Curable resin composition

Abstract

Abstract Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX 1 X 2 X 3 or —SiR 1 X 1 X 2 (wherein, X 1 , X 2 and X 3 respectively represent a hydrolytic group and may be the same as or different from each other, and R 1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR 1 X 1 X 2 , the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.

Inventors

• 👤 Shigeki Mori
• 👤 Yukihiro Nomura
• 👤 Kazuhiro Iyo
• 👤 Shinichi Sato

Bibliographic Details