US6943294B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrating passive components on spacer in stacked dies
Assignee: Intel Corp
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Filing: 2003-12-22
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Granted: 2005-09-13
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Expires: 2023-12-22
Abstract
Abstract An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.
Inventors
- 👤 Jung Kang
- 👤 Kaladhar Radhakrishnan
- 👤 Shamala A. Chikamenahalli
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:15
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W44/00; H10W44/20; H10W90/00; H10W20/00; H10W20/40; H10W72/00; H10W72/01; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W74/10; H10W74/15; H10W90/20; H10W90/231; H10W90/701; H10W90/721; H10W90/728; H10W90/731; H10W90/734; H10W90/738; H10W90/751; H10W90/752; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
35 words
A method comprising: integrating a capacitor on a spacer between upper and lower dies in stacked dies; and attaching bumps to electrically connect the capacitor to at least one of the upper and lower dies.
Claim 2
Independent Claim
35 words
A method comprising: integrating a capacitor on a spacer between upper and lower dies in stacked dies; and attaching bumps to electrically connect the capacitor to at least one of the upper and lower dies.
Claim 3
Dependent Claim
24 words
The method of claim 1 further comprising: filling adhesive between the spacer and the upper die and between the spacer and the lower die.
Claim 4
Dependent Claim
19 words
The method of claim 1 wherein integrating comprises: integrating the capacitor being a thin-film capacitor having a dielectric material.
Claim 5
Dependent Claim
21 words
The method of claim 1 wherein integrating comprises: integrating the capacitor having a thickness substantially less than thickness of the spacer.
Claim 6
Dependent Claim
20 words
The method of claim 4 wherein integrating comprises: integrating the capacitor having the thickness between 50 angstrom to 200 angstrom.
Claim 7
Dependent Claim
19 words
The method of claim 1 wherein integrating comprises: integrating the capacitor having a capacitance of at least 100 nF.
Claim 8
Dependent Claim
17 words
The method of claim 1 further comprising: filling adhesive between the lower die to a package substrate.
Claim 9
Dependent Claim
39 words
A spacer assembly comprising: a capacitor integrated on a spacer between upper and lower dies in stacked dies; and bumps attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies.
Claim 10
Dependent Claim
39 words
A spacer assembly comprising: a capacitor integrated on a spacer between upper and lower dies in stacked dies; and bumps attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies.
Claim 11
Dependent Claim
26 words
The spacer assembly of claim 8 further comprising: adhesive layers filled between the spacer and the upper die and between the spacer and the lower die.
Claim 12
Dependent Claim
17 words
The spacer assembly of claim 8 wherein the capacitor is a thin-film capacitor having a dielectric material.
Claim 13
Dependent Claim
19 words
The spacer assembly of claim 8 wherein the capacitor has a thickness substantially less than thickness of the spacer.
Claim 14
Dependent Claim
18 words
The spacer assembly of claim 11 wherein the capacitor has the thickness between 50 angstrom to 200 angstrom.
Claim 15
Dependent Claim
17 words
The spacer assembly of claim 8 wherein the capacitor has a capacitance of at least 100 nF.
Claim 16
Dependent Claim
27 words
The spacer assembly of claim 8 wherein the lower die is attached to a package substrate by an adhesive between the lower die and the package substrate.
Claim 17
Dependent Claim
96 words
A die assembly comprising: a package substrate; a plurality of stacked dies on the package substrate and having at least an upper die and a lower die; and at least a spacer assembly between the upper and lower dies, the spacer assembly comprising: a capacitor integrated on a spacer between the upper and lower dies, and conductors attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies bumps attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies.
Claim 18
Dependent Claim
96 words
A die assembly comprising: a package substrate; a plurality of stacked dies on the package substrate and having at least an upper die and a lower die; and at least a spacer assembly between the upper and lower dies, the spacer assembly comprising: a capacitor integrated on a spacer between the upper and lower dies, and conductors attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies bumps attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies.
Claim 19
Dependent Claim
30 words
The die assembly of claim 15 wherein the spacer assembly further comprises: adhesive layers filled between the spacer and the upper die and between the spacer and the lower die.
Claim 20
Dependent Claim
17 words
The die assembly of claim 15 wherein the capacitor is a thin-film capacitor having a dielectric material.
Claim 21
Dependent Claim
19 words
The die assembly of claim 15 wherein the capacitor has a thickness substantially less than thickness of the spacer.
Claim 22
Dependent Claim
18 words
The die assembly of claim 18 wherein the capacitor has the thickness between 50 angstrom to 200 angstrom.
Claim 23
Dependent Claim
17 words
The die assembly of claim 15 wherein the capacitor has a capacitance of at least 100 nF.
Claim 24
Dependent Claim
27 words
The die assembly of claim 15 wherein the lower die is attached to the package substrate by an adhesive between the lower die and the package substrate.
References Cited (Backward Citations)
US6005778A
Cited
US5864177A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2008-09-12 | 2009-03-14 | 2009-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-09-12 | 2013-03-14 | 2013-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-09-12 | 2017-03-14 | 2017-09-13 | $7700.00 | Window Closed / Lapsed |