Method and magazine device for testing semiconductor devices

Claim 1

A method for testing a plurality of semiconductor devices on a programmable testing device having at least one testing location with a plurality of first electrical contact devices defining a testing location interface, the method which comprises: providing a plurality of magazine devices each having a magazine shaft, a plurality of second electrical contact devices defining a first magazine interface, forming a counterpart to the testing location interface of the testing device, and each having a plurality of second magazine interfaces, formed by third electrical contact devices, for contacting a respective semiconductor device to be tested; thereby providing a given magazine type for similar types of semiconductor devices enabled for testing with substantially a same set of testing signals and test patterns independently of one of a terminal assignment and a type of package thereof; thereby providing each magazine type, respectively provided for mutually different semiconductor devices, with an identical first magazine interface with respect to the testing device; arranging semiconductor devices to be tested one above the other in a magazine shaft of a magazine device; mechanically fastening and contacting the magazine shaft on the testing location; and simultaneously testing a stack of similar semiconductor devices in the magazine shaft; and testing mutually different types of semiconductor devices in different types of package one after another substantially without conversions on the testing device.

Claim 2

A method for testing a plurality of semiconductor devices on a programmable testing device having at least one testing location with a plurality of first electrical contact devices defining a testing location interface, the method which comprises: providing a plurality of magazine devices each having a magazine shaft, a plurality of second electrical contact devices defining a first magazine interface, forming a counterpart to the testing location interface of the testing device, and each having a plurality of second magazine interfaces, formed by third electrical contact devices, for contacting a respective semiconductor device to be tested; thereby providing a given magazine type for similar types of semiconductor devices enabled for testing with substantially a same set of testing signals and test patterns independently of one of a terminal assignment and a type of package thereof; thereby providing each magazine type, respectively provided for mutually different semiconductor devices, with an identical first magazine interface with respect to the testing device; arranging semiconductor devices to be tested one above the other in a magazine shaft of a magazine device; mechanically fastening and contacting the magazine shaft on the testing location; and simultaneously testing a stack of similar semiconductor devices in the magazine shaft; and testing mutually different types of semiconductor devices in different types of package one after another substantially without conversions on the testing device.