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US6943042B2 Expired / Lapsed US ⏱️ 0.0 years remaining

Method of detecting spatially correlated variations in a parameter of an integrated circuit die

Assignee: Bell Semiconductor LLC
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Filing: 2003-08-13
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Granted: 2005-09-13
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Expires: 2023-08-13
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Abstract

Abstract A method of detecting spatially correlated variations that may be used for detecting statistical outliers in a production lot of integrated circuits to increase the average service life of the production lot includes measuring a selected parameter of each of a plurality of electronic circuits replicated on a common surface; calculating a difference between a value of the selected parameter at a target location and a value of the selected parameter an identical relative location with respect to the target location for each of the plurality of electronic circuits to generate a distribution of differences; calculating an absolute value of the distribution of differences; and calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location.

Inventors

  • 👤 Robert Madge
  • 👤 Kevin Cota
  • 👤 Bruce Whitefield

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 20:29
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/23

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 104 words
A method of detecting variations in a spatially correlated parameter comprising: measuring a selected parameter of each of a plurality of electronic circuits replicated on a common substrate; calculating a difference between a value of the selected parameter at a target location and that of an identical relative location with respect to the target location for each of the plurality of electronic circuits to generate a distribution of differences; calculating an absolute value of the distribution of differences; and calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location.
Claim 2
Independent Claim 104 words
A method of detecting variations in a spatially correlated parameter comprising: measuring a selected parameter of each of a plurality of electronic circuits replicated on a common substrate; calculating a difference between a value of the selected parameter at a target location and that of an identical relative location with respect to the target location for each of the plurality of electronic circuits to generate a distribution of differences; calculating an absolute value of the distribution of differences; and calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location.
Claim 3
Dependent Claim 28 words
The method of claim 1 further comprising plotting the residual as a function of the identical relative location to determine a spatial correlation pattern of the selected parameter.
Claim 4
Dependent Claim 22 words
The method of claim 1 wherein the electronic circuit is an integrated circuit die and the common substrate is a silicon wafer.
Claim 5
Dependent Claim 12 words
The method of claim 1 wherein the selected parameter is quiescent current.
Claim 6
Dependent Claim 150 words
A process for reducing the variance of a selected parameter in a production lot of integrated circuits comprising: measuring a selected parameter of each of a plurality of integrated circuit die replicated on a wafer substrate; calculating a difference between a value of the selected parameter at a target location and that of an identical relative location with respect to the target location for each of the plurality of integrated circuit die to generate a distribution of differences; calculating an absolute value of the distribution of differences; calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location having an expected value range of the selected parameter at the identical relative location; and rejecting any of the plurality of integrated circuit die having a value of the selected parameter that lies outside the expected value range.
Claim 7
Dependent Claim 150 words
A process for reducing the variance of a selected parameter in a production lot of integrated circuits comprising: measuring a selected parameter of each of a plurality of integrated circuit die replicated on a wafer substrate; calculating a difference between a value of the selected parameter at a target location and that of an identical relative location with respect to the target location for each of the plurality of integrated circuit die to generate a distribution of differences; calculating an absolute value of the distribution of differences; calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location having an expected value range of the selected parameter at the identical relative location; and rejecting any of the plurality of integrated circuit die having a value of the selected parameter that lies outside the expected value range.
Claim 8
Dependent Claim 28 words
The process of claim 5 further comprising plotting the residual as a function of the identical relative location to determine a spatial correlation pattern of the selected parameter.
Claim 9
Dependent Claim 12 words
The process of claim 5 wherein the selected parameter is quiescent current.

References Cited (Backward Citations)

US6023186A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2008-09-12 2009-03-14 2009-09-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2012-09-12 2013-03-14 2013-09-13 $3760.00 Window Closed / Lapsed
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