Method of making additive printed circuit boards and product thereof

Abstract

Abstract A METHOD IS DISCLOSED FOR FORMING PRINTED CIRCUIT BOARDS USING THE ADDITIVE PROCESS. IMPROVEMENT OVER THE PRIOR ART IS OBTAINED IN RESPECT TO ADHESION OF THE CONDUCTOR METAL CIRCUIT TO A THERMOSET RESIN SUBSTRATE. IN THE PROCESS, A NICKEL OR COPPER CLAD THERMOSET RESIN SUBSTRATE IS STRIPPED OF ALL METAL, ACTIVATED (CATALYZED), A RESIST PATTERN APPLIED TO OBTAIN THE DESIRED CIRCUIT AND CONDUCTOR METAL DEPOSITED ON THE CIRCUIT AREA BY ELECTROLESS AND/OR ELECTRODEPOSITION TO A FINAL DESIRED THICKNESS. AT ONE OR MORE POINTS IN THE PROCESS THE BOARD IS HEATED OR BAKED. VARIOUS TYPES OF CIRCUIT BOARDS RESULTING FROM THE PROCESS ARE ALSO DISCLOSED.

Inventors

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