US6960092B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compression mount and zero insertion force socket for IC devices
Assignee: Advanced Micro Devices Inc
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Filing: 2003-07-25
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Granted: 2005-11-01
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Expires: 2023-07-25
Abstract
Abstract In a socket system and method for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, a zif opening on a socket asserts substantially zero force as the pin of the IC device is inserted therein. In addition, a compression mount lead on the socket presses against the contact pad of the circuit board. Once inside the zif opening, the pin is coupled to the compression mount lead via forking leads that press against the pin. Thus, substantially zero force is applied on the body of the IC device. Furthermore, top portions of the forking leads contact a top portion of the pin toward the IC device to minimize an electrical path length.
Inventors
- 👤 Rafiq Hussain
- 👤 Jeffrey Cymerys
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 23:18
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0441; G01R1/0466; H; H01; H01R; H01R33/00; H01R33/74; H01R33/76; H01R12/00; H01R12/70; H01R12/71; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1007; H05K7/1053; H05K7/1076; H05K7/1084; H01R12/712; H01R12/714; H01R12/82; H01R12/85; H01R12/89
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
98 words
A socket system for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, comprising: a zif (zero-insertion-force) opening on a socket that asserts substantially zero force when a whole of the pin of the IC device is completely inserted within the zif opening; a compression mount lead disposed on the socket, wherein the compression mount lead includes a compression mechanism that compresses the compression mount lead against the contact pad of the circuit board with a compressive force; and a mechanism for coupling the pin to the compression mount lead.
Claim 2
Dependent Claim
98 words
A socket system for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, comprising: a zif (zero-insertion-force) opening on a socket that asserts substantially zero force when a whole of the pin of the IC device is completely inserted within the zif opening; a compression mount lead disposed on the socket, wherein the compression mount lead includes a compression mechanism that compresses the compression mount lead against the contact pad of the circuit board with a compressive force; and a mechanism for coupling the pin to the compression mount lead.
Claim 3
Dependent Claim
113 words
A socket system for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, comprising: a zif (zero-insertion-force) opening on a socket that asserts substantially zero force as the pin of the IC device is completely inserted therein; a compression mount lead disposed on the socket, wherein the compression mount lead includes a compression mechanism that compresses the compression mount lead against the contact pad of the circuit board with a compressive force; and a mechanism for coupling the pin to the compression mount lead; wherein the socket is mounted onto the circuit board such that the compression mount lead is compressed against the contact pad.
Claim 4
Dependent Claim
113 words
A socket system for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, comprising: a zif (zero-insertion-force) opening on a socket that asserts substantially zero force as the pin of the IC device is completely inserted therein; a compression mount lead disposed on the socket, wherein the compression mount lead includes a compression mechanism that compresses the compression mount lead against the contact pad of the circuit board with a compressive force; and a mechanism for coupling the pin to the compression mount lead; wherein the socket is mounted onto the circuit board such that the compression mount lead is compressed against the contact pad.
Claim 5
Dependent Claim
29 words
The socket system of claim 1 , wherein substantially zero force is asserted on the body of the IC device when the pin is coupled to the contact pad.
Claim 6
Dependent Claim
32 words
The socket system of claim 1 , further comprising: a back plate mounted to a back-side of the circuit board when the socket is mounted to a front-side of the circuit board.
Claim 7
Dependent Claim
25 words
The socket system of claim 1 , wherein the socket and the circuit board are part of a test system for testing the IC device.
Claim 8
Dependent Claim
23 words
The socket system of claim 1 , wherein the socket and the circuit board are parts for an OEM (original equipment manufacturer) machine.
Claim 9
Dependent Claim
18 words
The socket system of claim 1 , wherein the compression mount mechanism is comprised of a pogo spring.
Claim 10
Dependent Claim
28 words
The socket of claim 1 , wherein the compression mount lead is comprised of a J-bend lead that is compressed against the contact pad of the circuit board.
Claim 11
Dependent Claim
38 words
The socket system of claim 1 , wherein the mechanism for coupling the pin to the compression mount lead applies a force on the pin in a direction that is always perpendicular to a length of the pin.
Claim 12
Dependent Claim
91 words
The socket system of claim 9 , wherein the mechanism for coupling the pin to the compression mount lead comprises: forking leads coupled to the compression mount lead and surrounding the pin within the zif opening; and an actuation plate and an actuation lever that press the forking leads against the pin with the actuation plate being pressed toward the forking leads in only one lateral direction that is perpendicular to the length of the pin such that the pin is coupled to the compression mount lead via the forking leads.
Claim 13
Dependent Claim
39 words
The socket system of claim 10 , wherein top portions of the forking leads contact a top portion of the pin toward the IC device to minimize an electrical path length between the IC device and the circuit board.
Claim 14
Dependent Claim
111 words
A socket system for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, comprising: means for asserting substantially zero force on the pin of the IC device as a whole of the pin is completely inserted into a zif (zero-insertion-force) opening on a socket; means for compressing a compression mount lead against the contact pad of the circuit board with a compressive force; and means for coupling the pin of the IC device within the zif opening to the compression mount lead; wherein the socket is mounted onto the circuit board such that the compression mount lead is compressed against the contact pad.
Claim 15
Dependent Claim
111 words
A socket system for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, comprising: means for asserting substantially zero force on the pin of the IC device as a whole of the pin is completely inserted into a zif (zero-insertion-force) opening on a socket; means for compressing a compression mount lead against the contact pad of the circuit board with a compressive force; and means for coupling the pin of the IC device within the zif opening to the compression mount lead; wherein the socket is mounted onto the circuit board such that the compression mount lead is compressed against the contact pad.
Claim 16
Dependent Claim
24 words
The socket system of claim 12 , further comprising: means for minimizing an electrical path length between the IC device and the circuit board.
Claim 17
Dependent Claim
50 words
The socket system of claim 12 , further comprising: means for asserting substantially zero force on the body of the IC device when the pin is coupled to the compression mount lead with a force applied on the pin in a direction only perpendicular to a length of the pin.
Claim 18
Independent Claim
81 words
A method for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, including the steps of: asserting substantially zero force on the pin when a whole of the pin of the IC device is completely inserted within a zif (zero-insertion-force) opening on a socket; compressing a compression mount lead on the socket with a compressive force against the contact pad of the circuit board; and coupling the pin to the compression mount lead.
Claim 19
Independent Claim
81 words
A method for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, including the steps of: asserting substantially zero force on the pin when a whole of the pin of the IC device is completely inserted within a zif (zero-insertion-force) opening on a socket; compressing a compression mount lead on the socket with a compressive force against the contact pad of the circuit board; and coupling the pin to the compression mount lead.
Claim 20
Independent Claim
100 words
A method for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, including the steps of: asserting substantially zero force on the pin as a whole of the pin of the IC device is completely inserted into a zif (zero-insertion-force) opening on a socket; compressing a compression mount lead on the socket with a compressive force against the contact pad of the circuit board; coupling the pin to the compression mount lead; and mounting the socket onto the circuit board such that the compression mount lead is compressed against the contact pad.
Claim 21
Independent Claim
100 words
A method for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, including the steps of: asserting substantially zero force on the pin as a whole of the pin of the IC device is completely inserted into a zif (zero-insertion-force) opening on a socket; compressing a compression mount lead on the socket with a compressive force against the contact pad of the circuit board; coupling the pin to the compression mount lead; and mounting the socket onto the circuit board such that the compression mount lead is compressed against the contact pad.
Claim 22
Dependent Claim
31 words
The method of claim 15 , further including the step of: asserting substantially zero force on the body of the IC device when the pin is coupled to the contact pad.
Claim 23
Dependent Claim
34 words
The method of claim 15 , further including the step of: mounting a back plate to a back-side of the circuit board when the socket is mounted to a front-side of the circuit board.
Claim 24
Dependent Claim
24 words
The method of claim 15 , wherein the socket and the circuit board are part of a test system for testing the IC device.
Claim 25
Dependent Claim
22 words
The method of claim 15 , wherein the socket and the circuit board are parts for an OEM (original equipment manufacturer) machine.
Claim 26
Dependent Claim
17 words
The method of claim 15 , wherein the compression mount lead is comprised of a pogo spring.
Claim 27
Dependent Claim
28 words
The method of claim 15 , wherein the compression mount lead is comprised of a J-bend lead that is compressed against the contact pad of the circuit board.
Claim 28
Dependent Claim
35 words
The method of claim 15 , further comprising: coupling the pin to the compression mount lead with a force on the pin in a direction that is always perpendicular to a length of the pin.
Claim 29
Dependent Claim
57 words
The method of claim 23 , further including the step of: pressing forking leads against the pin with an actuation plate that is pressed toward the forking leads in only one lateral direction that is perpendicular to the length of the pin such that the pin is coupled to the compression mount lead via the forking leads.
Claim 30
Dependent Claim
38 words
The method of claim 24 , wherein top portions of the forking leads contact a top portion of the pin towards the IC device to minimize an electrical path length between the IC device and the circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-10-31 | 2009-05-02 | 2009-11-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-10-31 | 2013-05-02 | 2013-11-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-10-31 | 2017-05-02 | 2017-11-01 | $7700.00 | Window Closed / Lapsed |