Patent US6744763B1 successfully refreshed from Google Patents.
Patent US7072185B1 successfully refreshed from Google Patents.
US7072185B1
Expired / Lapsed
US
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Electronic module for system board with pass-thru holes
Assignee: Hewlett Packard Enterprise Development LP
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Filing: 2004-12-21
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Granted: 2006-07-04
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Expires: 2024-12-21
Abstract
Abstract Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.
Inventors
- 👤 Christian L. Belady
- 👤 Gary W. Williams
- 👤 Shaun L Harris
- 👤 Steven A. Belson
- 👤 Eric C. Peterson
- 👤 Stuart C. Haden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:23
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; G; G06; G06F; G06F1/00; G06F1/16; G06F1/18; G06F1/189; G06F1/20; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0213; H05K1/0263; H05K1/144; H05K2201/00; H05K2201/04; H05K2201/045; H05K2201/06; H05K2201/064; H05K2201/09; H05K2201/09009; H05K2201/09054; H05K2201/10; H05K2201/10007; H05K2201/10189; H05K2201/10431; H05K2201/1056; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/15; H05K2203/1572; H05K3/00; H05K3/0058; H05K3/0061
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
80 words
An electronic module connectable to a system board with pass-thru holes, the electronic module comprising: a first portion coupled to one side of the system board and having a printed circuit board (PCB) with plural processors; and a second portion coupled to a second, opposite side of the system board, having a power system board electrically coupled to the first portion, and having thermal dissipation device, wherein the thermal dissipation device extends through at least one of the pass-thru holes.
Claim 2
Dependent Claim
80 words
An electronic module connectable to a system board with pass-thru holes, the electronic module comprising: a first portion coupled to one side of the system board and having a printed circuit board (PCB) with plural processors; and a second portion coupled to a second, opposite side of the system board, having a power system board electrically coupled to the first portion, and having thermal dissipation device, wherein the thermal dissipation device extends through at least one of the pass-thru holes.
Claim 3
Dependent Claim
29 words
The electronic module of claim 1 wherein the PCB forms one side of the electronic module, and the power system board forms a second side of the electronic module.
Claim 4
Dependent Claim
32 words
The electric module of claim 1 wherein each processor is aligned with one of the pass-thru holes to receive a portion of the thermal dissipation device that extends through the pass-thru hole.
Claim 5
Dependent Claim
33 words
The electronic module of claim 1 wherein the thermal dissipation device directly contacts the plural processors and the power system for dissipation heat directly away from the plural processors and the power system.
Claim 6
Dependent Claim
24 words
The electronic module of claim 1 wherein the thermal dissipation device has plural extensions a extend through plural pass-thru holes of the system board.
Claim 7
Dependent Claim
16 words
The electronic module of claim 5 wherein the extensions conduct heat away from the plural processors.
Claim 8
Dependent Claim
27 words
The electronic module of claim 1 wherein heat generated by the processors is conducted, via the thermal dissipation device, from the first portion to the second module.
Claim 9
Dependent Claim
27 words
The electronic module of claim 1 wherein heat generated by the processors is conducted through the at least one pass-thru hole and exited from the electronic module.
Claim 10
Dependent Claim
26 words
The electronic module of claim 1 wherein the thermal dissipation device substantially fills a volume of space formed between the PCB and the power system board.
Claim 11
Dependent Claim
82 words
An electronic module connectable to a system board with a pass-thru hole, the electronic module, comprising: a circuit board having plural separate processors; a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board; and a thermal dissipation device disposed between the circuit and power boards for dissipating heat away from the processors, wherein the electronic module extends through the pass-thru hole and connects on two opposite sides of the system board.
Claim 12
Dependent Claim
82 words
An electronic module connectable to a system board with a pass-thru hole, the electronic module, comprising: a circuit board having plural separate processors; a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board; and a thermal dissipation device disposed between the circuit and power boards for dissipating heat away from the processors, wherein the electronic module extends through the pass-thru hole and connects on two opposite sides of the system board.
Claim 13
Dependent Claim
23 words
The electronic module of claim 10 wherein the thermal dissipation device extends trough the pass-thru hole to conduct heat away from the processors.
Claim 14
Dependent Claim
42 words
The electronic module of claim 10 wherein: the electronic module has a rectangular configuration; the pass-thru holes extends above two processors; the thermal dissipation device dissipates heat, via a direct heat exchange, away from both the power board and the two processors.
Claim 15
Dependent Claim
42 words
The electronic module of claim 10 wherein the circuit board forms one side of the electronic module, the power board forms another side of the electronic module, and the system board passes through the electronic module between the circuit and power boards.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-07-03 | 2010-01-02 | 2010-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-07-03 | 2014-01-02 | 2014-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-07-03 | 2018-01-02 | 2018-07-04 | $7700.00 | Window Closed / Lapsed |