Patent US6816378B1 successfully refreshed from Google Patents.
US6816378B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stack up assembly
Assignee: Hewlett Packard Enterprise Development LP
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Filing: 2003-04-28
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Granted: 2004-11-09
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Expires: 2023-04-28
Abstract
Abstract A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
Inventors
- 👤 Christian L. Belady
- 👤 Shaun L. Harris
- 👤 Gary Wayne Williams
- 👤 Brent A. Boudreaux
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:47
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/021; H05K1/14; H05K1/144; H10W40/10; H10W40/20; H10W40/22; H05K1/0204; H05K2201/00; H05K2201/04; H05K2201/042; H05K2201/06; H05K2201/066
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
127 words
An assembly, comprising: a first printed circuit board having a first opening and including a first heat-generating device; a second printed circuit board; a thermal pad on a surface of said second printed circuit board substantially aligned with said first opening in said first printed circuit board; a second heat-generating device mechanically and electrically coupled with said second printed circuit board, and thermally coupled with said thermal pad; and a heat sink having a first protrusion configured to extend through the first opening in said first printed circuit board, wherein said heat sink makes thermal contact with said first heat-generating device on said first printed circuit board, and wherein said heat sink first protrusion makes thermal contact with said thermal pad on said second printed circuit board.
Claim 2
Dependent Claim
127 words
An assembly, comprising: a first printed circuit board having a first opening and including a first heat-generating device; a second printed circuit board; a thermal pad on a surface of said second printed circuit board substantially aligned with said first opening in said first printed circuit board; a second heat-generating device mechanically and electrically coupled with said second printed circuit board, and thermally coupled with said thermal pad; and a heat sink having a first protrusion configured to extend through the first opening in said first printed circuit board, wherein said heat sink makes thermal contact with said first heat-generating device on said first printed circuit board, and wherein said heat sink first protrusion makes thermal contact with said thermal pad on said second printed circuit board.
Claim 3
Dependent Claim
14 words
The assembly of claim 1 , wherein said first heat-generating device is an ASIC.
Claim 4
Dependent Claim
14 words
The assembly of claim 1 , wherein said first heat-generating device is a microprocessor.
Claim 5
Dependent Claim
14 words
The assembly of claim 1 , wherein said first heat-generating device is a FET.
Claim 6
Dependent Claim
14 words
The assembly of claim 1 , wherein said second heat-generating device is an ASIC.
Claim 7
Dependent Claim
14 words
The assembly of claim 1 , wherein said second heat-generating device is a microprocessor.
Claim 8
Dependent Claim
14 words
The assembly of claim 1 , wherein said second heat-generating device is a FET.
Claim 9
Dependent Claim
21 words
The assembly of claim 1 , wherein said first printed circuit board including a first heat-generating device is a power module.
Claim 10
Dependent Claim
21 words
The assembly of claim 1 , wherein said second printed circuit board including a second heat-generating device is a power module.
Claim 11
Dependent Claim
20 words
The assembly of claim 1 , wherein said first printed circuit board is a voltage regulation module (VRM) circuit board.
Claim 12
Dependent Claim
20 words
The assembly of claim 1 , wherein said second printed circuit board is a voltage regulation module (VRM) circuit board.
Claim 13
Dependent Claim
26 words
The assembly of claim 1 , further comprising: an electrical connector configured to electrically couple said first printed circuit board to said second printed circuit board.
Claim 14
Dependent Claim
17 words
The assembly of claim 1 , wherein said first printed circuit board also has a second opening.
Claim 15
Dependent Claim
35 words
The assembly of claim 13 , further comprising: a third heat-generating device mechanically and electrically coupled with said second printed circuit board, and substantially aligned with said second opening in said first printed circuit board.
Claim 16
Dependent Claim
48 words
The assembly of claim 14 , wherein said heat sink also has a second protrusion configured to extend through the second opening in said first printed circuit board, wherein said heat sink second protrusion makes thermal contact with said third heat-generating device on said second printed circuit board.
Claim 17
Dependent Claim
14 words
The assembly of claim 15 , wherein said third heat-generating device is an ASIC.
Claim 18
Dependent Claim
14 words
The assembly of claim 15 , wherein said third heat-generating device is a microprocessor.
Claim 19
Dependent Claim
14 words
The assembly of claim 15 , wherein said third heat-generating device is a FET.
Claim 20
Dependent Claim
26 words
The assembly of claim 15 , further comprising: an electrical connector configured to electrically couple said first printed circuit board to said second printed circuit board.
Claim 21
Independent Claim
229 words
A method for the construction of an assembly, comprising the steps of: a) providing a first printed circuit board including a first heat-generating device and having a first opening; b) providing a second printed circuit board; c) creating a thermal pad on a surface of the second printed circuit board substantially aligned with the first opening in the first printed circuit board; d) mechanically and electrically coupling a second heat-generating device to the second printed circuit board; e) thermally coupling the second heat-generating device to the thermal pad; f) providing a heat sink having a first protrusion configured to extend through the first opening in the first printed circuit board and make thermal contact with the thermal pad on the second printed circuit board; g) mechanically coupling the first printed circuit board with the second printed circuit board such that the thermal pad on the second printed circuit board is substantially aligned under the first opening in the first printed circuit board; and h) mechanically coupling the heat sink to the first and second printed circuit boards such that the first protrusion of the heat sink extends through the first opening in the first printed circuit board and makes thermal contact with the thermal pad on the second printed circuit board, and the heat sink makes thermal contact with the first heat-generating device on the first printed circuit board.
Claim 22
Independent Claim
229 words
A method for the construction of an assembly, comprising the steps of: a) providing a first printed circuit board including a first heat-generating device and having a first opening; b) providing a second printed circuit board; c) creating a thermal pad on a surface of the second printed circuit board substantially aligned with the first opening in the first printed circuit board; d) mechanically and electrically coupling a second heat-generating device to the second printed circuit board; e) thermally coupling the second heat-generating device to the thermal pad; f) providing a heat sink having a first protrusion configured to extend through the first opening in the first printed circuit board and make thermal contact with the thermal pad on the second printed circuit board; g) mechanically coupling the first printed circuit board with the second printed circuit board such that the thermal pad on the second printed circuit board is substantially aligned under the first opening in the first printed circuit board; and h) mechanically coupling the heat sink to the first and second printed circuit boards such that the first protrusion of the heat sink extends through the first opening in the first printed circuit board and makes thermal contact with the thermal pad on the second printed circuit board, and the heat sink makes thermal contact with the first heat-generating device on the first printed circuit board.
Claim 23
Dependent Claim
14 words
The method of claim 20 , wherein the first heat-generating device is an ASIC.
Claim 24
Dependent Claim
14 words
The method of claim 20 , wherein the first heat-generating device is a microprocessor.
Claim 25
Dependent Claim
14 words
The method of claim 20 , wherein the first heat-generating device is a FET.
Claim 26
Dependent Claim
14 words
The method of claim 20 , wherein the second heat-generating device is an ASIC.
Claim 27
Dependent Claim
14 words
The method of claim 20 , wherein the second heat-generating device is a microprocessor.
Claim 28
Dependent Claim
14 words
The method of claim 20 , wherein the second heat-generating device is a FET.
Claim 29
Dependent Claim
21 words
The method of claim 20 , wherein the first printed circuit board including a first heat-generating device is a power module.
Claim 30
Dependent Claim
21 words
The method of claim 20 , wherein the second printed circuit board including a second heat-generating device is a power module.
Claim 31
Dependent Claim
20 words
The method of claim 20 , wherein the first printed circuit board is a voltage regulation module (VRM) circuit board.
Claim 32
Dependent Claim
20 words
The method of claim 20 , wherein the second printed circuit board is a voltage regulation module (VRM) circuit board.
Claim 33
Dependent Claim
29 words
The method of claim 20 , further comprising the step of: i) electrically coupling the first printed circuit board to the second printed circuit board through an electrical connector.
Claim 34
Dependent Claim
17 words
The method of claim 20 , wherein the first printed circuit board also has a second opening.
Claim 35
Dependent Claim
40 words
The method of claim 32 , further comprising the step of: i) mechanically and electrically coupling a third heat-generating device to the second printed circuit board in a location corresponding to the second opening in the first printed circuit board.
Claim 36
Dependent Claim
43 words
The method of claim 33 , wherein said heat sink also has a second protrusion configured to extend through the second opening in the first printed circuit board and make thermal contact with the third heat-generating device on the second printed circuit board.
Claim 37
Dependent Claim
14 words
The method of claim 34 , wherein the third heat-generating device is an ASIC.
Claim 38
Dependent Claim
14 words
The method of claim 34 , wherein the third heat-generating device is a microprocessor.
Claim 39
Dependent Claim
14 words
The method of claim 34 , wherein the third heat-generating device is a FET.
Claim 40
Dependent Claim
29 words
The method of claim 34 , further comprising the step of: i) electrically coupling the first printed circuit board to the second printed circuit board through an electrical connector.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-11-09 | 2008-05-10 | 2008-11-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-11-09 | 2012-05-10 | 2012-11-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-11-09 | 2016-05-10 | 2016-11-09 | $7700.00 | Window Closed / Lapsed |