Patent US7091592B2 successfully refreshed from Google Patents.
US7091592B2
Expired / Lapsed
US
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Stacked package for electronic elements and packaging method thereof
Assignee: Industrial Technology Research Institute
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Filing: 2004-02-19
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Granted: 2006-08-15
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Expires: 2024-02-19
Abstract
Abstract A stacked package for electronic elements is provided, a plurality of stud bumps are formed on a substrate by means of a stud bump process to align with a plurality of vias of one provided electronic element. The stud bumps respectively pass through the vias and electrically connect the electronic element. Furthermore, additional electronic elements are stacked on the carrier according to a similar way to form a stacked electronic package.
Inventors
- 👤 Shou-Lung Chen
- 👤 Fang-Jun Leu
- 👤 I-Hsuan Peng
- 👤 Shan-Pu Yu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:05
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/241; H10W72/244; H10W72/90; H10W90/20; H10W90/26; H10W90/297; H10W90/701; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
140 words
A stacked package for electronic elements, comprising: a substrate, having a supporting surface, wherein a plurality of stud bumps are formed on the supporting surface by a stud bump process and contact the supporting surface; and a plurality of electronic elements, each having a plurality of vias corresponding to the stud bumps, wherein the vias of each electronic element are respectively aligned with the stud bumps, each of the stud bumps being allowed to pass through the corresponding vias of the plurality of electronic elements so as to securely mount and stack the electronic elements on the substrate; and a solder paste that is applied over exposed surfaces of the stud bumps on the topmost electronic element, the solder paste being reflowed to flow down through the vias along the stud bumps so as to securely connect the electronic elements.
Claim 2
Dependent Claim
140 words
A stacked package for electronic elements, comprising: a substrate, having a supporting surface, wherein a plurality of stud bumps are formed on the supporting surface by a stud bump process and contact the supporting surface; and a plurality of electronic elements, each having a plurality of vias corresponding to the stud bumps, wherein the vias of each electronic element are respectively aligned with the stud bumps, each of the stud bumps being allowed to pass through the corresponding vias of the plurality of electronic elements so as to securely mount and stack the electronic elements on the substrate; and a solder paste that is applied over exposed surfaces of the stud bumps on the topmost electronic element, the solder paste being reflowed to flow down through the vias along the stud bumps so as to securely connect the electronic elements.
Claim 3
Dependent Claim
18 words
The stacked package for electronic elements of claim 1 , further comprising a spacer between adjacent electronic elements.
Claim 4
Dependent Claim
21 words
The stacked package for electronic elements of claim 1 , wherein the material of the stud bumps is a conductive metal.
Claim 5
Dependent Claim
22 words
The stacked package for electronic elements of claim 1 , wherein the material of the stud bumps is gold, copper or aluminum.
Claim 6
Dependent Claim
27 words
The stacked package for electronic elements of claim 1 , wherein the element is a silicon chip, a GaAs chip, an InP chip or a epitaxily-grown chip.
Claim 7
Dependent Claim
30 words
The stacked package for electronic elements of claim 1 , wherein the substrate is an organic substrate, a ceramic substrate, a glass substrate, a silicon substrate or a GaAs substrate.
Claim 8
Dependent Claim
33 words
The stacked package for electronic elements of claim 1 , wherein each of the stud bumps has a bottom wider than a width of the corresponding vias of the plurality of electronic elements.
Claim 9
Dependent Claim
43 words
The stacked package for electronic elements of claim 1 , wherein the plurality of electronic elements are stacked from bottom to top as a stacked structure, and each of the stud bumps has a height larger than a height of the stacked structure.
Claim 10
Dependent Claim
46 words
The stacked package for electronic elements of claim 1 , wherein the plurality of electronic elements are stacked from bottom to top as a stacked structure, and each of the stud bumps protrudes from a top surface of the topmost electronic element of the stacked structure.
Claim 11
Dependent Claim
120 words
A stacked package for electronic elements, comprising: a substrate, having a supporting surface, wherein a plurality of stud bumps are formed on the supporting surface by a stud bump process; a plurality of electronic elements, each having a plurality of vias corresponding to the stud bumps, wherein the vias of each electronic element are respectively aligned with the stud bumps, the stud bumps being allowed to pass through the vias so as to securely mount and stack the electronic elements on the substrate; and a conductive glue that is applied over the stud bumps on an exposed surface of the topmost electronic element, and flows through the vias along the stud bumps so as to securely connect the electronic elements.
Claim 12
Dependent Claim
120 words
A stacked package for electronic elements, comprising: a substrate, having a supporting surface, wherein a plurality of stud bumps are formed on the supporting surface by a stud bump process; a plurality of electronic elements, each having a plurality of vias corresponding to the stud bumps, wherein the vias of each electronic element are respectively aligned with the stud bumps, the stud bumps being allowed to pass through the vias so as to securely mount and stack the electronic elements on the substrate; and a conductive glue that is applied over the stud bumps on an exposed surface of the topmost electronic element, and flows through the vias along the stud bumps so as to securely connect the electronic elements.
Claim 13
Dependent Claim
18 words
The stacked package for electronic elements of claim 10 , further comprising a spacer between adjacent electronic elements.
Claim 14
Dependent Claim
21 words
The stacked package for electronic elements of claim 10 , wherein the material of the stud bumps is a conductive metal.
Claim 15
Dependent Claim
22 words
The stacked package for electronic elements of claim 10 , wherein the material of the stud bumps is gold, copper or aluminum.
Claim 16
Dependent Claim
27 words
The stacked package for electronic elements of claim 10 , wherein the element is a silicon chip, a GaAs chip, an InP chip or a epitaxily-grown chip.
Claim 17
Dependent Claim
30 words
The stacked package for electronic elements of claim 10 , wherein the substrate is an organic substrate, a ceramic substrate, a glass substrate, a silicon substrate or a GaAs substrate.
Claim 18
Dependent Claim
33 words
The stacked package for electronic elements of claim 10 , wherein each of the stud bumps has a bottom wider than a width of the corresponding vias of the plurality of electronic elements.
Claim 19
Dependent Claim
43 words
The stacked package for electronic elements of claim 10 , wherein the plurality of electronic elements are stacked from bottom to top as a stacked structure, and each of the stud bumps has a height larger than a height of the stacked structure.
Claim 20
Dependent Claim
46 words
The stacked package for electronic elements of claim 10 , wherein the plurality of electronic elements are stacked from bottom to top as a stacked structure, and each of the stud bumps protrudes from a top surface of the topmost electronic element of the stacked structure.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-08-14 | 2010-02-13 | 2010-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-08-14 | 2014-02-13 | 2014-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-08-14 | 2018-02-13 | 2018-08-15 | $7700.00 | Window Closed / Lapsed |