US7105103B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
System and method for the manufacture of surgical blades
Assignee: Beaver Visitec International US Inc
•
Filing: 2003-03-10
•
Granted: 2006-09-12
•
Expires: 2023-03-10
Abstract
Abstract A method for manufacturing surgical blades from either a crystalline or poly-crystalline material, preferably in the form of a wafer, is disclosed. The method includes preparing the crystalline or poly-crystalline wafers by mounting them and machining trenches into the wafers. The methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, and a hot forge press. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or poly-crystalline material are removed uniformly, producing single or double bevel blades. Nearly any angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5–500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.
Inventors
- 👤 Joseph Francis Keenan
- 👤 Vadim Mark Daskal
- 👤 James Joseph Hughes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 14:47
CPC Classifications
A; A61; A61B; A61B17/00; A61B17/32; A61B17/3209; A61B17/3211; B; B28; B28D; B28D5/00; B28D5/02; B28D5/022; A61B2017/00526
Claims Analysis
Total Claims: 54
Claim 1
Independent Claim
66 words
A method for manufacturing a cutting device from a crystalline material, the method comprising: machining at least one blade profile in a wafer of crystalline material on a first side of the wafer of the crystalline material; isotropically etching the wafer of crystalline material to form at least one surgical blade comprising the at least one blade profile; and singulating the at least one surgical blades.
Claim 2
Independent Claim
66 words
A method for manufacturing a cutting device from a crystalline material, the method comprising: machining at least one blade profile in a wafer of crystalline material on a first side of the wafer of the crystalline material; isotropically etching the wafer of crystalline material to form at least one surgical blade comprising the at least one blade profile; and singulating the at least one surgical blades.
Claim 3
Dependent Claim
29 words
The method according to claim 1 , wherein the machining step comprises: machining at least one blade profile in the wafer of crystalline material with a dicing saw blade.
Claim 4
Dependent Claim
28 words
The method according to claim 1 , wherein the machining step comprises: machining at least one blade profile in the wafer of crystalline material with a laser beam.
Claim 5
Dependent Claim
21 words
The method according to claim 3 , wherein the laser beam is produced by an excimer laser or a laser waterjet.
Claim 6
Dependent Claim
28 words
The method according to claim 1 , wherein the machining step comprises: machining at least one blade profile in the wafer of crystalline material with an ultrasonic machine.
Claim 7
Dependent Claim
29 words
The method according to claim 1 , wherein the machining step comprises: machining at least one blade profile in the wafer of crystalline material with a hot forging process.
Claim 8
Dependent Claim
89 words
The method according to claim 1 , wherein the etching step comprises: placing the wafer of crystalline material with at least one blade profile on a wafer boat; immersing the wafer boat and wafer of crystalline material with at least one blade profile in an isotropic acid bath; etching the crystalline material in a uniform manner such that the crystalline material is removed in a uniform manner on any exposed surface, whereby a sharp surgical blade edge is etched in the shape of the at least one blade profile.
Claim 9
Dependent Claim
23 words
The method according to claim 7 , wherein the isotropic acid bath comprises: a mixture of hydrofluoric acid, nitric acid and acetic acid.
Claim 10
Dependent Claim
22 words
The method according to claim 7 , wherein the isotropic acid bath comprises: a mixture of hydrofluoric acid, nitric acid and water.
Claim 11
Dependent Claim
92 words
The method according to claim 1 , wherein the etching step comprises: placing the wafer of crystalline material with at least one blade profile in a wafer boat; spraying a spray etchant at the wafer boat and wafer of crystalline material with at least one blade profile; etching the crystalline material in a uniform manner with the spray etchant such that the crystalline material is removed in a uniform manner on any exposed surface, whereby a sharp surgical blade edge is etched in the shape of the at least one blade profile.
Claim 12
Dependent Claim
107 words
The method according to claim 1 , wherein the etching step comprises: placing the wafer of crystalline material with at least one blade profile on a wafer boat; immersing the wafer boat and wafer of crystalline material with at least one blade profile in an isotropic xenon difluoride, sulfur hexafluoride or similar fluorinated gas environment; etching the crystalline material in a uniform manner with the isotropic xenon difluoride, sulfur hexafluoride or similar fluorinated gas such that the crystalline material is removed in a uniform manner on any exposed surface, whereby a sharp surgical blade edge is etched in the shape of the at least one blade profile.
Claim 13
Dependent Claim
92 words
The method according to claim 1 , wherein the etching step comprises: placing the wafer of crystalline material with at least one blade profile in a wafer boat; immersing the wafer boat and wafer of crystalline material with at least one blade profile in an electrolytic bath; etching the crystalline material in a uniform manner with the electrolytic bath such that the crystalline material is removed in a uniform manner on any exposed surface, whereby a sharp surgical blade edge is etched in the shape of the at least one blade profile.
Claim 14
Dependent Claim
23 words
The method according to claim 1 , wherein the singulating step comprises: dicing the machined wafer of crystalline material with a dicing blade.
Claim 15
Dependent Claim
23 words
The method according to claim 1 , wherein the singulating step comprises: dicing the machined wafer of crystalline material with a laser beam.
Claim 16
Dependent Claim
21 words
The method according to claim 1 , wherein the laser beam is produced by an excimer laser or a laser waterjet.
Claim 17
Dependent Claim
40 words
The method according to claim 1 , further comprising: dicing the machined wafer of crystalline material profiles after machining the at least one blade profile in the form of single bevel surgical blade and prior to the step of etching.
Claim 18
Dependent Claim
23 words
The method according to claim 16 , wherein the dicing step comprises: dicing the machined wafer of crystalline material with a dicing blade.
Claim 19
Dependent Claim
23 words
The method according to claim 16 , wherein the dicing step comprises: dicing the machined wafer of crystalline material with a laser beam.
Claim 20
Dependent Claim
21 words
The method according to claim 18 , wherein the laser beam is produced by an excimer laser or a laser waterjet.
Claim 21
Dependent Claim
47 words
The method for manufacturing a surgical blade from a crystalline material according to claim 1 , further comprising: machining at least one second blade profile in the wafer of crystalline material on a second side of the wafer of crystalline material prior to the step of etching.
Claim 22
Dependent Claim
20 words
The method according to claim 20 , further comprising: coating the first side of the machined wafer of crystalline material.
Claim 23
Dependent Claim
51 words
The method according to claim 21 , wherein the coating step comprises: coating the first side of the machined wafer of crystalline material with a layer of material selected from the group consisting of silicon nitride, titanium nitride, aluminum titanium nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride, and diamond-like-crystals.
Claim 24
Dependent Claim
43 words
The method according to claim 20 , further comprising: dicing the machined wafer of crystalline material into separated machined double beveled blade profiles after machining the at least one second blade profile in the second side and prior to the step of etching.
Claim 25
Dependent Claim
23 words
The method according to claim 23 , wherein the dicing step comprises: dicing the machined wafer of crystalline material with a dicing blade.
Claim 26
Dependent Claim
23 words
The method according to claim 23 , wherein the dicing step comprises: dicing the machined wafer of crystalline material with a laser beam.
Claim 27
Dependent Claim
21 words
The method according to claim 25 , wherein the laser beam is produced by an excimer laser or a laser waterjet.
Claim 28
Dependent Claim
46 words
The method according to claim 1 , further comprising: coating the first side of the wafer of crystalline material after the step of machining the wafer of crystalline material; and mounting the wafer of crystalline material on its first side prior to the step of etching.
Claim 29
Dependent Claim
51 words
The method according to claim 27 , wherein the coating step comprises: coating the first side of the formed wafer of crystalline material with a layer of material selected from the group consisting of silicon nitride, titanium nitride, aluminum titanium nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride, and diamond-like-crystals.
Claim 30
Dependent Claim
13 words
The method according to claim 1 , wherein the crystalline material comprises silicon.
Claim 31
Independent Claim
106 words
A method for manufacturing a cutting device from a crystalline material, comprising: mounting a wafer of crystalline material on a mounting assembly; pre-cutting the mounted wafer of crystalline material, such that a plurality of through hole fiducials are cut to assist in the machining step; machining at least one blade profile in the wafer of crystalline material on its first side; etching the wafer of crystalline material to form at least one surgical blade; singulating the etched crystalline material surgical blades; and radiating the singulated etched crystalline material surgical blades with ultra-violet light, to separate them from the mounting assembly, in preparation for packaging for sale.
Claim 32
Independent Claim
106 words
A method for manufacturing a cutting device from a crystalline material, comprising: mounting a wafer of crystalline material on a mounting assembly; pre-cutting the mounted wafer of crystalline material, such that a plurality of through hole fiducials are cut to assist in the machining step; machining at least one blade profile in the wafer of crystalline material on its first side; etching the wafer of crystalline material to form at least one surgical blade; singulating the etched crystalline material surgical blades; and radiating the singulated etched crystalline material surgical blades with ultra-violet light, to separate them from the mounting assembly, in preparation for packaging for sale.
Claim 33
Dependent Claim
26 words
The method according to claim 30 wherein the pre-cutting step comprises: pre-cutting through hole fiducials in the mounted wafer of crystalline material with a laser beam.
Claim 34
Dependent Claim
20 words
The method according to claim 31 wherein the laser beam is produced by an excimer laser or a laser waterjet.
Claim 35
Dependent Claim
27 words
The method according to claim 30 wherein the pre-cutting step comprises: pre-cutting through hole fiducials in the mounted wafer of crystalline material using a mechanical machining device.
Claim 36
Dependent Claim
23 words
The method according to claim 33 wherein the mechanical machining device comprises a drilling tool, ultrasonic machining tool or a mechanical grinding device.
Claim 37
Dependent Claim
12 words
The method according to claim 30 wherein the crystalline material comprises silicon.
Claim 38
Independent Claim
103 words
A method for manufacturing a cutting device from a crystalline material, comprising: mounting a wafer of crystalline material on a mounting assembly; pre-cutting the mounted wafer of crystalline material, such that a plurality slots are cut to assist in the machining step; machining at least one blade profile in the wafer of crystalline material on its first side; etching the wafer of crystalline material to form at least one surgical blade; singulating the etched crystalline material surgical blades; and radiating the singulated etched crystalline material surgical blades with ultra-violet light, to separate them from the mounting assembly, in preparation for packaging for sale.
Claim 39
Independent Claim
103 words
A method for manufacturing a cutting device from a crystalline material, comprising: mounting a wafer of crystalline material on a mounting assembly; pre-cutting the mounted wafer of crystalline material, such that a plurality slots are cut to assist in the machining step; machining at least one blade profile in the wafer of crystalline material on its first side; etching the wafer of crystalline material to form at least one surgical blade; singulating the etched crystalline material surgical blades; and radiating the singulated etched crystalline material surgical blades with ultra-violet light, to separate them from the mounting assembly, in preparation for packaging for sale.
Claim 40
Dependent Claim
53 words
The method according to claim 36 further comprising: pre-cutting slots in the mounted wafer of crystalline material with a laser beam a distance away from the edge of the crystalline material; and machining the at least one blade profile with a dicing saw blade that engages the crystalline wafer at the pre-cut slot.
Claim 41
Dependent Claim
21 words
The method according to claim 37 , wherein the laser beam is produced by an excimer laser or a laser waterjet.
Claim 42
Dependent Claim
53 words
The method according to claim 36 further comprising: pre-cutting slots in the mounted wafer of crystalline material with a mechanical machining device a distance away from the edge of the crystalline material; and machining the at least one blade profile with a dicing saw blade that engages crystalline wafer at the pre-cut slot.
Claim 43
Dependent Claim
24 words
The method according to claim 39 , wherein the mechanical machining device comprises a drilling tool, ultrasonic machining tool or a mechanical grinding device.
Claim 44
Dependent Claim
12 words
The method according to claim 36 wherein the crystalline material comprises silicon.
Claim 45
Independent Claim
60 words
A method for manufacturing a cutting device, the method comprising: pre-cutting a wafer of a crystalline material, such that a plurality of through hole fiducials are cut to assist in a machining step; machining at least one blade profile in the wafer of the crystalline material; and etching the wafer of crystalline material to form at least one surgical blade.
Claim 46
Independent Claim
60 words
A method for manufacturing a cutting device, the method comprising: pre-cutting a wafer of a crystalline material, such that a plurality of through hole fiducials are cut to assist in a machining step; machining at least one blade profile in the wafer of the crystalline material; and etching the wafer of crystalline material to form at least one surgical blade.
Claim 47
Dependent Claim
16 words
The method according to claim 42 , further comprising singulating the at least one surgical blade.
Claim 48
Dependent Claim
37 words
The method according to claim 42 , wherein the etching of the wafer comprises isotropically etching the wafer of the crystalline material to form the at least one surgical blade comprising the at least one blade profile.
Claim 49
Dependent Claim
38 words
The method according to claim 44 further comprising: mounting the wafer of the crystalline material on a mounting assembly; and radiating the singulated surgical blade with ultra-violet light, to separate the singulated surgical blade from the mounting assembly.
Claim 50
Independent Claim
58 words
A method for manufacturing a cutting device, the method comprising: pre-cutting a wafer of a crystalline material, such that a plurality of slots are cut to assist in a machining step; machining at least one blade profile in the wafer of the crystalline material; and etching the wafer of crystalline material to form at least one surgical blade.
Claim 51
Independent Claim
58 words
A method for manufacturing a cutting device, the method comprising: pre-cutting a wafer of a crystalline material, such that a plurality of slots are cut to assist in a machining step; machining at least one blade profile in the wafer of the crystalline material; and etching the wafer of crystalline material to form at least one surgical blade.
Claim 52
Dependent Claim
16 words
The method according to claim 46 , further comprising singulating the at least one surgical blade.
Claim 53
Dependent Claim
37 words
The method according to claim 46 , wherein the etching of the wafer comprises isotropically etching the wafer of the crystalline material to form the at least one surgical blade comprising the at least one blade profile.
Claim 54
Dependent Claim
38 words
The method according to claim 48 further comprising: mounting the wafer of the crystalline material on a mounting assembly; and radiating the singulated surgical blade with ultra-violet light, to separate the singulated surgical blade from the mounting assembly.
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