US6754471B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface acoustic wave filter packaging
Assignee: Skyworks Solutions Inc
•
Filing: 1999-12-06
•
Granted: 2004-06-22
•
Expires: 2019-12-06
Abstract
Abstract A system that provides packaging for a surface acoustic wave filter in such a way that the surface acoustic wave filter is capable of integration with a number of additional electronic devices on an integrated substrate. The surface acoustic wave filter is mounted in a “flip chip” configuration that enables the surface of the surface acoustic wave filter to be protected from a molding compound during and after the encapsulation of the surface acoustic wave filter and other circuitry contained on the integrated substrate. The manner in which the surface acoustic wave filter is packaged provides a great reduction in cost and occupied real estate on the integrated substrate, in that, the surface acoustic wave filter is mounted in such as way as not to require conventionally used ceramic packaging that encases the surface acoustic wave filter. An air gap is preserved between the surface acoustic wave filter side of the surface acoustic wave filter and the integrated substrate on which it is mounted. This air gap ensures proper operation of the surface acoustic wave filter. In addition, a passivation layer is deposited on the surface acoustic wave filter side of the surface acoustic wave filter before it is mounted in the “flip chip” configuration, thereby provided a degree of protection of the surface acoustic wave filter side of the surface acoustic wave filter.
Inventors
- 👤 Nooshin D. Vakilian
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:00
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/0538; H03H9/0542; H03H9/058; H03H9/059; H03H9/10; H03H9/1064; H03H9/1085; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
163 words
A wireless transceiver that receives a signal, the wireless transceiver comprising: a motherboard; an integrated substrate that is mounted on the motherboard; a switching circuitry that receives the signal; a surface acoustic wave filter die that receives the signal from the switching circuitry and that filters the signal; a low noise amplifier die that receives the signal from the surface acoustic wave filter die and that amplifies the signal; and a mixer die that receives the signal from the low noise amplifier die and that downconverts a frequency of the signal, wherein each of the switching circuitry, the surface acoustic wave filter die, the low noise amplifier die, and the mixer die is mounted on the integrated substrate; and the surface acoustic wave filter die is mounted in a flip chip configuration on the integrated substrate, and a passivation layer is deposited on the surface acoustic wave filter die prior to the surface acoustic wave filter die being mounted on the integrated substrate.
Claim 2
Dependent Claim
163 words
A wireless transceiver that receives a signal, the wireless transceiver comprising: a motherboard; an integrated substrate that is mounted on the motherboard; a switching circuitry that receives the signal; a surface acoustic wave filter die that receives the signal from the switching circuitry and that filters the signal; a low noise amplifier die that receives the signal from the surface acoustic wave filter die and that amplifies the signal; and a mixer die that receives the signal from the low noise amplifier die and that downconverts a frequency of the signal, wherein each of the switching circuitry, the surface acoustic wave filter die, the low noise amplifier die, and the mixer die is mounted on the integrated substrate; and the surface acoustic wave filter die is mounted in a flip chip configuration on the integrated substrate, and a passivation layer is deposited on the surface acoustic wave filter die prior to the surface acoustic wave filter die being mounted on the integrated substrate.
Claim 3
Dependent Claim
23 words
The wireless transceiver of claim 1 , further comprising an antenna that receives the signal and provides the signal to the switching circuitry.
Claim 4
Dependent Claim
39 words
The wireless transceiver of claim 1 , further comprising at least one additional circuitry, the at least one additional circuitry is mounted on the motherboard and the at least one additional circuitry receives the signal from the mixer die.
Claim 5
Dependent Claim
16 words
The wireless transceiver of claim 1 , wherein the wireless transceiver is a wireless communication device.
Claim 6
Dependent Claim
15 words
The wireless transceiver of claim 1 , wherein the wireless transceiver is a cellular telephone.
Claim 7
Dependent Claim
14 words
The wireless transceiver of claim 1 , wherein the signal is a speech signal.
Claim 8
Dependent Claim
40 words
The wireless transceiver of claim 1 , wherein the flip chip configuration of mounting of the surface acoustic wave filter die on the integrated substrate provides an air gap between the surface acoustic wave filter die and the integrated substrate.
Claim 9
Dependent Claim
15 words
The wireless transceiver of claim 1 , wherein the passivation layer is a dielectric material.
Claim 10
Dependent Claim
19 words
The wireless transceiver of claim 1 wherein the passivation layer covers the surface acoustic wave filter die active region.
Claim 11
Dependent Claim
147 words
A multi-chip module comprising: an integrated substrate; a surface acoustic wave filter die that is mounted on the integrated substrate, surface acoustic wave filter die is mounted in a flip chip configuration on the integrated substrate, the surface acoustic wave filter die is encapsulated on the integrated substrate; and wherein a passivation layer is deposited on the surface acoustic wave filter die prior to the surface acoustic wave filter die being mounted on the integrated substrate, wherein the surface acoustic wave filter die is contained within a flip mounted circuitry; and further comprising a surface mounted circuitry, the surface mounted circuitry comprises a switching circuitry; and a chip on-board circuitry, the chip on-board circuitry comprises a low noise amplifier die and a mixer die; and wherein each of the flip mounted circuitry, the surface mounted circuitry, and the chip on-board circuitry is mounted on the integrated substrate.
Claim 12
Dependent Claim
147 words
A multi-chip module comprising: an integrated substrate; a surface acoustic wave filter die that is mounted on the integrated substrate, surface acoustic wave filter die is mounted in a flip chip configuration on the integrated substrate, the surface acoustic wave filter die is encapsulated on the integrated substrate; and wherein a passivation layer is deposited on the surface acoustic wave filter die prior to the surface acoustic wave filter die being mounted on the integrated substrate, wherein the surface acoustic wave filter die is contained within a flip mounted circuitry; and further comprising a surface mounted circuitry, the surface mounted circuitry comprises a switching circuitry; and a chip on-board circuitry, the chip on-board circuitry comprises a low noise amplifier die and a mixer die; and wherein each of the flip mounted circuitry, the surface mounted circuitry, and the chip on-board circuitry is mounted on the integrated substrate.
Claim 13
Dependent Claim
22 words
The multi-chip module of claim 10 , wherein a molding compound encapsulated the surface acoustic wave filter die on the integrated substrate.
Claim 14
Dependent Claim
18 words
The multi-chip module of claim 10 , wherein the multi-chip module is contained within a personal communication device.
Claim 15
Dependent Claim
15 words
The multi-chip module of claim 10 , wherein the passivation layer is a dielectric material.
Claim 16
Independent Claim
116 words
A method to package a surface acoustic wave (SAW) filter die, the method comprising: passivating a filter side of the surface acoustic wave filter die; mounting the surface acoustic wave filter die in a flip chip configuration on a substrate; and encapsulating the surface acoustic wave filter die on the substrate, wherein the surface acoustic wave filter die comprises a plurality of contact pads; and further comprising applying a plurality of solder balls to the plurality of contacts pads before mounting the surface acoustic wave filter die in the flip chip configuration on the substrate, wherein the passivating the filter side of the surface acoustic wave filter die covers the surface acoustic wave filter active region.
Claim 17
Independent Claim
116 words
A method to package a surface acoustic wave (SAW) filter die, the method comprising: passivating a filter side of the surface acoustic wave filter die; mounting the surface acoustic wave filter die in a flip chip configuration on a substrate; and encapsulating the surface acoustic wave filter die on the substrate, wherein the surface acoustic wave filter die comprises a plurality of contact pads; and further comprising applying a plurality of solder balls to the plurality of contacts pads before mounting the surface acoustic wave filter die in the flip chip configuration on the substrate, wherein the passivating the filter side of the surface acoustic wave filter die covers the surface acoustic wave filter active region.
Claim 18
Dependent Claim
26 words
The method of claim 14 , further comprising covering the plurality of contact pads before passivating the filter side of the surface acoustic wave filter die.
Claim 19
Dependent Claim
25 words
The method of claim 14 , wherein the flip chip configuration provides an air gap between the surface acoustic wave filter die and the substrate.
Claim 20
Dependent Claim
34 words
The method of claim 14 , wherein a dielectric material is applied to the surface acoustic wave filter die to perform the passivation of the filter side of the surface acoustic wave filter die.
References Cited (Backward Citations)
US5109536A
Cited
US5444865A
Cited
US5319800A
Cited
US5355524A
Cited
US5254962A
Cited
US5465409A
Cited
US5903820A
Cited
US5928598A
Cited
US6417026B2
Cited
US6424238B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-06-22 | 2007-12-22 | 2008-06-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-06-22 | 2011-12-22 | 2012-06-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-06-22 | 2015-12-22 | 2016-06-22 | $7700.00 | Window Closed / Lapsed |