Zero insertion force connector for printed circuit boards

Claim 1

A low insertion force socket for receiving an integrated circuit package with multiple leads in an array, said socket comprising: an insulative base having means for receiving a plurality of contacts, an insulative top plate having openings for receiving the leads of a said package, a plurality of individual contacts supported in said base for making connection between the leads of a said package and an external electronic article, said contacts each comprising at least one arm which is movable into engagement with a lead of a said package, a cam plate formed of insulative material positioned between said base and said top plate and having means for receiving each contact and for moving said at least one arm of each contact between an open and a closed position upon movement of said cam plate in relationship to said base and said top plate, spring means for forcing said cam plate in a direction to move said at least one arm of each contact to close against and to make contact with said leads, said spring means comprising opposed undulating surfaces which have spaced nodes to allow the surfaces to cross a line therebetween which line is generally perpendicular to the desired direction of movement of said cam plate, and a flat leaf spring interposed between said surfaces and stressed to a serpentine path for producing a force to urge said cam plate in said direction to move said arms of said contacts to a closed position, and means for releasing the pressure from said spring means for releasing said arms of said contacts from said force of said cam plate.