US6007357A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip socket assembly and chip file assembly for semiconductor chips
Assignee: Rambus Inc
•
Filing: 1997-07-03
•
Granted: 1999-12-28
•
Expires: 2017-07-03
Abstract
Abstract A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.
Inventors
- 👤 Donald V. Perino
- 👤 Wayne S. Richardson
- 👤 John B. Dillon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 17:32
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/14; H05K7/1422; H05K7/1427; H05K7/1429; H05K7/1431; H01; H01R; H01R12/00; H01R12/70; H01R12/7005; H05K3/00; H05K3/30; H05K3/32; H05K3/325
Claims Analysis
Total Claims: 59
Claim 1
Independent Claim
53 words
A chip package comprising: packaging material; a lead extending from one side of the packaging material, wherein the lead has a substantially C-shaped form; and a flexible insert residing between the C-shaped lead and the one side of the packaging material, wherein the flexible insert supplies spring force when the lead is compressed.
Claim 2
Dependent Claim
53 words
A chip package comprising: packaging material; a lead extending from one side of the packaging material, wherein the lead has a substantially C-shaped form; and a flexible insert residing between the C-shaped lead and the one side of the packaging material, wherein the flexible insert supplies spring force when the lead is compressed.
Claim 3
Dependent Claim
70 words
A chip assembly comprising: the chip package of claim 1; a base having a top, a bottom, and a connector, the base defining a slot for receiving the chip package and for guiding the chip package to the bottom of the base; and a clip configured to mate with the connector of the base for retaining the chip package in the base when mating with the connector of the base.
Claim 4
Dependent Claim
17 words
The chip socket assembly of claim 2, wherein the chip package is a surface vertical package (SVP).
Claim 5
Dependent Claim
32 words
The chip socket assembly of claim 1, wherein the connector of the base includes a protuberance and wherein the clip includes an opening configured to mate with the protuberance of the base.
Claim 6
Dependent Claim
32 words
The chip socket assembly of claim 2, wherein the connector of the base includes a socket and wherein the clip includes a connector configured to mate with the socket of the base.
Claim 7
Dependent Claim
23 words
The chip socket assembly of claim 2, wherein the chip package further includes a support pin extending from the edge of the chip.
Claim 8
Dependent Claim
37 words
The chip socket assembly of claim 6, wherein the base defines the slot with a guide for guiding the support pin of the chip package when the chip package is placed in the slot of the base.
Claim 9
Dependent Claim
61 words
A system comprising: (a) a circuit board having a surface and having a bus on the surface; and (b) the chip assembly of claim 1 wherein the base is coupled to the surface of the circuit board over the bus, and wherein the slot of the base guides the chip package to the bottom of the base and over the bus.
Claim 10
Dependent Claim
16 words
The chip package of claim 1, wherein the flexible insert is formed from a compliant material.
Claim 11
Dependent Claim
13 words
The chip package of claim 9, wherein the compliant material comprises an elastomer.
Claim 12
Dependent Claim
49 words
An assembly comprising: (a) the chip package of claim 1 (b) a base for receiving the chip package; and (c) a mechanism for securing the chip package in the base such that the lead of the chip package is compressed when the chip package is secured in the base.
Claim 13
Dependent Claim
11 words
The assembly of claim 11, wherein the mechanism is a clip.
Claim 14
Dependent Claim
19 words
The chip package of claim 1, further comprising a cam follower extending from an edge of the packaging material.
Claim 15
Dependent Claim
86 words
An assembly comprising: (a) the chip package of claim 13 (b) a circuit board having a first conductive region; and (c) a base coupled to the circuit board, wherein the base has a slot for receiving the cam follower and for securing the chip package, wherein the slot guides the cam follower in both a downward and a lateral direction, wherein the lead of the chip package is electrically coupled to the first conductive region of the circuit board when the base secures the chip package.
Claim 16
Dependent Claim
45 words
The assembly of claim 14, wherein the lead of the chip package physically contacts the first conductive region of the circuit board, wherein when the slot guides the cam follower in the lateral direction, the lead wipes the first conductive surface of the circuit board.
Claim 17
Dependent Claim
47 words
The assembly of claim 14, further comprising a sliding member in a slidable engagement with respect to the base, wherein the sliding member includes a slot for receiving the cam follower of the chip package and for guiding the cam follower into the slot of the base.
Claim 18
Dependent Claim
16 words
The chip package of claim 1, wherein the chip package is a surface vertical package (SVP).
Claim 19
Dependent Claim
19 words
The chip package of claim 1, further comprising a support pin extending from an edge of the packaging material.
Claim 20
Dependent Claim
12 words
The chip package of claim 18, wherein the support pin is bent.
Claim 21
Dependent Claim
78 words
An assembly comprising: the chip package of claim 1; a base having a top and a bottom, the base defining a slot for receiving the chip package at the top of the base and for guiding the chip package to the bottom of the base; the base having a clip portion configured to mate with the chip package for retaining the chip package in the base when the chip package is placed in the slot of the base.
Claim 22
Dependent Claim
33 words
The assembly of claim 20, wherein the clip portion of the base includes a socket and wherein the chip package includes a connector configured to mate with the socket of the clip portion.
Claim 23
Dependent Claim
28 words
The assembly of claim 20, wherein the chip package includes a support pin extending from the edge of the chip package and wherein the support pin is bent.
Claim 24
Dependent Claim
35 words
The assembly of claim 22, wherein the base defines the slot with a guide for guiding the support pin of the chip package when the chip package is placed in the slot of the base.
Claim 25
Dependent Claim
18 words
The chip package of claim 1, further comprising a clip connected to a side of the chip package.
Claim 26
Dependent Claim
73 words
An assembly comprising: the chip package of claim 24; a circuit board having a first conductive region; and a base coupled to the circuit board, wherein the base secures the chip package by having a side of the base engage the clip of the chip package wherein the lead of the vertical chip package is electrically coupled to the first conductive region of the circuit board when the base secures the chip package.
Claim 27
Dependent Claim
24 words
The assembly of claim 25, wherein the clip of the chip package is flexible and wherein the side of the base is substantially rigid.
Claim 28
Dependent Claim
24 words
The assembly of claim 25, wherein the clip of the chip package is substantially rigid and wherein the side of the base is flexible.
Claim 29
Dependent Claim
30 words
The assembly of claim 25, further comprising an electrical signal line that is attached to the chip package and not connected to the first conductive region of the circuit board.
Claim 30
Dependent Claim
19 words
The assembly of claim 28, wherein the electrical signal line is attached to a top of the chip package.
Claim 31
Dependent Claim
20 words
The assembly of claim 25, wherein the lead is directly connected to the first conductive region of the circuit board.
Claim 32
Dependent Claim
16 words
The chip package of claim 1, wherein the lead is comprised of a flexible metallic material.
Claim 33
Dependent Claim
12 words
The chip package of claim 31, wherein the metallic material is beryllium-copper.
Claim 34
Dependent Claim
23 words
The chip package of claim 1, wherein the packaging material is a flexible material that supplies spring force when the lead is compressed.
Claim 35
Dependent Claim
13 words
The chip package of claim 33, wherein the flexible material is silicone rubber.
Claim 36
Dependent Claim
26 words
The chip package of claim 1, wherein the flexible insert is compressed against the chip package to supply the spring force when the lead is compressed.
Claim 37
Dependent Claim
29 words
The chip package of claim 1, wherein the packaging material has a bottom-facing housing that extends laterally from the packaging material, the bottom-facing housing having a pocket formed therein.
Claim 38
Dependent Claim
21 words
The chip package of claim 36, wherein an end of the lead resides within the pocket when the lead is compressed.
Claim 39
Dependent Claim
28 words
The chip package of claim 1, wherein the packaging material has first and second integral clips for engaging the packaging material with a socket portion of a base.
Claim 40
Dependent Claim
28 words
The chip package of claim 1, wherein the packaging material has first and second protruding ledges for engaging the packaging material with a socket portion of a base.
Claim 41
Dependent Claim
22 words
The chip package of claim 1, wherein the packaging material has a cam follower for engaging the packaging material with a base.
Claim 42
Dependent Claim
131 words
An assembly comprising: (a) a vertical chip package having an integrated circuit embedded therein, the vertical chip package including a first integral clip and a second integral clip, said clips being directly attached to the vertical chip package; (b) a circuit board having a first conductive region; and (c) a base coupled to the circuit board, wherein the base secures the vertical chip package by having a first side of the base latched to the first clip of the vertical chip package and by having a second side of the base latched to engage the second clip of the vertical chip package, wherein a bottom lead of the vertical chip package is electrically coupled to the first conductive region of the circuit board when the base secures the vertical chip package.
Claim 43
Dependent Claim
131 words
An assembly comprising: (a) a vertical chip package having an integrated circuit embedded therein, the vertical chip package including a first integral clip and a second integral clip, said clips being directly attached to the vertical chip package; (b) a circuit board having a first conductive region; and (c) a base coupled to the circuit board, wherein the base secures the vertical chip package by having a first side of the base latched to the first clip of the vertical chip package and by having a second side of the base latched to engage the second clip of the vertical chip package, wherein a bottom lead of the vertical chip package is electrically coupled to the first conductive region of the circuit board when the base secures the vertical chip package.
Claim 44
Dependent Claim
31 words
The assembly of claim 41, wherein the first and second clips of the vertical chip package are flexible and wherein the first and second sides of the base are substantially rigid.
Claim 45
Dependent Claim
31 words
The assembly of claim 41, wherein the first and second clips of the vertical chip package are substantially rigid and wherein the first and second sides of the base are flexible.
Claim 46
Dependent Claim
31 words
The assembly of claim 43, further comprising an electrical signal line that is attached to the vertical chip package and not connected to the first conductive region of the circuit board.
Claim 47
Dependent Claim
20 words
The assembly of claim 44, wherein the electrical signal line is attached to a top of the vertical chip package.
Claim 48
Dependent Claim
57 words
The assembly of claim 41, further comprising an elastomeric connector sheet physically residing between the bottom lead of the vertical chip package and the first conductive region of the circuit board, wherein the elastomeric connector sheet permits electrical coupling between the bottom lead of the vertical chip package and the first conductive region of the circuit board.
Claim 49
Dependent Claim
50 words
The assembly of claim 34, wherein the vertical chip package has a bottom-facing housing that extends laterally therefrom, the bottom-facing housing having a pocket formed therein; and wherein the lead has a substantially C-shaped form, wherein an end of the lead resides within the pocket when the lead is compressed.
Claim 50
Dependent Claim
24 words
The assembly of claim 47, wherein the lead is comprised of a flexible metallic material that supplies spring force when the lead is compressed.
Claim 51
Dependent Claim
11 words
The assembly of claim 48, wherein the metallic material is beryllium-copper.
Claim 52
Dependent Claim
22 words
The assembly of claim 47, wherein the packaging material is a flexible material that supplies spring force when the lead is compressed.
Claim 53
Dependent Claim
12 words
The assembly of claim 50, wherein the flexible material is silicone rubber.
Claim 54
Dependent Claim
23 words
The assembly of claim 47, wherein the vertical chip package includes a cam follower for engaging the vertical chip package with the base.
Claim 55
Dependent Claim
17 words
The assembly of claim 34, wherein the lead provides spring force when contacting the first conductive region.
Claim 56
Dependent Claim
80 words
A chip package comprising: packaging material for housing circuitry therein; a substantially C-shaped lead extending from one side of the packaging material, the lead for contacting a substantially flat conductive surface to make a separable connection therewith when a securing force is applied to the packaging material; and an elastomeric insert that resides between one side of the packaging material and the lead, and wherein the elastomeric insert provides spring force when the lead contacts the substantially flat conductive surface.
Claim 57
Dependent Claim
80 words
A chip package comprising: packaging material for housing circuitry therein; a substantially C-shaped lead extending from one side of the packaging material, the lead for contacting a substantially flat conductive surface to make a separable connection therewith when a securing force is applied to the packaging material; and an elastomeric insert that resides between one side of the packaging material and the lead, and wherein the elastomeric insert provides spring force when the lead contacts the substantially flat conductive surface.
Claim 58
Dependent Claim
96 words
An assembly comprising: a chip package with: a substantially C-shaped lead extending from one side of the chip package; and an elastomeric insert that resides between one side of the packaging material and the lead; a circuit board having a conductive surface; and a base coupled to the circuit board, wherein the base secures the chip package such that the lead contacts the conductive surface to make a separable connection therewith when a securing force is applied to the packaging material, and wherein the elastomeric insert provides spring force when the lead contacts the conductive surface.
Claim 59
Dependent Claim
96 words
An assembly comprising: a chip package with: a substantially C-shaped lead extending from one side of the chip package; and an elastomeric insert that resides between one side of the packaging material and the lead; a circuit board having a conductive surface; and a base coupled to the circuit board, wherein the base secures the chip package such that the lead contacts the conductive surface to make a separable connection therewith when a securing force is applied to the packaging material, and wherein the elastomeric insert provides spring force when the lead contacts the conductive surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-27 | 2003-06-28 | 2003-12-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-27 | 2007-06-28 | 2007-12-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-27 | 2011-06-28 | 2011-12-28 | $7700.00 | Window Closed / Lapsed |