US6819001B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interposer, interposer package and device assembly employing the same
Assignee: General Electric Co
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Filing: 2003-03-14
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Granted: 2004-11-16
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Expires: 2023-03-14
Abstract
Abstract An interposer, interposer package and device assembly employing the same are provided. The interposer has a substrate formed of a semiconductor material, with first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof. The second input/output contacts are electrically connected to the first input/output contacts. The first input/output contacts disposed over the first main surface of the interposer substrate are for attachment to input/output pads of a device to which the interposer is to be attached. The second input/output contacts disposed over the second main surface of the interposer substrate facilitate electrical coupling to a component to which the interposer is also to be attached.
Inventors
- 👤 William E. Burdick, Jr.
- 👤 James W. Rose
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:33
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W40/00; H10W40/10; H10W70/65; H10W70/654; H10W70/655; H10W70/656; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/075; H10W72/20; H10W72/50; H10W72/551; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
140 words
A structure comprising: an interposer comprising a substrate formed of a semiconductor material and having first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof, wherein the second input/output contacts are electrically connected to the first input/output contacts; and wherein the first input/output contacts disposed over the first main surface of the substrate are for attachment to input/output pads of a device to which the interposer is to be attached, and wherein the second input/output contacts disposed over the second main surface facilitate coupling to contacts of a component to which the interposer is also to be attached; and wherein the first input/output contacts disposed over the first main surface have a different pitch than the second input/output contacts disposed over the second main surface of the interposer's substrate.
Claim 2
Dependent Claim
140 words
A structure comprising: an interposer comprising a substrate formed of a semiconductor material and having first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof, wherein the second input/output contacts are electrically connected to the first input/output contacts; and wherein the first input/output contacts disposed over the first main surface of the substrate are for attachment to input/output pads of a device to which the interposer is to be attached, and wherein the second input/output contacts disposed over the second main surface facilitate coupling to contacts of a component to which the interposer is also to be attached; and wherein the first input/output contacts disposed over the first main surface have a different pitch than the second input/output contacts disposed over the second main surface of the interposer's substrate.
Claim 3
Dependent Claim
41 words
The structure of claim 1 , wherein the first input/output contacts disposed over the first main surface of the interposer substrate have a comparable feature size to the input/output pads of the device to which the interposer is to be attached.
Claim 4
Dependent Claim
41 words
The structure of claim 1 , wherein the device comprises a bare integrated circuit chip having an x,y surface area, and wherein the interposer has a surface area similarly sized to the x,y surface area of the bare integrated circuit chip.
Claim 5
Dependent Claim
44 words
The structure of claim 3 , wherein the bare integrated circuit chip comprises a first integrated circuit chip, the component comprises a second integrated circuit chip, and the interposer facilitates electrical connection between the first integrated circuit chip and the second integrated circuit chip.
Claim 6
Dependent Claim
20 words
The structure of claim 1 , wherein the semiconductor material comprises at least one of silicon, silicon carbide, and gallium-arsenide.
Claim 7
Dependent Claim
35 words
The structure of claim 1 , wherein the device has a substrate formed of a semiconductor material and the interposer's substrate semiconductor material matches at least in part the semiconductor material of the device's substrate.
Claim 8
Dependent Claim
84 words
The structure of claim 1 , wherein each input/output contact of the first input/output contacts disposed over the first main surface of the interposer's substrate is electrically connected to at least one input/output contact of the second input/output contacts disposed over the second main surface of the interposer's substrate, and wherein the second input/output contacts disposed over the second main surface of the interposer's substrate have a larger pitch than the first input/output contacts disposed over the first main surface of the interposer's substrate.
Claim 9
Dependent Claim
84 words
The structure of claim 1 , wherein each input/output contact of the first input/output contacts disposed over the first main surface of the interposer's substrate is electrically connected to at least one input/output contact of the second input/output contacts disposed over the second main surface of the interposer's substrate, and wherein the second input/output contacts disposed over the second main surface of the interposer's substrate have a smaller pitch than the first input/output contacts disposed over the first main surface of the interposer's substrate.
Claim 10
Dependent Claim
81 words
The structure of claim 1 , wherein the interposer further comprises at least one of a heat sink for facilitating dissipation of heat from the device when the interposer is attached thereto, and an active or a passive circuit or component disposed on the interposer's substrate and electrically coupled to one or more of the first input/output contacts disposed over the first main surface of the substrate or the second input/output contacts disposed over the second main surface of the substrate.
Claim 11
Dependent Claim
143 words
A structure comprising: an interposer comprising a substrate formed of a semiconductor material and having first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof, wherein the second input/output contacts are electrically connected to the first input/output contacts: wherein the first input/output contacts disposed over the first main surface of the substrate are for attachment to input/output pads of a device to which the interposer is to be attached, and wherein the second input/output contacts disposed over the second main surface facilitate coupling to contacts of a component to which the interposer is also to be attached; and wherein the interposer further comprises an interposer package, the interposer package having an encapsulate surrounding at least a portion of the second input/output contacts disposed over the second main surface of the interposer's substrate.
Claim 12
Dependent Claim
143 words
A structure comprising: an interposer comprising a substrate formed of a semiconductor material and having first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof, wherein the second input/output contacts are electrically connected to the first input/output contacts: wherein the first input/output contacts disposed over the first main surface of the substrate are for attachment to input/output pads of a device to which the interposer is to be attached, and wherein the second input/output contacts disposed over the second main surface facilitate coupling to contacts of a component to which the interposer is also to be attached; and wherein the interposer further comprises an interposer package, the interposer package having an encapsulate surrounding at least a portion of the second input/output contacts disposed over the second main surface of the interposer's substrate.
Claim 13
Dependent Claim
53 words
The structure of claim 9 , wherein the interposer package further comprises pluggable input/output contacts disposed over the second main surface of the substrate and electrically connected to the second input/output contacts over the second main surface of the interposer's substrate, the pluggable input/output contacts facilitating plugging/unplugging of the interposer to/from the component.
Claim 14
Dependent Claim
145 words
A structure comprising: an integrated circuit device having input/output pads disposed over a surface thereof; an interposer having a substrate formed of a semiconductor material, and having first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof, wherein the second input/output contacts are electrically connected to the first input/output contacts; wherein the first input/output contacts disposed over the first main surface of the substrate are electrically attached to the input/output pads of the integrated circuit device, and wherein the second input/output contacts disposed over the second main surface facilitate coupling to contacts of a component to which the interposer can also be attached; and wherein the first input/output contacts disposed over the first main surface have a different pitch than the second input/output contacts disposed over the second main surface of the interposer's subtrate.
Claim 15
Dependent Claim
145 words
A structure comprising: an integrated circuit device having input/output pads disposed over a surface thereof; an interposer having a substrate formed of a semiconductor material, and having first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof, wherein the second input/output contacts are electrically connected to the first input/output contacts; wherein the first input/output contacts disposed over the first main surface of the substrate are electrically attached to the input/output pads of the integrated circuit device, and wherein the second input/output contacts disposed over the second main surface facilitate coupling to contacts of a component to which the interposer can also be attached; and wherein the first input/output contacts disposed over the first main surface have a different pitch than the second input/output contacts disposed over the second main surface of the interposer's subtrate.
Claim 16
Dependent Claim
40 words
The structure of claim 12 , wherein the integrated circuit device comprises a first integrated circuit chip and wherein the component comprises at least one of a second integrated circuit chip, a flexible circuit interconnect, and a printed circuit board.
Claim 17
Dependent Claim
20 words
The structure of claim 12 , wherein the semiconductor material comprises at least one of silicon, silicon carbide, and gallium-arsenide.
Claim 18
Dependent Claim
39 words
The structure of claim 12 , wherein the integrated circuit device has a substrate formed of a semiconductor material and the interposer's substrate semiconductor material matches at least in part the semiconductor material of the integrated circuit device's substrate.
Claim 19
Dependent Claim
79 words
The structure of claim 12 , wherein the interposer further comprises at least one of a heat sink for facilitating dissipation of heat from the integrated circuit device, and an active or a passive circuit or component disposed on the interposer's substrate and electrically coupled to one or more of the first input/output contacts disposed over the first main surface of the interposer's substrate or the second input/output contacts disposed over the second main surface of the interposer's substrate.
Claim 20
Dependent Claim
40 words
The structure of claim 12 , wherein the interposer further comprises an interposer package, the interposer package including an encapsulate surrounding at least a portion of the second input/output contacts disposed over the second main surface of the interposer's substrate.
Claim 21
Dependent Claim
39 words
The structure of claim 17 , wherein the interposer package further comprises pluggable input/output contacts disposed over the second main surface of the interposer substrate and electrically connected to the second input/output contacts over the substrate's second main surface.
Claim 22
Dependent Claim
149 words
A structure comprising: an integrated circuit device having input/output pads disposed over a surface thereof; an interposer having a substrate formed of a semiconductor material and having first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof, wherein the second input/output contacts are electrically connected to the first input/output contacts; wherein the first input/output contacts disposed over the first main surface of the substrate are electrically attached to the input/output pads of the integrated circuit device, and wherein the second input/output contacts disposed over the second main surface facilitate coupling to contacts of a component to which the interposer can also be attached; and further comprising electrical interconnection electrically connecting the first input/output contacts to the second input/output contacts of the interposer's substrate, wherein the electrical interconnection is electrically isolated from the semiconductor material of the interposer's substrate.
Claim 23
Dependent Claim
149 words
A structure comprising: an integrated circuit device having input/output pads disposed over a surface thereof; an interposer having a substrate formed of a semiconductor material and having first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof, wherein the second input/output contacts are electrically connected to the first input/output contacts; wherein the first input/output contacts disposed over the first main surface of the substrate are electrically attached to the input/output pads of the integrated circuit device, and wherein the second input/output contacts disposed over the second main surface facilitate coupling to contacts of a component to which the interposer can also be attached; and further comprising electrical interconnection electrically connecting the first input/output contacts to the second input/output contacts of the interposer's substrate, wherein the electrical interconnection is electrically isolated from the semiconductor material of the interposer's substrate.
Claim 24
Dependent Claim
17 words
The structure of claim 12 , wherein the integrated circuit device comprises a bare integrated circuit chip.
Claim 25
Dependent Claim
50 words
The structure of claim 20 , wherein the interposer further comprises pluggable input/output contacts disposed over the second main surface of the interposer substrate and electrically connected to the second input/output contacts over the substrate's second main surface, the pluggable input/output contacts facilitating plugging/unplugging of the interposer to/from the component.
Claim 26
Independent Claim
121 words
A method for contacting input/output pads of a device, comprising: providing an interposer having a substrate formed of a semiconductor material, wherein the interposer includes first input/output contacts disposed over a first main surface of the interposer's substrate and second input/output contacts disposed over a second main surface of the interposer's substrate, the first input/output contacts being electrically connected to the second input/output contacts; electrically connecting the interposer to a device by electrically connecting the first input/output contacts of the interposer to input/output pads of the device; and wherein the first input/output contacts disposed over the first main surface of the interposer have a different pitch than the second input/output contacts disposed over the second main surface of the interposer substrate.
Claim 27
Independent Claim
121 words
A method for contacting input/output pads of a device, comprising: providing an interposer having a substrate formed of a semiconductor material, wherein the interposer includes first input/output contacts disposed over a first main surface of the interposer's substrate and second input/output contacts disposed over a second main surface of the interposer's substrate, the first input/output contacts being electrically connected to the second input/output contacts; electrically connecting the interposer to a device by electrically connecting the first input/output contacts of the interposer to input/output pads of the device; and wherein the first input/output contacts disposed over the first main surface of the interposer have a different pitch than the second input/output contacts disposed over the second main surface of the interposer substrate.
Claim 28
Dependent Claim
20 words
The method of claim 22 , wherein the semiconductor material comprises at least one of silicon, silicon carbide, and gallium-arsenide.
Claim 29
Dependent Claim
35 words
The method of claim 22 , wherein the device has a substrate formed of a semiconductor material and the interposer's substrate semiconductor material matches at least in part the semiconductor material of the device's substrate.
Claim 30
Dependent Claim
56 words
The method of claim 22 , wherein the second input/output contacts disposed over the interposer's second main surface facilitate coupling of the interposer to contacts of a component to which the interposer can also be attached, wherein the component comprises at least one of another device, a flexible circuit interconnect, or a printed circuit board subsystem.
Claim 31
Dependent Claim
15 words
The method of claim 22 , wherein the device comprises a bare integrated circuit chip.
Claim 32
Dependent Claim
38 words
The method of claim 26 , wherein the bare integrated circuit chip has an x,y surface area, and wherein the interposer has an x,y surface area similar to the x,y surface area of the bare integrated circuit chip.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-11-16 | 2008-05-17 | 2008-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-11-16 | 2012-05-17 | 2012-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-11-16 | 2016-05-17 | 2016-11-16 | $7700.00 | Window Closed / Lapsed |