US6974219B1
Expired / Lapsed
US
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Zero reflectance design for tilted devices
Assignee: Gula Consulting LLC
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Filing: 2004-07-09
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Granted: 2005-12-13
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Expires: 2024-07-09
Abstract
Abstract Techniques that eliminate or otherwise reduce retroreflections associated with focal plane arrays (cooled and uncooled) and other tilted devices are disclosed. The device topology is designed so that incoming radiation is reflected outside of the incoming focusing optical cone. Planarization is used to eliminate concave geometries and angled sidewalls can be used to eliminate convex geometries, as such geometries cause retroreflection. The resultant structure is covered with reflective material (e.g., aluminum, titanium tungsten, or other standard metallization), which not only safely reflects light from the scene, but also prevents reflections from the underlying geometries of the via. Devices configured in accordance with the principles of the present invention require less tilt, thereby minimizing optical distortion.
Inventors
- 👤 Jeannie Geneczko
- 👤 Richard Blackwell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 13:03
CPC Classifications
G; G02; G02B; G02B27/00; G02B27/0018; H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/18; H10F39/184; H10F39/1843; H10F39/80; H10F39/811; H10F39/809; Y; Y10; Y10S; Y10S359/00; Y10S359/90
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
85 words
A method for manufacturing a tilted focal plane array having a via structure that fills and planarizes at least one via and is configured to reduce retroreflections, the method comprising: planarizing each via so as to provide each via with a planarized topmost surface for substantially eliminating internal physical geometries of each via; creating external angled sidewalls for each via so as to provide each via with a built-in tilt; and covering the planarized topmost surface and the external angled sidewalls with a reflective material.
Claim 2
Independent Claim
85 words
A method for manufacturing a tilted focal plane array having a via structure that fills and planarizes at least one via and is configured to reduce retroreflections, the method comprising: planarizing each via so as to provide each via with a planarized topmost surface for substantially eliminating internal physical geometries of each via; creating external angled sidewalls for each via so as to provide each via with a built-in tilt; and covering the planarized topmost surface and the external angled sidewalls with a reflective material.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein the covering includes metallizing the planarized topmost surface and the external angled sidewalls of each via.
Claim 4
Dependent Claim
22 words
The method of claim 1 wherein the reflective material is selected from one of the group consisting of aluminum and titanium tungsten.
Claim 5
Dependent Claim
18 words
The method of claim 1 wherein the planarizing includes filling internal concave geometries of each via with polyimide.
Claim 6
Dependent Claim
30 words
The method of claim 1 wherein the planarizing includes filling internal concave geometries of each via with at least one of the group consisting of spin-on-glass and selectively deposited metal.
Claim 7
Dependent Claim
25 words
The method of claim 1 wherein the external angled sidewalls are angled at about 45° relative to a focal plane of the focal plane array.
Claim 8
Dependent Claim
28 words
The method of claim 1 wherein the planarizing includes filling internal concave geometries of each via with polyimide, and creating the external angled sidewalls includes etching the polyimide.
Claim 9
Dependent Claim
17 words
The method of claim 1 wherein creating the external angled sidewalls includes etching the planarized topmost surface.
Claim 10
Dependent Claim
26 words
The method of claim 1 wherein creating the external angled sidewalls is carried out using one of the group consisting of spin-on-glass and sputter deposited dielectric.
Claim 11
Dependent Claim
17 words
The method of claim 1 wherein creating the external angled sidewalls is carried out using photodefinable polyimide.
Claim 12
Dependent Claim
80 words
A tilted focal plane array having a at least one via structure that fills and planarizes at least one via and is configured to reduce retroreflections, the array comprising: a number of detection areas for detecting radiation; each via structure having a planarized topmost surface for substantially eliminating internal physical via geometries and external angled sidewalls so as to provide each via with a built-in tilt; and a reflective material covering the planarized topmost surface and the external angled sidewalls.
Claim 13
Dependent Claim
80 words
A tilted focal plane array having a at least one via structure that fills and planarizes at least one via and is configured to reduce retroreflections, the array comprising: a number of detection areas for detecting radiation; each via structure having a planarized topmost surface for substantially eliminating internal physical via geometries and external angled sidewalls so as to provide each via with a built-in tilt; and a reflective material covering the planarized topmost surface and the external angled sidewalls.
Claim 14
Dependent Claim
26 words
The array of claim 11 wherein the reflective material is a metal deposited on the planarized topmost surface and the external angled sidewalls of each via.
Claim 15
Dependent Claim
20 words
The array of claim 11 wherein the reflective material is one of the group consisting of aluminum and titanium tungsten.
Claim 16
Dependent Claim
21 words
The array of claim 11 wherein at least one of the planarized topmost surfaces and the external angled sidewalls are polyimide.
Claim 17
Dependent Claim
31 words
The array of claim 11 wherein each planarized topmost surface for substantially eliminating internal physical via geometries is at least one of the group consisting of spin-on-glass and selectively deposited metal.
Claim 18
Dependent Claim
25 words
The array of claim 11 wherein the external angled sidewalls are angled at about 45° relative to a focal plane of the focal plane array.
Claim 19
Dependent Claim
24 words
The array of claim 11 wherein the external angled sidewalls include one of the group consisting of spin-on-glass, sputter deposited dielectric, and photodefinable polyimide.
Claim 20
Dependent Claim
60 words
A via structure that fills and planarizes at least one via and is configured to reduce retroreflections of a tilted device, comprising: a planarized topmost surface for substantially eliminating internal physical via geometries; external angled sidewalls so as to provide each via with a built-in tilt; and a reflective material covering the planarized topmost surface and the external angled sidewalls.
Claim 21
Dependent Claim
60 words
A via structure that fills and planarizes at least one via and is configured to reduce retroreflections of a tilted device, comprising: a planarized topmost surface for substantially eliminating internal physical via geometries; external angled sidewalls so as to provide each via with a built-in tilt; and a reflective material covering the planarized topmost surface and the external angled sidewalls.
Claim 22
Dependent Claim
13 words
The via structure of claim 18 wherein the reflective material is a metal.
Claim 23
Dependent Claim
21 words
The via structure of claim 18 wherein the reflective material is one of the group consisting of aluminum and titanium tungsten.
Claim 24
Dependent Claim
22 words
The via structure of claim 18 wherein at least one of the planarized topmost surface and the external angled sidewalls is polyimide.
Claim 25
Dependent Claim
25 words
The via structure of claim 18 wherein the planarized topmost surface is at least one of the group consisting of spin-on-glass and selectively deposited metal.
Claim 26
Dependent Claim
38 words
The via structure of claim 18 wherein the external angled sidewalls are angled between 35° and 55° relative to a focal plane of the tilted device, and include one of polyimide, spin-on-glass, sputter deposited dielectric, or photodefinable polyimide.
Claim 27
Independent Claim
91 words
A method for manufacturing a tilted focal plane array having a via structure configured to reduce retroreflections, the method comprising: providing a via topology for said via structure configured to reflect incoming radiation outside of an incoming focusing optical cone associated with an imaged scene, by filling and planarizing a via to provide at least one external angled sidewall and a substantially planarized topmost surface, wherein said substantially planarized topmost surface and said external angled sidewall of said via topology reflect said incoming radiation outside of said incoming focusing optical cone.
Claim 28
Independent Claim
91 words
A method for manufacturing a tilted focal plane array having a via structure configured to reduce retroreflections, the method comprising: providing a via topology for said via structure configured to reflect incoming radiation outside of an incoming focusing optical cone associated with an imaged scene, by filling and planarizing a via to provide at least one external angled sidewall and a substantially planarized topmost surface, wherein said substantially planarized topmost surface and said external angled sidewall of said via topology reflect said incoming radiation outside of said incoming focusing optical cone.
Claim 29
Dependent Claim
89 words
A via structure that fills and planarizes a via and is configured to reduce retroreflections of a tilted device, comprising: a via topology for said via structure configured to reflect incoming radiation outside of an incoming focusing optical cone associated with an imaged scene wherein said via topology includes at least one external angled side wall and with a substantially planarized topmost surface, wherein said substantially planarized topmost surface and said external angled sidewall of said via topology reflect said incoming radiation outside of said incoming focusing optical cone.
Claim 30
Dependent Claim
89 words
A via structure that fills and planarizes a via and is configured to reduce retroreflections of a tilted device, comprising: a via topology for said via structure configured to reflect incoming radiation outside of an incoming focusing optical cone associated with an imaged scene wherein said via topology includes at least one external angled side wall and with a substantially planarized topmost surface, wherein said substantially planarized topmost surface and said external angled sidewall of said via topology reflect said incoming radiation outside of said incoming focusing optical cone.
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