US6887650B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Transfer method, method of manufacturing thin film devices, method of manufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, ic card, and electronic appliance
Assignee: Samsung Electronics Co Ltd
•
Filing: 2002-07-24
•
Granted: 2005-05-03
•
Expires: 2022-07-24
Abstract
Abstract A transfer method comprising a step of forming a plurality of transferred bodies on a transfer origin substrate, and a step of applying energy to partial regions corresponding to the transferred bodies to be transferred, and transferring these transferred bodies corresponding to the partial regions onto a transfer destination substrate. A plurality of transferred bodies such as devices or circuits that are to be disposed on a transfer destination substrate with spaces therebetween can be manufactured integrated together on a transfer origin substrate, and hence compared with the case that the transferred bodies are formed on the transfer destination substrate directly, the amount of materials used in the manufacture of the transferred bodies can be reduced, the area efficiency can be greatly improved, and a transfer destination substrate on which a large number of devices or circuits are disposed in scattered locations can be manufactured efficiently and cheaply.
Inventors
- 👤 Tatsuya Shimoda
- 👤 Sumio Utsunomiya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 17:48
CPC Classifications
H; H10; H10D; H10D86/00; H10D86/01; H10D86/021; H10D86/0214; B; B82; B82Y; B82Y10/00; B82Y30/00; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/046; H10B; H10B10/00; H10B12/00; H10B12/01; H10B20/00; H10B20/27; H10B41/00; H10B51/00; H10B51/30; H10B53/00; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0314; H10D30/0321; H10D30/0323; H10D84/00; H10D84/90; H10D86/40; H10D86/60; H10D86/80; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/136; G02F1/13613; H10K; H10K59/00; H10K59/10; H10K59/12; H10P72/7412; H10P72/7414; H10P72/7426; H10P72/743; H10P72/7432; H10P72/7434; H10P72/744; H10W; H10W72/00; H10W72/01; H10W72/0198; H10W90/00; H10W90/20; H10W90/24
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
74 words
A transfer method for transferring a transferred body, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; applying energy to a partial region of the transfer layer corresponding to each of said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial region onto a transfer destination substrate.
Claim 2
Dependent Claim
74 words
A transfer method for transferring a transferred body, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; applying energy to a partial region of the transfer layer corresponding to each of said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial region onto a transfer destination substrate.
Claim 3
Dependent Claim
42 words
The transfer method according to claim 1 , further comprising dividing the plurality of said transferred bodies into a plurality of regions, and the transferring of said transferred bodies comprising applying said energy to one or more of said plurality of regions.
Claim 4
Dependent Claim
48 words
The transfer method according to claim 1 , the transferring of said transferred bodies onto said transfer destination substrate comprising making said transfer origin substrate face the transfer destination substrate, and forming an adhesive layer on at least either said said transferred bodies or said transfer destination substrate.
Claim 5
Dependent Claim
50 words
The transfer method according to claim 1 , further comprising: before the forming of said transferred bodies, forming a peeling layer on said transfer origin substrate; and after the forming of said transferred bodies, dividing at least either said transferred bodies or said peeling layer into a plurality of regions.
Claim 6
Dependent Claim
24 words
The transfer method according to claim 1 , transferring of said transferred bodies onto said transfer destination substrate comprising irradiating light as said energy.
Claim 7
Dependent Claim
30 words
The transfer method according to claim 1 , further comprising: shifting the relative position between nozzles that discharge a material and said substrate; and discharging said material from said nozzles.
Claim 8
Dependent Claim
41 words
The transfer method according to claim 1 , the forming of said transferred bodies comprising forming region dividing sections that guide said transferred bodies during said transfer such that said transferred bodies are divided along outer peripheries of said partial regions.
Claim 9
Dependent Claim
33 words
The transfer method according to claim 7 , the forming of said transferred bodies further comprising forming a projecting structure that demarcates the regions of said transferred bodies as said region dividing sections.
Claim 10
Dependent Claim
32 words
The transfer method according to claim 7 , the forming of said transferred bodies further comprising forming grooves at boundaries between the regions of said transferred bodies as said region dividing sections.
Claim 11
Dependent Claim
33 words
The transfer method according to claim 1 , the forming of said transferred bodies comprising forming devices or circuits having the same constitution as one another as said plurality of said transferred bodies.
Claim 12
Dependent Claim
33 words
The transfer method according to claim 1 , the forming of said transferred bodies comprising forming devices or circuits having a different constitution to one another as said plurality of said transferred bodies.
Claim 13
Dependent Claim
28 words
A method of manufacturing thin film devices comprising the transfer method according to claim 1 , the thin film devices including thin film devices as said transferred bodies.
Claim 14
Dependent Claim
25 words
A method of manufacturing integrated circuits comprising the transfer method according to claim 1 , the integrated circuits including integrated circuits as said transferred bodies.
Claim 15
Dependent Claim
16 words
A method of manufacturing a circuit board, comprising the transfer method according to claim 1 .
Claim 16
Dependent Claim
16 words
A method of manufacturing an electro-optical apparatus, comprising the transfer method according to claim 1 .
Claim 17
Dependent Claim
129 words
A transfer method for transferring a transferred body, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial regions onto transfer destination substrates; the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other said transferred bodies corresponding to the other partial regions onto other said transfer destination substrates.
Claim 18
Dependent Claim
129 words
A transfer method for transferring a transferred body, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial regions onto transfer destination substrates; the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other said transferred bodies corresponding to the other partial regions onto other said transfer destination substrates.
Claim 19
Dependent Claim
121 words
A transfer method for transferring transferred bodies, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; transferring said transferred bodies from said transfer origin substrate onto an intermediate transfer substrate; and transferring said transferred bodies from said intermediate transfer substrate onto a transfer destination substrate; at least either the transferring of said transferred bodies onto said intermediate transfer substrate or the transferring of said transferred bodies onto said transfer destination substrate, comprising applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred, and transferring said transferred bodies formed in the partial regions.
Claim 20
Dependent Claim
121 words
A transfer method for transferring transferred bodies, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; transferring said transferred bodies from said transfer origin substrate onto an intermediate transfer substrate; and transferring said transferred bodies from said intermediate transfer substrate onto a transfer destination substrate; at least either the transferring of said transferred bodies onto said intermediate transfer substrate or the transferring of said transferred bodies onto said transfer destination substrate, comprising applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred, and transferring said transferred bodies formed in the partial regions.
Claim 21
Dependent Claim
54 words
The transfer method according to claim 17 , further comprising: dividing the plurality of said transferred bodies into a plurality of regions, and at least either the transferring onto said intermediate transfer substrate or the transferring onto said transfer destination substrate comprising applying said energy to one or more of said plurality of regions.
Claim 22
Dependent Claim
47 words
The transfer method according to claim 17 , the transferring of said transferred bodies onto said intermediate transfer substrate comprising making said transfer origin substrate face said intermediate transfer substrate, and forming an adhesive layer on at least either said transferred bodies or said intermediate transfer substrate.
Claim 23
Dependent Claim
47 words
The transfer method according to claim 17 , the transferring of said transferred bodies onto said transfer destination substrate comprising making said intermediate transfer substrate face said transfer destination substrate, and forming an adhesive layer on at least either said transferred bodies or said transfer destination substrate.
Claim 24
Dependent Claim
50 words
The transfer method according to claim 17 , further comprising: before the forming of said transferred bodies, forming a peeling layer on said transfer origin substrate; and after the forming of said transferred bodies, dividing at least either said transferred bodies or said peeling layer into said plurality of regions.
Claim 25
Dependent Claim
33 words
The transfer method according to claim 17 , at least either the transferring onto said intermediate transfer substrate or the transferring onto said transfer destination substrate comprising irradiating light is as said energy.
Claim 26
Dependent Claim
30 words
The transfer method according to claim 17 , further comprising: shifting the relative position between nozzles that discharge a material and said substrate; and discharging said material from said nozzles.
Claim 27
Dependent Claim
41 words
The transfer method according to claim 17 , the forming of said transferred bodies comprising forming region dividing sections that guide said transferred bodies during said transfer such that said transferred bodies are divided along outer peripheries of said partial regions.
Claim 28
Dependent Claim
33 words
The transfer method according to claim 24 , the forming of said transferred bodies further comprising forming a projecting structure that demarcates the regions of said transferred bodies as said region dividing sections.
Claim 29
Dependent Claim
32 words
The transfer method according to claim 24 , the forming of said transferred bodies further comprising forming grooves at boundaries between the regions of said transferred bodies as said region dividing sections.
Claim 30
Dependent Claim
30 words
The transfer method according to claim 17 , the forming of said transferred bodies comprising forming devices or circuits having the same constitution as one another as said transferred bodies.
Claim 31
Dependent Claim
30 words
The transfer method according to claim 17 , the forming of said transferred bodies comprising forming devices or circuits having a different constitution to one another as said transferred bodies.
Claim 32
Dependent Claim
28 words
A method of manufacturing thin film devices comprising the transfer method according to claim 17 , the thin film devices including thin film devices as said transferred bodies.
Claim 33
Dependent Claim
25 words
A method of manufacturing integrated circuits comprising the transfer method according to claim 17 , the integrated circuits including integrated circuits as said transferred bodies.
Claim 34
Dependent Claim
16 words
A method of manufacturing a circuit board, comprising the transfer method according to claim 17 .
Claim 35
Dependent Claim
16 words
A method of manufacturing an electro-optical apparatus, comprising the transfer method according to claim 17 .
Claim 36
Dependent Claim
181 words
A transfer method for transferring transferred bodies, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; transferring said transferred bodies from said transfer origin substrate onto an intermediate transfer substrate; and transferring said transferred bodies from said intermediate transfer substrate onto transfer destination substrates; at least either the transferring of said transferred bodies onto said intermediate transfer substrate or the transferring of said transferred bodies onto said transfer destination substrates, comprising applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred, and transferring said transferred bodies formed in the partial regions; and the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other transferred bodies corresponding to the other partial regions onto another one of said transfer destination substrates.
Claim 37
Dependent Claim
181 words
A transfer method for transferring transferred bodies, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; transferring said transferred bodies from said transfer origin substrate onto an intermediate transfer substrate; and transferring said transferred bodies from said intermediate transfer substrate onto transfer destination substrates; at least either the transferring of said transferred bodies onto said intermediate transfer substrate or the transferring of said transferred bodies onto said transfer destination substrates, comprising applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred, and transferring said transferred bodies formed in the partial regions; and the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other transferred bodies corresponding to the other partial regions onto another one of said transfer destination substrates.
Claim 38
Dependent Claim
69 words
A transfer method for transferring a transferred body, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies by patterning the transfer layer on the transfer origin substrate; applying energy to a partial region of the transfer layer corresponding to each of said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial region onto a transfer destination substrate.
Claim 39
Dependent Claim
69 words
A transfer method for transferring a transferred body, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies by patterning the transfer layer on the transfer origin substrate; applying energy to a partial region of the transfer layer corresponding to each of said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial region onto a transfer destination substrate.
Claim 40
Dependent Claim
125 words
A transfer method for transferring a transferred body, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies by patterning the transfer layer on the transfer origin substrate; and applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial regions onto transfer destination substrates; the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other said transferred bodies corresponding to the other partial regions onto other said transfer destination substrates.
Claim 41
Dependent Claim
125 words
A transfer method for transferring a transferred body, comprising: forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies by patterning the transfer layer on the transfer origin substrate; and applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial regions onto transfer destination substrates; the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other said transferred bodies corresponding to the other partial regions onto other said transfer destination substrates.
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