Multi-channel, low input capacitance signal probe and probe head

Claim 2

A multi-channel, low input capacitance signal probe head comprising: at least a first substrate having a plurality of input signal pads formed thereon with the input signal pads being exposed on one end of the substrate; a housing having at least a first open end and a substrate support member that receives the substrate such that the input signal pads are exposed at the open end of the housing; and a removable signal contact holder mounted to the housing and supporting electrically conductive elastomer signal contacts with the holder disposed over the open end of the housing such that the elastomer signal contacts engage the input signal pads.

Claim 3

The multi-channel, low input capacitance signal probe head as recited in claim 1 further comprising a second substrate having a plurality of input signal pads formed thereon with the input signal pads of the second substrate being exposed on one end of the second substrate with the substrate support member receiving the second substrate such that the support member is disposed between the first and second substrates and the input signal pads on the second substrate are exposed at the open end of the housing.

Claim 4

The multi-channel, low input capacitance signal probe head as recited in claim 1 wherein the housing further comprises opposing sidewalls walls separated by opposing front and back walls with each sidewall having a latching recess formed therein adjacent to the open end of the housing, and first bores formed through the housing on either side of the first substrate that are perpendicular to the open end of the housing.

Claim 5

The multi-channel, low input capacitance signal probe head as recited in claim 3 wherein the removable signal contact holder further comprises a planar frame member and latching members extending perpendicular from either end of the frame member with at least a first slot formed in the frame member aligned with the input signal pads on the first substrate for receiving the electrically conductive elastomer signal contacts.

Claim 6

The multi-channel, low input capacitance signal probe head as recited in claim 4 wherein the latching members further comprise inwardly facing latching ramps with each latching ramp having a terminating ledge that engage the latching recesses in the housing sidewalls.

Claim 7

The multi-channel, low input capacitance signal probe head as recited in claim 4 further comprising at least a first alignment rib formed parallel to the slot on the planar frame that engages a corresponding recess formed in the housing.

Claim 8

The multi-channel, low input capacitance signal probe head as recited in claim 4 wherein the frame member further comprises apertures formed on either side of the slot and aligned with the first bores in the housing.

Claim 9

The multi-channel, low input capacitance signal probe head as recited in claim 7 further comprising a probe head retention member for securing the multi-channel signal probe head to a device under test.

Claim 10

The multi-channel, low input capacitance signal probe head as recited in claim 8 wherein the device under test is a circuit board having an array of signal contact pads on at least one surface thereof corresponding to the electrically conductive elastomer signal contacts and through holes formed on either side of the array of signal contact pads aligned with the first bores in the housing, the probe head retention member further comprising attachment members extending through the first bores in the housing and threadably mating with threaded apertures disposed in a retention block positioned on the opposite side of the circuit board from the contact pads that are aligned with the through holes in the circuit board to secure the signal probe head to the device under test.

Claim 11

The multi-channel, low input capacitance signal probe head as recited in claim 9 wherein the attachment members comprise threaded screws.

Claim 12

The multi-channel, low input capacitance signal probe head as recited in claim 9 wherein the retention block further comprises alignment flanges formed adjacent to the threaded apertures having an exterior surface closely mating with and extending through the through holes in the circuit board.

Claim 13

The multi-channel, low input capacitance signal probe head as recited in claim 11 wherein the housing further comprises second bores extending from the open end of the housing and coaxial with the first bores, each second bore having a diameter larger than the first bore and sized to closely receive one of the alignment flanges extending above the circuit board.

Claim 14

The multi-channel, low input capacitance signal probe head as recited in claim 11 wherein the retention block alignment flanges include latching members extending outward from the retention block alignment flanges to engage the top surface of the circuit board.

Claim 15

The multi-channel, low input capacitance signal probe head as recited in claim 13 wherein the housing further comprises notches formed adjacent to the open end of the housing that closely receive the latching members of the retention block alignment flanges.

Claim 16

The multi-channel, low input capacitance signal probe head as recited in claim 9 wherein the retention block further comprises an elongated rectangular housing having exterior walls forming an interior chamber that receives a stiffener block having the threaded apertures formed therein.

Claim 17

The multi-channel, low input capacitance signal probe head as recited in claim 15 wherein the rectangular housing further comprises alignment flanges extending from one of the exterior walls adjacent to the threaded apertures and having an exterior surface closely mating with and extending through the through holes in the circuit board.

Claim 18

The multi-channel, low input capacitance signal probe head as recited in claim 16 wherein the housing further comprises second bores extending from the open end of the housing and coaxial with the first bores, each second bore having a diameter larger than the first bore and sized to closely receiving one of the alignment flanges extending above the circuit board.

Claim 19

The multi-channel, low input capacitance signal probe head as recited in claim 16 wherein the rectangular housing alignment flanges include latching members extending outward from the rectangular housing alignment flanges to engage the top surface of the circuit board.

Claim 20

The multi-channel, low input capacitance signal probe head as recited in claim 18 wherein the housing further comprises notches formed adjacent to the open end of the housing that closely receive the latching members of the rectangular housing alignment flanges.

Claim 21

The multi-channel, low input capacitance signal probe head as recited in claim 3 wherein the housing further comprises: a substrate carrier forming the substrate support member that receives the first substrate with the input signal pads on the first substrate being exposed at one end of the carrier; and a substrate carrier cover having exterior walls forming an interior chamber that receives the substrate carrier and the first substrate with the exterior walls forming the opposing sidewalls and front and back walls of the housing.

Claim 22

The multi-channel, low input capacitance signal probe head as recited in claim 20 wherein the substrate carrier further comprises opposing stiles and rails with the stiles and at least one rail having recesses formed on one surface thereof for receiving the first substrate with the end of the first substrate having the signal pads extending to the end of the rail having the recess.

Claim 23

The multi-channel, low input capacitance signal probe head as recited in claim 21 wherein the stiles include the housing bores.

Claim 24

The multi-channel, low input capacitance signal probe head as recited in claim 21 further comprising a second substrate having a plurality of input signal pads thereon with the input signal pads of the second substrate being exposed on one end of the second substrate with the stiles and the one rail having recesses formed on the reverse side thereof for receiving the second substrate with the end of the second substrate having the signal pads extending to the end of the rail having the recess.

Claim 25

A multi-channel, low input capacitance signal probe head system mountable on a device under test having an array of signal contact pads on at least one surface of a circuit board and through holes formed on either side of the array of signal contact pads comprising: at least a first substrate having a plurality of input signal pads formed thereon with the input signal pads being exposed on one end of the substrate; a housing having at least a first open end and a substrate support member that receives the substrate such that the input signal pads are exposed at the open end of the housing, and first bores formed through the housing on either side of the substrate that are perpendicular to the open end of the housing; a probe head retention member having attachment members extending through the first bores in the housing and threadably mating with threaded apertures mounted to the opposite side of the circuit board from the contact pads that are aligned with the through holes in the circuit board to secure the signal probe head to a device under test; and a removable signal contact holder mounted to the housing and supporting electrically conductive elastomer signal contacts with the holder having apertures formed on either side of the elastomer signal contacts and aligned with the first bores in the housing, the holder disposed over the open end the housing such that the elastomer signal contacts engage the input signal pads.

Claim 26

A multi-channel, low input capacitance signal probe head system mountable on a device under test having an array of signal contact pads on at least one surface of a circuit board and through holes formed on either side of the array of signal contact pads comprising: at least a first substrate having a plurality of input signal pads formed thereon with the input signal pads being exposed on one end of the substrate; a housing having at least a first open end and a substrate support member that receives the substrate such that the input signal pads are exposed at the open end of the housing, and first bores formed through the housing on either side of the substrate that are perpendicular to the open end of the housing; a probe head retention member having attachment members extending through the first bores in the housing and threadably mating with threaded apertures mounted to the opposite side of the circuit board from the contact pads that are aligned with the through holes in the circuit board to secure the signal probe head to a device under test; and a removable signal contact holder mounted to the housing and supporting electrically conductive elastomer signal contacts with the holder having apertures formed on either side of the elastomer signal contacts and aligned with the first bores in the housing, the holder disposed over the open end the housing such that the elastomer signal contacts engage the input signal pads.

Claim 27

The multi-channel, low input capacitance signal probe head system as recited in claim 24 further comprising a second substrate having a plurality of input signal pads formed thereon with the input signal pads of the second substrate being exposed on one end of the second substrate with the substrate support member receiving the second substrate such that the support member is disposed between the first and second substrates and the input signal pads on the second substrate are exposed at the open end of the housing.

Claim 28

The multi-channel, low input capacitance signal probe head system as recited in claim 24 wherein the housing further comprises opposing sidewalls separated by opposing front and back walls with each sidewall having a latching recess formed therein adjacent to the open end of the housing.

Claim 29

The multi-channel, low input capacitance signal probe head system as recited in claim 26 wherein the removable signal contact holder further comprises a planar frame member and latching members extending perpendicular from either end of the frame member with at least a first slot formed in the frame member aligned with the input signal pads on the first substrate that receive the electrically conductive elastomer signal contacts and the latching members having inwardly facing latching ramps with each latching ramp having a terminating ledge that engage the latching recesses in the housing sidewalls.

Claim 30

The multi-channel, low input capacitance signal probe head system as recited in claim 27 further comprising at least a first alignment rib formed parallel to the slot on the planar frame that engages a corresponding recess formed in the housing.

Claim 31

The multi-channel, low input capacitance signal probe head system as recited in claim 26 wherein the housing further comprises: a substrate carrier forming the substrate support member that receives the first substrate with the input signal pads on the first substrate being exposed at one end of the carrier; and a substrate carrier cover having exterior walls forming an interior chamber that receives the substrate carrier and the first substrate with the exterior walls forming the opposing sidewalls and front and back walls of the housing.

Claim 32

The multi-channel, low input capacitance signal probe head system as recited in claim 29 wherein the substrate carrier further comprises opposing stiles and rails with the stiles and at least one rail having recesses formed on one surface thereof for receiving the first substrate with the end of the first substrate having the signal pads extending to the end of the rail having the recess.

Claim 33

The multi-channel, low input capacitance signal probe head system as recited in claim 30 wherein the stiles include the housing bores.

Claim 34

The multi-channel, low input capacitance signal probe head system as recited in claim 30 further comprising a second substrate having a plurality of input signal pads thereon with the input signal pads of the second substrate being exposed on one end of the second substrate with the stiles and the one rail having recesses formed on the reverse side thereof for receiving the second substrate with the end of the second substrate having the input signal pads extending to the end of the rail having the recess.

Claim 35

The multi-channel, low input capacitance signal probe head system as recited in claim 24 wherein the probe head retention member further comprises a retention block positioned on the opposite side of the circuit board from the contact pads having the threaded apertures formed therein that are aligned with the through holes to receive the attachment members.

Claim 36

The multi-channel, low input capacitance signal probe head system as recited in claim 33 wherein the attachment members comprise threaded screws.

Claim 37

The multi-channel, low input capacitance signal probe head system as recited in claim 33 wherein the retention block further comprises alignment flanges formed adjacent to the threaded apertures having an exterior surface closely mating with and extending through the through holes in the circuit board with the retention block alignment flanges having latching members extending outward from the retention block alignment flanges to engage the top surface of the circuit board.

Claim 38

The multi-channel, low input capacitance signal probe head system as recited in claim 35 wherein the housing further comprises second bores extending from the open end of the housing and coaxial with the first bores, each second bore having a diameter larger than the first bore and sized to closely receive one of the retention block alignment flanges extending above the circuit board and notches formed adjacent to the open end of the housing that closely receive the latching members of the retention block alignment flanges.

Claim 39

The multi-channel, low input capacitance signal probe head system as recited in claim 33 wherein the retention block further comprises an elongated rectangular housing having exterior walls forming an interior chamber that receives a stiffener block having the threaded apertures formed therein.

Claim 40

The multi-channel, low input capacitance signal probe head system as recited in claim 37 wherein the rectangular housing further comprises alignment flanges extending from one of the exterior walls adjacent to the threaded apertures and having an exterior surface closely mating with and extending through the through holes in the circuit board with the rectangular housing alignment flanges having latching members extending outward from the rectangular housing alignment flanges to engage the top surface of the circuit board.

Claim 41

The multi-channel, low input capacitance signal probe head system as recited in claim 38 wherein the housing further comprises second bores extending from the open end of the housing and coaxial with the first bores, each second bore having a diameter larger than the first bore and sized to closely receive one of the rectangular housing alignment flanges extending above the circuit board and notches formed adjacent to the open end of the housing that closely receive the latching members of the rectangular housing alignment flanges.

Claim 42

A multi-channel, low input capacitance measurement probe for coupling a device under test having an array of signal contact pads on at least one surface of a circuit board and through holes formed on either side of the array of signal contact pads to a measurement instrument comprising: at least a first substrate having a plurality of input signal circuits and associated input signal pads formed thereon with the input signal pads being exposed on one end of the first substrate and the input signal circuits being adjacent to and electrically coupled to the input signal pads; a housing having a substrate carrier and substrate carrier cover with the substrate carrier receiving the first substrate such that the input signal pads on the first substrate are exposed at one end of the substrate carrier and the substrate carrier cover having opposing sidewalls walls separated by opposing front and back walls forming an open ended chamber that receives the substrate carrier and the first substrate such that the input signal pads are exposed at one of the open ends of the substrate carrier cover with each sidewall having a latching recess formed therein adjacent to the open end of the housing and first bores formed through the substrate carrier on either side of the first substrate that are perpendicular to the open end of the housing and aligned with the through holes in the circuit board; a probe head retention member having attachment members extending through the first bores in the substrate carrier and threadably mating with threaded apertures mounted to the opposite side of the circuit board from the contact pads and over the through holes to secure the measurement probe to a device under test; a removable signal contact holder having a planar frame member and latching members extending perpendicular from either end of the frame member with at least a first slot formed in the frame member aligned with the input signal pads on the first substrate that receive electrically conductive elastomer signal contacts and the latching members having inwardly facing latching ramps with each latching ramp having a terminating ledge that engage the latching recesses in the housing sidewalls to mount the signal contact holder over the open end the housing such that the elastomer signal contacts engage the input signal pads with apertures formed on either side of the electrically conductive elastomer signal contacts that are aligned with the bores in the substrate carrier and the through holes on the circuit board; and a multiple signal lines cable having the signal lines at one end electrically coupled to outputs of the input signal circuits and the signal lines at the other end electrically coupled to an input connector for coupling to the measurement instrument.

Claim 43

A multi-channel, low input capacitance measurement probe for coupling a device under test having an array of signal contact pads on at least one surface of a circuit board and through holes formed on either side of the array of signal contact pads to a measurement instrument comprising: at least a first substrate having a plurality of input signal circuits and associated input signal pads formed thereon with the input signal pads being exposed on one end of the first substrate and the input signal circuits being adjacent to and electrically coupled to the input signal pads; a housing having a substrate carrier and substrate carrier cover with the substrate carrier receiving the first substrate such that the input signal pads on the first substrate are exposed at one end of the substrate carrier and the substrate carrier cover having opposing sidewalls walls separated by opposing front and back walls forming an open ended chamber that receives the substrate carrier and the first substrate such that the input signal pads are exposed at one of the open ends of the substrate carrier cover with each sidewall having a latching recess formed therein adjacent to the open end of the housing and first bores formed through the substrate carrier on either side of the first substrate that are perpendicular to the open end of the housing and aligned with the through holes in the circuit board; a probe head retention member having attachment members extending through the first bores in the substrate carrier and threadably mating with threaded apertures mounted to the opposite side of the circuit board from the contact pads and over the through holes to secure the measurement probe to a device under test; a removable signal contact holder having a planar frame member and latching members extending perpendicular from either end of the frame member with at least a first slot formed in the frame member aligned with the input signal pads on the first substrate that receive electrically conductive elastomer signal contacts and the latching members having inwardly facing latching ramps with each latching ramp having a terminating ledge that engage the latching recesses in the housing sidewalls to mount the signal contact holder over the open end the housing such that the elastomer signal contacts engage the input signal pads with apertures formed on either side of the electrically conductive elastomer signal contacts that are aligned with the bores in the substrate carrier and the through holes on the circuit board; and a multiple signal lines cable having the signal lines at one end electrically coupled to outputs of the input signal circuits and the signal lines at the other end electrically coupled to an input connector for coupling to the measurement instrument.

Claim 44

A multi-channel, low input capacitance measurement probe as recited in claim 40 further comprising at least a first alignment rib formed parallel to the slot on the planar frame that engages a corresponding recess formed in the substrate carrier.

Claim 45

The multi-channel, low input capacitance measurement probe as recited in claim 40 wherein the probe head retention member further comprises a retention block positioned on the opposite side of the circuit board from the contact pads having the threaded apertures formed therein that are aligned with the through holes to receive the attachment members.

Claim 46

The multi-channel, low input capacitance measurement probe as recited in claim 42 wherein the attachment members comprise threaded screws.

Claim 47

The multi-channel, low input capacitance measurement probe as recited in claim 42 wherein the retention block further comprises alignment flanges formed adjacent to the threaded apertures having an exterior surface closely mating with and extending through the through holes in the circuit board with the retention block alignment flanges having latching members extending outward from the retention block alignment flanges to engage the top surface of the circuit board.

Claim 48

The multi-channel, low input capacitance measurement probe as recited in claim 44 wherein the housing further comprises second bores extending from the open end of the housing and coaxial with the first bores, each second bore having a diameter larger than the first bore and sized to closely receive one of the retention block alignment flanges extending above the circuit board and notches formed adjacent to the open end of the housing that closely receive the latching members of the retention block alignment flanges.

Claim 49

The multi-channel, low input capacitance measurement probe as recited in claim 42 wherein the retention block further comprises an elongated rectangular housing having exterior walls forming an interior chamber that receives a stiffener block having the threaded apertures formed therein.

Claim 50

The multi-channel, low input capacitance measurement probe as recited in claim 46 wherein the rectangular housing further comprises alignment flanges extending from one of the exterior walls adjacent to the threaded apertures and having an exterior surface closely mating with and extending through the through holes in the circuit board with the rectangular housing alignment flanges having latching members extending outward from the rectangular housing alignment flanges to engage the top surface of the circuit board.

Claim 51

The multi-channel, low input capacitance measurement probe as recited in claim 47 wherein the housing further comprises second bores extending from the open end of the housing and coaxial with the first bores, each second bore having a diameter larger than the first bore and sized to closely receiving one of the rectangular housing alignment flanges extending above the circuit board and notches formed adjacent to the open end of the housing that closely receive the latching members of the rectangular housing alignment flanges.

Claim 52

The multi-channel, low input capacitance measurement probe as recited in claim 40 wherein the substrate carrier further comprises opposing stiles and rails with the stiles and at least one rail having recesses formed on one surface thereof for receiving the first substrate with the end of the first substrate having the signal pads extending to the end of the rail having the recess.

Claim 53

The multi-channel, low input capacitance measurement probe as recited in claim 49 wherein the stiles include the substrate carrier bores.

Claim 54

The multi-channel, low input capacitance measurement probe as recited in claim 49 further comprising a second substrate having a plurality of input signal circuits and associated input signal pads thereon with the input signal pads of the second substrate being exposed on one end of the second substrate and the input signal circuits of the second substrate being adjacent to and electrically coupled to the input signal pads with the stiles and the one rail having recesses formed on the reverse side thereof for receiving the second substrate with the end of the second substrate having the input signal pads extending to the end of the rail having the recess.

Claim 55

The multi-channel, low input capacitance measurement probe as recited in claim 40 further comprising a second substrate having a plurality of input signal circuits and associated input signal pads formed thereon with the input signal pads of the second substrate being exposed on one end of the second substrate and the input signal circuits of the second substrate being adjacent to and electrically coupled to the input signal pads with the substrate support member receiving the second substrate such that the support member is disposed between the first and second substrates and the input signal pads on the second substrate are exposed at the open end of the housing.