Patent US7629860B2 successfully refreshed from Google Patents.
← Back to Patent Explorer
US7629860B2 Active / In Force US ⏱️ 0.6 years remaining

Miniaturized wide-band baluns for RF applications

Assignee: JCET Semiconductor Shaoxing Co Ltd
•
Filing: 2007-06-08
•
Granted: 2009-12-08
•
Expires: 2027-06-08
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between secondhand third portions of the third coil.

Inventors

  • 👤 Kai Liu
  • 👤 Robert Charles Frye

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 05:29
CPC Classifications
H; H03; H03H; H03H7/00; H03H7/42; H01; H01F; H01F17/00; H01F17/0006; H01F17/0013; H03H7/01; H03H7/17; H03H7/1741; H03H7/1775; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/4902; Y10T29/49071

Claims Analysis

Total Claims: 35
Claim 1
Independent Claim 121 words
A wide-band balun device, comprising: a first tube, deposited over a substrate, and configured in a first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second tube, deposited over the substrate, and configured in a second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and a third tube, deposited over the substrate, and configured in a third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 2
Dependent Claim 121 words
A wide-band balun device, comprising: a first tube, deposited over a substrate, and configured in a first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second tube, deposited over the substrate, and configured in a second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and a third tube, deposited over the substrate, and configured in a third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 3
Dependent Claim 20 words
The balun device of claim 1 , wherein the substrate includes a silicon, glass, or ceramic substrate for structural support.
Claim 4
Dependent Claim 18 words
The balun device of claim 1 , wherein the first coil is oriented in an octagonal geometric shape.
Claim 5
Dependent Claim 18 words
The balun device of claim 1 , wherein the first tube has a rectangular cross-section or round cross-section.
Claim 6
Dependent Claim 27 words
The balun device of claim 1 , further including a first capacitor device, deposited over the substrate, and coupled between the unbalanced port and the first coil.
Claim 7
Dependent Claim 19 words
The balun device of claim 1 , wherein the second coil is coupled to ground at a center tap.
Claim 8
Dependent Claim 32 words
The balun device of claim 5 , further including second and third capacitor devices, deposited over the substrate, and connected between the first and second portions of the third coil and ground.
Claim 9
Dependent Claim 19 words
The balun device of claim 1 , wherein the first coil is copper (Cu) or a copper alloy material.
Claim 10
Dependent Claim 129 words
A balun device, comprising: a first coil deposited over a substrate, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second coil deposited over the substrate and magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; a third coil deposited over the substrate and magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil; and first and second capacitors, deposited over the substrate, and connected between the first and second portions of the third coil and ground.
Claim 11
Dependent Claim 129 words
A balun device, comprising: a first coil deposited over a substrate, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second coil deposited over the substrate and magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; a third coil deposited over the substrate and magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil; and first and second capacitors, deposited over the substrate, and connected between the first and second portions of the third coil and ground.
Claim 12
Dependent Claim 23 words
The balun device of claim 9 , further including a balanced port coupled to the first and second portions of the third coil.
Claim 13
Dependent Claim 30 words
The balun device of claim 9 , further including a third capacitor, deposited over the substrate, and coupled between a first end of the first coil and an unbalanced port.
Claim 14
Dependent Claim 28 words
The balun device of claim 11 , further including a fourth capacitor, deposited over the substrate, and coupled between an output terminal of the third capacitor and ground.
Claim 15
Dependent Claim 20 words
The balun device of claim 9 , wherein the substrate includes a silicon, glass, or ceramic substrate for structural support.
Claim 16
Dependent Claim 20 words
The balun device of claim 9 , wherein the first coil is configured over the substrate in two interconnected groups.
Claim 17
Dependent Claim 19 words
The balun device of claim 9 , wherein the second coil is coupled to ground at a center tap.
Claim 18
Dependent Claim 132 words
A balun for a semiconductor device, comprising: a first metallization, deposited over a substrate, and oriented in a first coil, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second metallization, deposited over the substrate, and oriented in a second coil, the second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and a third metallization, deposited over the substrate, and oriented in a third coil, the third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 19
Dependent Claim 132 words
A balun for a semiconductor device, comprising: a first metallization, deposited over a substrate, and oriented in a first coil, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second metallization, deposited over the substrate, and oriented in a second coil, the second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and a third metallization, deposited over the substrate, and oriented in a third coil, the third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 20
Dependent Claim 19 words
The balun of claim 16 , wherein the substrate includes a silicon, glass, or ceramic substrate for structural support.
Claim 21
Dependent Claim 17 words
The balun of claim 17 , wherein the coil structure comprises a portion of a semiconductor device.
Claim 22
Dependent Claim 16 words
The balun of claim 16 , wherein the first metallization has a rectangular or round cross-section.
Claim 23
Dependent Claim 30 words
The balun of claim 16 , further including first and second capacitors, deposited over the substrate, and connected between the second and third portions of the third coil and ground.
Claim 24
Dependent Claim 29 words
The balun of claim 20 , further including a third capacitor, deposited over the substrate, and coupled between a first end of the first coil and an unbalanced port.
Claim 25
Dependent Claim 27 words
The balun of claim 21 , further including a fourth capacitor, deposited over the substrate, and coupled between an output terminal of the third capacitor and ground.
Claim 26
Dependent Claim 19 words
The balun of claim 16 , wherein the first coil is configured over the substrate in two interconnected groups.
Claim 27
Independent Claim 135 words
A method of manufacturing a balun, comprising: providing a first metallization, deposited over a substrate, and oriented in a first coil, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; providing a second metallization, deposited over the substrate, and oriented in a second coil, the second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and providing a third metallization, deposited over the substrate, and oriented in a third coil, the third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 28
Independent Claim 135 words
A method of manufacturing a balun, comprising: providing a first metallization, deposited over a substrate, and oriented in a first coil, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; providing a second metallization, deposited over the substrate, and oriented in a second coil, the second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and providing a third metallization, deposited over the substrate, and oriented in a third coil, the third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 29
Dependent Claim 21 words
The method of manufacture of claim 24 , wherein the substrate includes a silicon, glass, or ceramic substrate for structural support.
Claim 30
Dependent Claim 19 words
The method of manufacture of claim 25 , wherein the coil structure comprises a portion of a semiconductor device.
Claim 31
Dependent Claim 18 words
The method of manufacture of claim 24 , wherein the first metallization has a rectangular or round cross-section.
Claim 32
Dependent Claim 32 words
The method of manufacture of claim 24 , further including first and second capacitors, deposited over the substrate, and connected between the second and third portions of the third coil and ground.
Claim 33
Dependent Claim 31 words
The method of manufacture of claim 28 , further including a third capacitor, deposited over the substrate, and coupled between a first end of the first coil and an unbalanced port.
Claim 34
Dependent Claim 29 words
The method of manufacture of claim 29 , further including a fourth capacitor, deposited over the substrate, and coupled between an output terminal of the third capacitor and ground.
Claim 35
Dependent Claim 21 words
The method of manufacture of claim 24 , wherein the first coil is configured over the substrate in two interconnected groups.

References Cited (Backward Citations)

US5697088A Cited
US7042303B2 Cited
US6515556B1 Cited
US6683510B1 Cited
US7397328B2 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2012-12-07 2013-06-08 2013-12-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2016-12-07 2017-06-08 2017-12-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2020-12-07 2021-06-08 2021-12-08 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag