Patent US7402911B2 successfully refreshed from Google Patents.
US7402911B2
Expired / Lapsed
US
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Multi-chip device and method for producing a multi-chip device
Assignee: Polaris Innovations Ltd
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Filing: 2005-06-28
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Granted: 2008-07-22
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Expires: 2025-06-28
Abstract
Abstract The present invention relates to a multi-chip device comprising a substrate having a first surface on which a number of first contact elements is provided, a plurality of integrated circuit chips arranged in a chip stack which is arranged on a second surface of the substrate opposing the first surface, wherein each of the chips having a surface on which a number of second contact elements are provided, wherein a first one of the chips and the second contact elements thereon is arranged such that its second contact elements are uncovered by any of the chips or by the substrate and face towards the second surface of the substrate; and connecting elements which are arranged such as to connect at least one of the first contact elements of the substrate and at least one of the second contact elements of the first chip.
Inventors
- 👤 Jochen Thomas
- 👤 Wolfgang Hetzel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:27
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W70/00; H10W70/60; H10W72/00; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W90/20; H10W90/24; H10W90/291; H10W90/297; H10W90/701; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
288 words
A multi-chip package, comprising: a substrate having opposing first and second surfaces and a plurality of contact areas disposed on the second surface of the substrate; a first integrated circuit positioned in a face-down position over the substrate, wherein a first surface of the first integrated circuit and the first surface of the substrate are in facing relationship with respect to one another, a second surface of the integrated circuit faces away from the substrate, and the first integrated circuit comprises a first plurality of contact pads disposed on the first surface of the first integrated circuit; a second integrated circuit positioned face-down over at least a portion of the first integrated circuit, wherein the second surface of the first integrated circuit is facing at least a portion of a first surface of the second integrated circuit and the second integrated circuit comprises a second plurality of contact pads disposed on the first surface of the second integrated circuit; and electrical conductors coupling the first and second plurality of contact pads to the plurality of contact areas disposed on the second surface of the substrate, wherein the first and second integrated circuits are cascaded, wherein: the first plurality of contact pads is located along a first edge of the first integrated circuit; the second plurality of contact pads is located along a first edge of the second integrated circuit; the first edge of the first integrated circuit is positioned such that the first edge of the first integrated circuit extends beyond a first edge of the substrate; and the first edge of the second integrated circuit is positioned such that the first edge of the second integrated circuit extends beyond the first edge of the first integrated circuit.
Claim 2
Dependent Claim
288 words
A multi-chip package, comprising: a substrate having opposing first and second surfaces and a plurality of contact areas disposed on the second surface of the substrate; a first integrated circuit positioned in a face-down position over the substrate, wherein a first surface of the first integrated circuit and the first surface of the substrate are in facing relationship with respect to one another, a second surface of the integrated circuit faces away from the substrate, and the first integrated circuit comprises a first plurality of contact pads disposed on the first surface of the first integrated circuit; a second integrated circuit positioned face-down over at least a portion of the first integrated circuit, wherein the second surface of the first integrated circuit is facing at least a portion of a first surface of the second integrated circuit and the second integrated circuit comprises a second plurality of contact pads disposed on the first surface of the second integrated circuit; and electrical conductors coupling the first and second plurality of contact pads to the plurality of contact areas disposed on the second surface of the substrate, wherein the first and second integrated circuits are cascaded, wherein: the first plurality of contact pads is located along a first edge of the first integrated circuit; the second plurality of contact pads is located along a first edge of the second integrated circuit; the first edge of the first integrated circuit is positioned such that the first edge of the first integrated circuit extends beyond a first edge of the substrate; and the first edge of the second integrated circuit is positioned such that the first edge of the second integrated circuit extends beyond the first edge of the first integrated circuit.
Claim 3
Dependent Claim
25 words
The multi-chip package of claim 1 , wherein the substrate further comprises a plurality of solder balls connected to the second surface of the substrate.
Claim 4
Dependent Claim
31 words
The multi-chip package of claim 1 , wherein at least one of the first plurality of contact pads and the second plurality of contact pads are part of a redistribution layer.
Claim 5
Dependent Claim
27 words
The multi-chip package of claim 1 , wherein at least a portion of the first integrated circuit, second integrated circuit, and substrate are encapsulated in a mold.
Claim 6
Dependent Claim
38 words
The multi-chip package of claim 1 , wherein the first and second integrated circuits are perpendicularly cascaded, and wherein the second edge of the first integrated circuit is perpendicular to the first edge of the first integrated circuit.
Claim 7
Dependent Claim
309 words
A multi-chip package, comprising: a substrate having a first surface, a second surface, a through-channel extending through the first surface to the second surface, and a plurality of contact areas disposed on the second surface of the substrate; a first integrated circuit in a face-down position over the substrate, wherein a first surface of the first integrated circuit and the first surface of the substrate are in facing relationship with respect to one another, a second surface of the integrated circuit faces away from the substrate, and the first integrated circuit comprises a first plurality of contact pads disposed on the first surface of the first integrated circuit; a second integrated circuit positioned face-down over at least a portion of the first integrated circuit, wherein the second surface of the first integrated circuit is facing at least a portion of a first surface of the second integrated circuit, and the second integrated circuit comprises a second plurality of contact pads disposed on the first surface of the second integrated circuit; electrical conductors coupling the first and second plurality of contact pads to the plurality of contact areas disposed on the second surface of the substrate, wherein the electrical conductors pass through the through-channel, wherein the first and second integrated circuits are cascaded, wherein: the first plurality of contact pads is located along a first edge of the first integrated circuit; the second plurality of contact pads is located along a first edge of the second integrated circuit; the first edge of the first integrated circuit is positioned such that the first edge of the first integrated circuit extends beyond a first edge of the through-channel of the substrate; and the first edge of the second integrated circuit is positioned such that the first edge of the second integrated circuit extends beyond the first edge of the first integrated circuit.
Claim 8
Dependent Claim
309 words
A multi-chip package, comprising: a substrate having a first surface, a second surface, a through-channel extending through the first surface to the second surface, and a plurality of contact areas disposed on the second surface of the substrate; a first integrated circuit in a face-down position over the substrate, wherein a first surface of the first integrated circuit and the first surface of the substrate are in facing relationship with respect to one another, a second surface of the integrated circuit faces away from the substrate, and the first integrated circuit comprises a first plurality of contact pads disposed on the first surface of the first integrated circuit; a second integrated circuit positioned face-down over at least a portion of the first integrated circuit, wherein the second surface of the first integrated circuit is facing at least a portion of a first surface of the second integrated circuit, and the second integrated circuit comprises a second plurality of contact pads disposed on the first surface of the second integrated circuit; electrical conductors coupling the first and second plurality of contact pads to the plurality of contact areas disposed on the second surface of the substrate, wherein the electrical conductors pass through the through-channel, wherein the first and second integrated circuits are cascaded, wherein: the first plurality of contact pads is located along a first edge of the first integrated circuit; the second plurality of contact pads is located along a first edge of the second integrated circuit; the first edge of the first integrated circuit is positioned such that the first edge of the first integrated circuit extends beyond a first edge of the through-channel of the substrate; and the first edge of the second integrated circuit is positioned such that the first edge of the second integrated circuit extends beyond the first edge of the first integrated circuit.
Claim 9
Dependent Claim
28 words
The multi-chip package of claim 6 , wherein the first and second integrated circuits are perpendicularly cascaded, and wherein the second channel is perpendicular to the first channel.
Claim 10
Dependent Claim
25 words
The multi-chip package of claim 7 , wherein the substrate further comprises a plurality of solder balls connected to the second surface of the substrate.
Claim 11
Dependent Claim
31 words
The multi-chip package of claim 7 , wherein at least one of the first plurality of contact pads and the second plurality of contact pads are part of a redistribution layer.
Claim 12
Dependent Claim
367 words
A multi-chip package, comprising: a substrate having opposing first and second surfaces, a first plurality of contact areas disposed on the second surface of the substrate, and a second plurality of contact areas disposed on the second surface of the substrate; a first integrated circuit in a face-down position over the substrate, wherein a first surface of the first integrated circuit and the first surface of the substrate are in facing relationship with respect to one another, wherein a second surface of the integrated circuit faces away from the substrate, and the first integrated circuit comprises a first plurality of contact pads disposed on the first surface of the first integrated circuit; a second integrated circuit positioned face-up over at least a portion of the substrate, wherein the first surface of the substrate is facing at least a portion of a first surface of the second integrated circuit and the second integrated circuit comprises a second plurality of contact pads disposed on a second surface of the second integrated circuit, wherein the first integrated circuit is positioned over at least a portion of the second integrated circuit, and wherein the second surface of the second integrated circuit faces the first surface of the first integrated circuit; first electrical conductors coupling the first plurality of contact pads to the first plurality of contact areas underneath the substrate; and second electrical conductors coupling the second plurality of contact pads to the second plurality of contact areas, wherein the first and second integrated circuits are perpendicularly positioned, wherein: the first plurality of contact pads is located along a first edge of the first integrated circuit; the second plurality of contact pads is located along a first edge of the second integrated circuit; the first integrated circuit is positioned such that the first edge of the first integrated circuit extends beyond a first edge of a first channel of the through-channel of the substrate; and the second integrated circuit is positioned such that the first edge of the second integrated circuit extends beyond a second edge of the first integrated circuit, wherein the second edge of the first integrated circuit is perpendicular to the first edge of the first integrated circuit.
Claim 13
Dependent Claim
367 words
A multi-chip package, comprising: a substrate having opposing first and second surfaces, a first plurality of contact areas disposed on the second surface of the substrate, and a second plurality of contact areas disposed on the second surface of the substrate; a first integrated circuit in a face-down position over the substrate, wherein a first surface of the first integrated circuit and the first surface of the substrate are in facing relationship with respect to one another, wherein a second surface of the integrated circuit faces away from the substrate, and the first integrated circuit comprises a first plurality of contact pads disposed on the first surface of the first integrated circuit; a second integrated circuit positioned face-up over at least a portion of the substrate, wherein the first surface of the substrate is facing at least a portion of a first surface of the second integrated circuit and the second integrated circuit comprises a second plurality of contact pads disposed on a second surface of the second integrated circuit, wherein the first integrated circuit is positioned over at least a portion of the second integrated circuit, and wherein the second surface of the second integrated circuit faces the first surface of the first integrated circuit; first electrical conductors coupling the first plurality of contact pads to the first plurality of contact areas underneath the substrate; and second electrical conductors coupling the second plurality of contact pads to the second plurality of contact areas, wherein the first and second integrated circuits are perpendicularly positioned, wherein: the first plurality of contact pads is located along a first edge of the first integrated circuit; the second plurality of contact pads is located along a first edge of the second integrated circuit; the first integrated circuit is positioned such that the first edge of the first integrated circuit extends beyond a first edge of a first channel of the through-channel of the substrate; and the second integrated circuit is positioned such that the first edge of the second integrated circuit extends beyond a second edge of the first integrated circuit, wherein the second edge of the first integrated circuit is perpendicular to the first edge of the first integrated circuit.
Claim 14
Dependent Claim
56 words
The multi-chip package of claim 10 , wherein the first integrated circuit and the second integrated circuit are on a same level with respect the substrate, such that the first surface of the first integrated circuit and the first surface of the second integrated circuit are a same distance from the first surface of the substrate.
Claim 15
Dependent Claim
53 words
The multi-chip package of claim 10 , wherein the substrate further comprises a through-channel extending through the first surface of the substrate to the second surface of the substrate, and wherein the first electrical conductors connecting the first plurality of contact pads to the first plurality of contact areas pass through the through-channel.
Claim 16
Dependent Claim
25 words
The multi-chip package of claim 10 , wherein the substrate further comprises a plurality of solder balls connected to the second surface of the substrate.
References Cited (Backward Citations)
US6531784B1
Cited
US7205656B2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2011-07-22 | 2012-01-21 | 2012-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2015-07-22 | 2016-01-21 | 2016-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2019-07-22 | 2020-01-21 | 2020-07-22 | $7700.00 | Window Closed / Lapsed |