f. to one liter of water. .Iaddend. .Iadd.26. Solution of claim 25 for stripping solder tin in an SMOBC process. .Iaddend. .Iadd.27. Solution of claim 25 for stripping solder or tin from printed circuit boards in a nickel-gold process. .Iaddend. .Iadd.28. Non-peroxide solder stripping solution comprising: a. sodium m-nitrobenzenesulfonate of 80 g/l; b. fluoboric acid of 276 g/l; c. 3-hydroxyphenol of 89/l; and, d. to one liter of water. .Iaddend. .Iadd.29. Solution of claim 28 further

Claim 22

comprising 90 ml/l of nitric acid. .Iaddend. .Iadd.30. Non-peroxide solder stripping solution comprising: a. sodium m-nitrobenzenesulfonate of 80 g/l; b. fluoboric acid of 276 g/l; c. thiourea of 14 g/l; d. 3-hydroxyphenol of 89/l; and, e. to one liter of water. .Iaddend. .Iadd.31. Non-peroxide solder stripping solution comprising: a. sodium m-nitrobenzenesulfonate of 80 g/l; b. nitric acid of 90 ml/l; c. 3-hydroxyphenol of 89/l; and, d. to one liter of water. .Iaddend.

Claim 23

comprising 90 ml/l of nitric acid. .Iaddend. .Iadd.30. Non-peroxide solder stripping solution comprising: a. sodium m-nitrobenzenesulfonate of 80 g/l; b. fluoboric acid of 276 g/l; c. thiourea of 14 g/l; d. 3-hydroxyphenol of 89/l; and, e. to one liter of water. .Iaddend. .Iadd.31. Non-peroxide solder stripping solution comprising: a. sodium m-nitrobenzenesulfonate of 80 g/l; b. nitric acid of 90 ml/l; c. 3-hydroxyphenol of 89/l; and, d. to one liter of water. .Iaddend.