Patent US6731015B2 successfully refreshed from Google Patents.
US6731015B2
Expired / Lapsed
US
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Super low profile package with stacked dies
Assignee: Siliconware Precision Industries Co Ltd
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Filing: 2001-12-27
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Granted: 2004-05-04
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Expires: 2021-12-27
Abstract
Abstract A super low profile package with stacked dies comprises a substrate, a heat spreader, a first die, a second die, a molding compound, and a number of solder balls. The substrate has a cavity, a top surface and a bottom surface opposite to the top surface. The heat spreader is connected to the bottom surface of the substrate, and a portion of the heat spreader opposite to the cavity serves as a die pad. The first die seated in the cavity is attached to the die pad while the second die seated in the cavity is attached to the first die, and both dies are wire-bonded to the substrate for electrical connection. The molding compound fills the cavity and encapsulates the first die, the second die, the heat spreader, and part of the bottom surface of the substrate. Numerous solder balls are attached to the bottom surface of the substrate. The benefits resulting from the package of the invention include a reduction of profile, a simple manufacturing process, and a low prime cost.
Inventors
- 👤 Chi-Chuan Wu
- 👤 Tzong-Dar Her
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:40
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W40/00; H10W40/10; H10W40/70; H10W40/77; H10W40/778; H10W90/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W90/20; H10W90/22; H10W90/288; H10W90/291; H10W90/701; H10W90/721; H10W90/722; H10W90/731; H10W90/732; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
205 words
A super low profile package with stacked dies, comprising: a substrate having a through cavity in its center and having a top surface and a bottom surface opposite to the top surface; a heat spreader, which comprises: a base portion, and serving as a die pad for providing support; and an extending portion, radiating from the base portion and fixing the heat spreader onto the bottom surface of the substrate, so that the heat spreader is supported by the substrate by way of the extending portion; a first die seated in the cavity, wherein the first die is attached to the die pad and electrically connected to the substrate; a second die seated in the cavity, wherein the second die is attached to the first die and electrically connected to the substrate, wherein the first die and the second die are disposed above the heat spreader; a molding compound filling the cavity and encapsulating the first die, the second die, the heat spreader, and part of the bottom surface of the substrate; and a plurality of solder balls attached directly to the bottom surface of the substrate, wherein the heat spreader and the solder balls are both disposed on the same side of the substrate.
Claim 2
Dependent Claim
205 words
A super low profile package with stacked dies, comprising: a substrate having a through cavity in its center and having a top surface and a bottom surface opposite to the top surface; a heat spreader, which comprises: a base portion, and serving as a die pad for providing support; and an extending portion, radiating from the base portion and fixing the heat spreader onto the bottom surface of the substrate, so that the heat spreader is supported by the substrate by way of the extending portion; a first die seated in the cavity, wherein the first die is attached to the die pad and electrically connected to the substrate; a second die seated in the cavity, wherein the second die is attached to the first die and electrically connected to the substrate, wherein the first die and the second die are disposed above the heat spreader; a molding compound filling the cavity and encapsulating the first die, the second die, the heat spreader, and part of the bottom surface of the substrate; and a plurality of solder balls attached directly to the bottom surface of the substrate, wherein the heat spreader and the solder balls are both disposed on the same side of the substrate.
Claim 3
Dependent Claim
43 words
The super low profile package according to claim 1 , wherein the bottom surface of the substrate further has a ground ring for ground connection, and the extending portion of the heat spreader connects and fixes the heat spreader to the ground ring.
Claim 4
Dependent Claim
23 words
The super low profile package according to claim 1 , wherein the first die is electrically connected to the substrate by a wire.
Claim 5
Dependent Claim
23 words
The super low profile package according to claim 1 , wherein the second die is electrically connected to the substrate by a wire.
Claim 6
Dependent Claim
29 words
The super low profile package according to claim 1 , wherein the first die with an active surface facing downward is connected to the die pad by an adhesive.
Claim 7
Dependent Claim
46 words
The super low profile package according to claim 1 , wherein the second die with an active surface facing downward is connected to the first die by an adhesive, and active surfaces of the first die and the second dies both are facing the same direction.
Claim 8
Dependent Claim
34 words
The super low profile package according to claim 1 , wherein the first die is connected to the second die through a plurality of second solder balls in accordance with a flip chip arrangement.
Claim 9
Dependent Claim
22 words
The super low profile package according to claim 1 , wherein a portion of the heat spreader is exposed to the atmosphere.
Claim 10
Dependent Claim
187 words
A super low profile package with stacked dies, comprising: a substrate having a through cavity in its center and having a top surface and a bottom surface opposite to the top surface; a heat spreader, which comprises: a base portion, and serving as a die pad for providing support; and an extending portion, radiating from the base portion and connecting and fixing the heat spreader to the bottom surface of the substrate, so that the heat spreader is supported by the substrate by way of the extending portion; a first die seated in the cavity, wherein the first die is attached to the die pad and electrically connected to the substrate; a second die seated in the cavity, wherein the second die is attached to the first die and electrically connected to the substrate, and a back surface of the second die is exposed to the atmosphere; a molding compound filling the cavity and encapsulating the first die, the second die, the heat spreader, and part of the bottom surface of the substrate; and a plurality of solder balls attached to the bottom surface of the substrate.
Claim 11
Dependent Claim
187 words
A super low profile package with stacked dies, comprising: a substrate having a through cavity in its center and having a top surface and a bottom surface opposite to the top surface; a heat spreader, which comprises: a base portion, and serving as a die pad for providing support; and an extending portion, radiating from the base portion and connecting and fixing the heat spreader to the bottom surface of the substrate, so that the heat spreader is supported by the substrate by way of the extending portion; a first die seated in the cavity, wherein the first die is attached to the die pad and electrically connected to the substrate; a second die seated in the cavity, wherein the second die is attached to the first die and electrically connected to the substrate, and a back surface of the second die is exposed to the atmosphere; a molding compound filling the cavity and encapsulating the first die, the second die, the heat spreader, and part of the bottom surface of the substrate; and a plurality of solder balls attached to the bottom surface of the substrate.
Claim 12
Dependent Claim
43 words
The super low profile package according to claim 9 , wherein the bottom surface of the substrate further has a ground ring for ground connection, and the extending portion of the heat spreader connects and fixes the heat spreader to the ground ring.
Claim 13
Dependent Claim
23 words
The super low profile package according to claim 9 , wherein the first die is electrically connected to the substrate by a wire.
Claim 14
Dependent Claim
23 words
The super low profile package according to claim 9 , wherein the second die is electrically connected to the substrate by a wire.
Claim 15
Dependent Claim
29 words
The super low profile package according to claim 9 , wherein the first die with an active surface facing downward is connected to the die pad by an adhesive.
Claim 16
Dependent Claim
46 words
The super low profile package according to claim 9 , wherein the second die with an active surface facing downward is connected to the first die by an adhesive, and active surfaces of the first die and the second dies both are facing the same direction.
Claim 17
Dependent Claim
34 words
The super low profile package according to claim 9 , wherein the first die is connected to the second die through a plurality of second solder balls in accordance with a flip chip arrangement.
Claim 18
Dependent Claim
218 words
A super low profile package with stacked dies, comprising: a substrate having a through cavity in its center and having a top surface and a bottom surface opposite to the top surface; a heat spreader, a portion of which is exposed to the atmosphere, wherein the heat spreader comprises: a base portion, and serving as a die pad for providing support; and an extending portion, radiating from the base portion and connecting and fixing the heat spreader to the bottom surface of the substrate, so that the heat spreader is supported by the substrate by way of the extending portion; a first die seated in the cavity, wherein the first die is attached to the die pad and electrically connected to the substrate; a second die seated in the cavity, wherein the second die is attached to the first die and electrically connected to the substrate; a molding compound filling the cavity and encapsulating the first die, the second die, the heat spreader, and part of the bottom surface of the substrate; and a plurality of solder balls attached to the bottom surface of the substrate; wherein the package is further assembled to a printed circuit board (PCB) by thermally connecting the exposed heat spreader and a ground layer of the PCB through a layer of epoxy resin.
Claim 19
Dependent Claim
218 words
A super low profile package with stacked dies, comprising: a substrate having a through cavity in its center and having a top surface and a bottom surface opposite to the top surface; a heat spreader, a portion of which is exposed to the atmosphere, wherein the heat spreader comprises: a base portion, and serving as a die pad for providing support; and an extending portion, radiating from the base portion and connecting and fixing the heat spreader to the bottom surface of the substrate, so that the heat spreader is supported by the substrate by way of the extending portion; a first die seated in the cavity, wherein the first die is attached to the die pad and electrically connected to the substrate; a second die seated in the cavity, wherein the second die is attached to the first die and electrically connected to the substrate; a molding compound filling the cavity and encapsulating the first die, the second die, the heat spreader, and part of the bottom surface of the substrate; and a plurality of solder balls attached to the bottom surface of the substrate; wherein the package is further assembled to a printed circuit board (PCB) by thermally connecting the exposed heat spreader and a ground layer of the PCB through a layer of epoxy resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-05-04 | 2007-11-03 | 2008-05-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-05-04 | 2011-11-03 | 2012-05-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-05-04 | 2015-11-03 | 2016-05-04 | $7700.00 | Window Closed / Lapsed |