Abstract A method of detecting spatially correlated variations that may be used for detecting statistical outliers in a production lot of integrated circuits to increase the average service life of the production lot includes measuring a selected parameter of each of a plurality of electronic circuits replicated on a common surface; calculating a difference between a value of the selected parameter at a target location and a value of the selected parameter an identical relative location with respect to the target location for each of the plurality of electronic circuits to generate a distribution of differences; calculating an absolute value of the distribution of differences; and calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location.
Inventors
👤 Robert Madge
👤 Kevin Cota
👤 Bruce Whitefield
Bibliographic Details
Application Number—
JurisdictionUS
Data Sourcegoogle_patents
Last Synchronized2026-11-09 20:29
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/23
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
104 words
A method of detecting variations in a spatially correlated parameter comprising: measuring a selected parameter of each of a plurality of electronic circuits replicated on a common substrate; calculating a difference between a value of the selected parameter at a target location and that of an identical relative location with respect to the target location for each of the plurality of electronic circuits to generate a distribution of differences; calculating an absolute value of the distribution of differences; and calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location.
Claim 2
Independent Claim
104 words
A method of detecting variations in a spatially correlated parameter comprising: measuring a selected parameter of each of a plurality of electronic circuits replicated on a common substrate; calculating a difference between a value of the selected parameter at a target location and that of an identical relative location with respect to the target location for each of the plurality of electronic circuits to generate a distribution of differences; calculating an absolute value of the distribution of differences; and calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location.
Claim 3
Dependent Claim
28 words
The method of claim 1 further comprising plotting the residual as a function of the identical relative location to determine a spatial correlation pattern of the selected parameter.
Claim 4
Dependent Claim
22 words
The method of claim 1 wherein the electronic circuit is an integrated circuit die and the common substrate is a silicon wafer.
Claim 5
Dependent Claim
12 words
The method of claim 1 wherein the selected parameter is quiescent current.
Claim 6
Dependent Claim
150 words
A process for reducing the variance of a selected parameter in a production lot of integrated circuits comprising: measuring a selected parameter of each of a plurality of integrated circuit die replicated on a wafer substrate; calculating a difference between a value of the selected parameter at a target location and that of an identical relative location with respect to the target location for each of the plurality of integrated circuit die to generate a distribution of differences; calculating an absolute value of the distribution of differences; calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location having an expected value range of the selected parameter at the identical relative location; and rejecting any of the plurality of integrated circuit die having a value of the selected parameter that lies outside the expected value range.
Claim 7
Dependent Claim
150 words
A process for reducing the variance of a selected parameter in a production lot of integrated circuits comprising: measuring a selected parameter of each of a plurality of integrated circuit die replicated on a wafer substrate; calculating a difference between a value of the selected parameter at a target location and that of an identical relative location with respect to the target location for each of the plurality of integrated circuit die to generate a distribution of differences; calculating an absolute value of the distribution of differences; calculating an average of the absolute value of the distribution of differences to generate a representative value for the residual for the identical relative location having an expected value range of the selected parameter at the identical relative location; and rejecting any of the plurality of integrated circuit die having a value of the selected parameter that lies outside the expected value range.
Claim 8
Dependent Claim
28 words
The process of claim 5 further comprising plotting the residual as a function of the identical relative location to determine a spatial correlation pattern of the selected parameter.
Claim 9
Dependent Claim
12 words
The process of claim 5 wherein the selected parameter is quiescent current.