Cross-linked resins

Claim 2

A cross-linked resin obtained by heating at 100° C. to 350° C. an unsaturated bis-imide selected from the group consisting of maleic N,N'-ethylene-bis-imide, maleic N,N'-hexamethylene-bis-imide, maleic N,N'-metaphenylene-bis-imide, maleic N,N'-paraphenylene-bis-imide, maleic N,N'-4,4'-diphenylmethane-bis-imide, maleic N,N'-4,4'-diphenylether-bis-imide, maleic N,N'-4,4'-diphenylsulphone-bis-imide, maleic N,N'-4,4'-dicyclohexylmethane-bis-imide, maleic N,N' -α,α'-4,4'-dimethylenecyclohexane-bis-imide, maleic N,N'-metaxylylene-bis-imide and maleic N,N'-4,4'-diphenylcyclohexane-bis-imide with a diamine selected from the group consisting of 4,4'-diaminodicyclohexylmethane, 1,4-diaminocyclohexane, 2,6-diaminopyridine, metaphenylenediamine, paraphenylenediamine, 4,4'-diaminadiphenylmethane, 2,2-bis-(4-aminophenyl)-propane, benzidine, 4,4'-diaminophenyl oxide, 4,4'-diaminodiphenyl sulphide, 4,4'-diaminodiphenyl-sulphone, bis-(4-aminophenyl)diphenylsilane, bis-(4-aminophenyl)methylphosphine oxide, bis-(3-aminophenyl)methylphosphine oxide, bis-(4-aminophenyl)phenylphosphine oxide, bis-(4-aminophenyl)phenylamine, 1,5-diamino-naphthalene, metaxylylenediamine, paraxylene diamine, 1,1-bis(paraaminophenyl)phthalene, 1,1-bis(4-aminophenyl)cyclohexane, 1,1-bis(4-amino-3-methylphenyl)cyclohexane and hexamethylenediamine at a ratio of bis-imide to diamine of from 1.2:1 to 50:1.

Claim 3

The cross-linked resin of claim 1 wherein said unsaturated bis-imide is maleic N,N'-4,4'-diphenylmethane-bis-imide and said diamine is bis-(4-aminophenyl)methane.

Claim 4

The cross-linked resin of claim 1 wherein the ratio of bis-imide to diamine is from 1.3:1 to 5:1.

Claim 5

The cross-linked resin of claim 2 wherein the ratio of bis-imide to diamine is from 1.3:1 to 5:1.

Claim 6

The cross-linked resin of claim 2 wherein the ratio of bis-imide to diamine is from about 2.3 to about 3.6. .Iadd. 6. A resinous polymer soluble in inert polar organic solvent and containing amine and imide groups formed by reacting a bis-maleimide with a diprimary amine in a molar ratio of from 1.2:1 to 50:1 at a temperature of from about 100° C. to about 250° C. .Iaddend. .Iadd. 7. The resinous polymer of claim 6 wherein the bis-malemide is maleic N,N'-4,4'-diphenylmethane-bis-imide and said diprimary amine is bis-(4-aminophenyl)methane. .Iaddend..Iadd. 8. The resinous polymer of claim 6 wherein the ratio of bis-imide to diamine is from 1.3:1 to 5:1. .Iaddend..Iadd. 9. A lacquer comprising the resinous polymer of claim 6 in solution in an inert polar organic solvent. .Iaddend..Iadd. 10. The lacquer of claim 9 in which said solvent is selected from the group of dimethyl formamide, dimethyl-acetamide and N-methyl pyrrolidone. .Iaddend..Iadd. 11. A method for curing the resinous polymer of claim 6 wherein the said polymer is heated up to a temperature of about 350° C. .Iaddend. .Iadd. 12. A resinous polymer soluble in inert polar organic solvent and containing amine and imide groups formed by reacting a bis-maleimide with a diprimary amine in a molar ratio between 1.2 to 1 and 50:1, said reaction being carried out in solution in an inert polar organic solvent at a temperature of 100° to 250° C. .Iaddend..Iadd. 13. A polymer as recited in claim 12 in which the ratio of said bis-maleimide to said diprimary amine is from 1.3:1 to 5:1. .Iaddend..Iadd. 14. A polymer as recited in claim 12 in which said maleimide is based on maleic anhydride. .Iaddend..Iadd. 15. A polymer as recited in claim 12 in which said diprimary amine is aromatic. .Iaddend..Iadd. 16. A polymer as recited in claim 12 in which the temperature of reaction is 150° C. .Iaddend. .Iadd. 17. A lacquer comprising the polymer of claim 12 in solution in an inert polar organic solvent. .Iaddend. .Iadd. 18. A method of forming a resinous polymer soluble in an inert polar organic solvent and containing amine and imide groups comprising reacting a bis-maleimide with a diprimary amine in a molar ratio of from 1.2:1 to 50:1 in an inert polar organic solvent medium at a temperature of 100° to 250° C. .Iaddend..Iadd. 19. A lacquer comprising a resinous polymer soluble in inert polar organic solvent and containing amine and imide groups formed by reacting a bis-maleimide with a diprimary amine in a molar ratio between 1.2:1 and 50:1, said reaction being carried out in solution in inert polar organic solvent at a temperature of 100° to 250° C., said resinous polymer being in solution in an inert polar organic solvent selected from the group of dimethyl formamide, dimethylacetamide and N-methyl pyrrolidone. .Iaddend. .Iadd. 20. A resinous moulded polymer soluble in polar organic solvent and containing amine and imide groups formed by reacting a bis-maleimide with a diprimary amine in a molar ratio of from 1.2:1 to 50:1 at a temperature of from about 100° C. to about 250° C. .Iaddend. .Iadd. 21. The product of the process as defined by claim 11. .Iaddend.