Patent US6815729B1 successfully refreshed from Google Patents.
US6815729B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electro-optical apparatus
Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Filing: 2002-10-09
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Granted: 2004-11-09
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Expires: 2022-10-09
Abstract
Abstract An electro-optical device preferably includes a printed circuit board (PCB) having a cutout region or a rigid region. A leadframe having an electro-optical semiconductor device arranged thereon can be arranged in proximity to the cutout region of the PCB. Alternatively, the electro-optical device can be arranged on the rigid region of the PCB. A lens is preferably arranged over the electro-optical semiconductor device. A connector array can also be arranged on the PCB to communicate electrical signals with an external device. An interface circuit, such as a driver circuit or an amplifier circuit, can also be arranged in close proximity to the electro-optical semiconductor devices on the leadframe or the PCB.
Inventors
- 👤 Brenor Brophy
- 👤 Marc Hartranft
- 👤 Syed Tariq Shafaat
- 👤 Jeff Hall
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 09:08
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/02325; H01S5/40; H01S5/42; H01S5/423; H01S5/0235; H01S5/02355; H01S5/0237; H01S5/024; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
63 words
An electro-optical device comprising: a printed circuit board (PCB) having a device region and a connector region; an electro-optical semiconductor device arranged in the device region; a lens arranged over the electro-optical semiconductor device; and a connector array arranged in the connector region of the PCB, said connector array comprising an array of connectors configured to communicate electrical signals with an external device.
Claim 2
Dependent Claim
63 words
An electro-optical device comprising: a printed circuit board (PCB) having a device region and a connector region; an electro-optical semiconductor device arranged in the device region; a lens arranged over the electro-optical semiconductor device; and a connector array arranged in the connector region of the PCB, said connector array comprising an array of connectors configured to communicate electrical signals with an external device.
Claim 3
Dependent Claim
19 words
The device according to claim 1 , further comprising a heatsink arranged in thermal communication with the device region.
Claim 4
Dependent Claim
39 words
The device according to claim 1 , wherein the lens comprises a lens array, and wherein the sub-assembly further comprises an alignment mechanism for aligning the lens array over one or more active areas of the electro-optical semiconductor device.
Claim 5
Dependent Claim
52 words
The device according to claim 3 , wherein the device further comprises a rigid substrate arranged in the device region of the PCB; wherein the electro-optical semiconductor device is arranged on the rigid substrate; and wherein the alignment mechanism comprises matching alignment holes arranged in the rigid substrate and the lens array.
Claim 6
Dependent Claim
17 words
The device according to claim 3 , wherein the lens array comprises an over-molded lens array (OMLA).
Claim 7
Dependent Claim
37 words
The device according to claim 1 , wherein the PCB further comprises a cutout region arranged in the device region, wherein the rigid substrate comprises a leadframe arranged beneath the cutout region and bonded to the PCB.
Claim 8
Dependent Claim
38 words
The device according to claim 6 , wherein the lens comprises lens elements formed in an over-molded lens array (OMLA), said OMLA being formed on the leadframe over one or more active areas of the electro-optical semiconductor device.
Claim 9
Dependent Claim
27 words
The device according to claim 1 , wherein the PCB is a rigid flex PCB and wherein the device region comprises a rigid portion of the PCB.
Claim 10
Dependent Claim
31 words
The device according to claim 1 , said device further comprising an interface semiconductor device arranged in electrical communication with the electro-optical semiconductor device and in electrical communication with the PCB.
Claim 11
Dependent Claim
40 words
An electro-optical apparatus comprising: a molded lens array; a leadframe comprising a plurality of alignment marks; and an electro-optical semiconductor device mounted on the leadframe, wherein the electro-optical semiconductor device is properly positioned on the leadframe using the alignment marks.
Claim 12
Dependent Claim
40 words
An electro-optical apparatus comprising: a molded lens array; a leadframe comprising a plurality of alignment marks; and an electro-optical semiconductor device mounted on the leadframe, wherein the electro-optical semiconductor device is properly positioned on the leadframe using the alignment marks.
Claim 13
Dependent Claim
37 words
The apparatus according to claim 10 , further comprising a flexible printed circuit board having a cutout region, wherein the leadframe is a rigid leadframe arranged in proximity to the cutout region of the printed circuit board.
Claim 14
Dependent Claim
19 words
The apparatus according to claim 11 , further comprising a connector array arranged on the flexible printed circuit board.
Claim 15
Dependent Claim
42 words
The apparatus according to claim 10 , wherein the molded lens array comprises a plurality of datum holes configured to match datum holes formed in the leadframe, and wherein the lens array is aligned with the leadframe using the matching datum holes.
Claim 16
Dependent Claim
23 words
The apparatus according to claim 13 , wherein the datum holes and alignment marks are positioned with an accuracy of approximately ±5 μm.
Claim 17
Dependent Claim
52 words
An electro-optical apparatus, comprising: a flex printed circuit board (PCB) having a cutout region; a leadframe arranged in proximity with the cutout region of the PCB; an electro-optical semiconductor device mounted on a first side of the leadframe; and a heatsink arranged in thermal communication with a second side of the leadframe.
Claim 18
Dependent Claim
52 words
An electro-optical apparatus, comprising: a flex printed circuit board (PCB) having a cutout region; a leadframe arranged in proximity with the cutout region of the PCB; an electro-optical semiconductor device mounted on a first side of the leadframe; and a heatsink arranged in thermal communication with a second side of the leadframe.
Claim 19
Dependent Claim
27 words
The apparatus according to claim 15 , wherein a space between the second side of the leadframe and the heatsink is filled with a thermally conductive material.
Claim 20
Dependent Claim
25 words
The apparatus according to claim 15 , wherein the heatsink is further configured to thermally communicate with an interface semiconductor device mounted on the leadframe.
Claim 21
Dependent Claim
22 words
The apparatus according to claim 15 , further comprising an interface semiconductor device flip-chip mounted on a second side of the PCB.
Claim 22
Dependent Claim
24 words
The apparatus according to claim 18 , further comprising a thermally conductive material filling a gap between the interface semiconductor device and the heatsink.
Claim 23
Dependent Claim
37 words
The apparatus according to claim 15 , further comprising a lens array arranged on the first side of the leadframe, said lens array comprising a lens element aligned over an active area of the electro-optical semiconductor device.
References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 2007-11-09 | 2008-05-10 | 2008-11-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-11-09 | 2012-05-10 | 2012-11-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-11-09 | 2016-05-10 | 2016-11-09 | $7700.00 | Window Closed / Lapsed |