Patent US6849954B2 successfully refreshed from Google Patents.
US6849954B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC package substrate with over voltage protection function
Assignee: Inpaq Technology Co Ltd
•
Filing: 2002-08-15
•
Granted: 2005-02-01
•
Expires: 2022-08-15
Abstract
Abstract The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install multiple protection devices on a printed circuit board. Therefore, the costs to design circuits are reduced, the limited space is effectively utilized, and unit costs to install respective protection devices are lowered down.
Inventors
- 👤 Chun-yuan Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:00
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/80; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
81 words
An IC package substrate with over voltage protection function, comprising: a substrate ( 22 ); one or more lower electrodes ( 25 ) disposed on the substrate; one or more protection material layers ( 24 ) disposed on the lower electrode and electrically connected with the lower electrodes; one or more upper electrodes ( 21 ) disposed on the one or more protection material layers and connected with said protection material layers; and one or more grounding lines ( 23 ).
Claim 2
Dependent Claim
81 words
An IC package substrate with over voltage protection function, comprising: a substrate ( 22 ); one or more lower electrodes ( 25 ) disposed on the substrate; one or more protection material layers ( 24 ) disposed on the lower electrode and electrically connected with the lower electrodes; one or more upper electrodes ( 21 ) disposed on the one or more protection material layers and connected with said protection material layers; and one or more grounding lines ( 23 ).
Claim 3
Dependent Claim
22 words
The IC package substrate with over voltage protection function of claim 1 , wherein the protection material layers are variable resistance materials.
Claim 4
Dependent Claim
29 words
The IC package substrate with over voltage protection function of claim 1 , further comprising an overcoat ( 26 ) for protecting an IC chip and helping heat dissipation.
Claim 5
Dependent Claim
23 words
The IC package substrate with over voltage protection function of claim 1 , wherein the grounding lines are separated from the lower electrodes.
References Cited (Backward Citations)
US4959505A
Cited
US4993142A
Cited
US5831510A
Cited
US5884391A
Cited
JPH09260106A
Cited
US6223423B1
Cited
US20010000658A1
Cited
US6242997B1
Cited
US6556123B1
Cited
US6429533B1
Cited
US6285275B1
Cited
US6297722B1
Cited
US6498715B2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-02-01 | 2008-08-02 | 2009-02-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-02-01 | 2012-08-02 | 2013-02-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-02-01 | 2016-08-02 | 2017-02-01 | $7700.00 | Window Closed / Lapsed |