Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
121 words
A wide-band balun device, comprising: a first tube, deposited over a substrate, and configured in a first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second tube, deposited over the substrate, and configured in a second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and a third tube, deposited over the substrate, and configured in a third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 2
Dependent Claim
121 words
A wide-band balun device, comprising: a first tube, deposited over a substrate, and configured in a first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second tube, deposited over the substrate, and configured in a second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and a third tube, deposited over the substrate, and configured in a third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 3
Dependent Claim
20 words
The balun device of claim 1 , wherein the substrate includes a silicon, glass, or ceramic substrate for structural support.
Claim 4
Dependent Claim
18 words
The balun device of claim 1 , wherein the first coil is oriented in an octagonal geometric shape.
Claim 5
Dependent Claim
18 words
The balun device of claim 1 , wherein the first tube has a rectangular cross-section or round cross-section.
Claim 6
Dependent Claim
27 words
The balun device of claim 1 , further including a first capacitor device, deposited over the substrate, and coupled between the unbalanced port and the first coil.
Claim 7
Dependent Claim
19 words
The balun device of claim 1 , wherein the second coil is coupled to ground at a center tap.
Claim 8
Dependent Claim
32 words
The balun device of claim 5 , further including second and third capacitor devices, deposited over the substrate, and connected between the first and second portions of the third coil and ground.
Claim 9
Dependent Claim
19 words
The balun device of claim 1 , wherein the first coil is copper (Cu) or a copper alloy material.
Claim 10
Dependent Claim
129 words
A balun device, comprising: a first coil deposited over a substrate, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second coil deposited over the substrate and magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; a third coil deposited over the substrate and magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil; and first and second capacitors, deposited over the substrate, and connected between the first and second portions of the third coil and ground.
Claim 11
Dependent Claim
129 words
A balun device, comprising: a first coil deposited over a substrate, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second coil deposited over the substrate and magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; a third coil deposited over the substrate and magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil; and first and second capacitors, deposited over the substrate, and connected between the first and second portions of the third coil and ground.
Claim 12
Dependent Claim
23 words
The balun device of claim 9 , further including a balanced port coupled to the first and second portions of the third coil.
Claim 13
Dependent Claim
30 words
The balun device of claim 9 , further including a third capacitor, deposited over the substrate, and coupled between a first end of the first coil and an unbalanced port.
Claim 14
Dependent Claim
28 words
The balun device of claim 11 , further including a fourth capacitor, deposited over the substrate, and coupled between an output terminal of the third capacitor and ground.
Claim 15
Dependent Claim
20 words
The balun device of claim 9 , wherein the substrate includes a silicon, glass, or ceramic substrate for structural support.
Claim 16
Dependent Claim
20 words
The balun device of claim 9 , wherein the first coil is configured over the substrate in two interconnected groups.
Claim 17
Dependent Claim
19 words
The balun device of claim 9 , wherein the second coil is coupled to ground at a center tap.
Claim 18
Dependent Claim
132 words
A balun for a semiconductor device, comprising: a first metallization, deposited over a substrate, and oriented in a first coil, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second metallization, deposited over the substrate, and oriented in a second coil, the second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and a third metallization, deposited over the substrate, and oriented in a third coil, the third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 19
Dependent Claim
132 words
A balun for a semiconductor device, comprising: a first metallization, deposited over a substrate, and oriented in a first coil, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; a second metallization, deposited over the substrate, and oriented in a second coil, the second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and a third metallization, deposited over the substrate, and oriented in a third coil, the third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 20
Dependent Claim
19 words
The balun of claim 16 , wherein the substrate includes a silicon, glass, or ceramic substrate for structural support.
Claim 21
Dependent Claim
17 words
The balun of claim 17 , wherein the coil structure comprises a portion of a semiconductor device.
Claim 22
Dependent Claim
16 words
The balun of claim 16 , wherein the first metallization has a rectangular or round cross-section.
Claim 23
Dependent Claim
30 words
The balun of claim 16 , further including first and second capacitors, deposited over the substrate, and connected between the second and third portions of the third coil and ground.
Claim 24
Dependent Claim
29 words
The balun of claim 20 , further including a third capacitor, deposited over the substrate, and coupled between a first end of the first coil and an unbalanced port.
Claim 25
Dependent Claim
27 words
The balun of claim 21 , further including a fourth capacitor, deposited over the substrate, and coupled between an output terminal of the third capacitor and ground.
Claim 26
Dependent Claim
19 words
The balun of claim 16 , wherein the first coil is configured over the substrate in two interconnected groups.
Claim 27
Independent Claim
135 words
A method of manufacturing a balun, comprising: providing a first metallization, deposited over a substrate, and oriented in a first coil, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; providing a second metallization, deposited over the substrate, and oriented in a second coil, the second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and providing a third metallization, deposited over the substrate, and oriented in a third coil, the third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 28
Independent Claim
135 words
A method of manufacturing a balun, comprising: providing a first metallization, deposited over a substrate, and oriented in a first coil, the first coil extending horizontally across the substrate while maintaining a substantially flat vertical profile; providing a second metallization, deposited over the substrate, and oriented in a second coil, the second coil magnetically coupled to the first coil, wherein a portion of the second coil is oriented interiorly of the first coil; and providing a third metallization, deposited over the substrate, and oriented in a third coil, the third coil magnetically coupled to the first and second coils, wherein a first portion of the third coil is oriented interiorly of the second coil, the third coil having a balanced port connected to the third coil between second and third portions of the third coil.
Claim 29
Dependent Claim
21 words
The method of manufacture of claim 24 , wherein the substrate includes a silicon, glass, or ceramic substrate for structural support.
Claim 30
Dependent Claim
19 words
The method of manufacture of claim 25 , wherein the coil structure comprises a portion of a semiconductor device.
Claim 31
Dependent Claim
18 words
The method of manufacture of claim 24 , wherein the first metallization has a rectangular or round cross-section.
Claim 32
Dependent Claim
32 words
The method of manufacture of claim 24 , further including first and second capacitors, deposited over the substrate, and connected between the second and third portions of the third coil and ground.
Claim 33
Dependent Claim
31 words
The method of manufacture of claim 28 , further including a third capacitor, deposited over the substrate, and coupled between a first end of the first coil and an unbalanced port.
Claim 34
Dependent Claim
29 words
The method of manufacture of claim 29 , further including a fourth capacitor, deposited over the substrate, and coupled between an output terminal of the third capacitor and ground.
Claim 35
Dependent Claim
21 words
The method of manufacture of claim 24 , wherein the first coil is configured over the substrate in two interconnected groups.