US6849954B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC package substrate with over voltage protection function
Assignee: Inpaq Technology Co Ltd
•
Filing: 2002-08-15
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Granted: 2005-02-01
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Expires: 2022-08-15
Abstract
Abstract The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install multiple protection devices on a printed circuit board. Therefore, the costs to design circuits are reduced, the limited space is effectively utilized, and unit costs to install respective protection devices are lowered down.
Inventors
- 👤 Chun-yuan Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:40
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/80; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
81 words
An IC package substrate with over voltage protection function, comprising: a substrate ( 22 ); one or more lower electrodes ( 25 ) disposed on the substrate; one or more protection material layers ( 24 ) disposed on the lower electrode and electrically connected with the lower electrodes; one or more upper electrodes ( 21 ) disposed on the one or more protection material layers and connected with said protection material layers; and one or more grounding lines ( 23 ).
Claim 2
Dependent Claim
81 words
An IC package substrate with over voltage protection function, comprising: a substrate ( 22 ); one or more lower electrodes ( 25 ) disposed on the substrate; one or more protection material layers ( 24 ) disposed on the lower electrode and electrically connected with the lower electrodes; one or more upper electrodes ( 21 ) disposed on the one or more protection material layers and connected with said protection material layers; and one or more grounding lines ( 23 ).
Claim 3
Dependent Claim
22 words
The IC package substrate with over voltage protection function of claim 1 , wherein the protection material layers are variable resistance materials.
Claim 4
Dependent Claim
29 words
The IC package substrate with over voltage protection function of claim 1 , further comprising an overcoat ( 26 ) for protecting an IC chip and helping heat dissipation.
Claim 5
Dependent Claim
23 words
The IC package substrate with over voltage protection function of claim 1 , wherein the grounding lines are separated from the lower electrodes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-02-01 | 2008-08-02 | 2009-02-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-02-01 | 2012-08-02 | 2013-02-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-02-01 | 2016-08-02 | 2017-02-01 | $7700.00 | Window Closed / Lapsed |