US6727115B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Back-side through-hole interconnection of a die to a substrate
Assignee: Samsung Electronics Co Ltd
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Filing: 2001-10-31
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Granted: 2004-04-27
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Expires: 2021-10-31
Abstract
Abstract A method and apparatus for connecting a die having active circuitry to a substrate in semiconductor applications and in thermal inkjet printer applications where the die is directly bonded and sealed to the substrate without the need for conventional TAB circuit. Each die includes a back-side and a front-side, where the active circuitry is positioned, with at least one through-hole formed between the front-side and the back-side of the die. Each through-hole on the die is aligned with a corresponding conductive trace on the substrate. A conductive member is inserted within each through-hole. One end of the conductive member is electrically connected to a trace on the substrate. The other end of the conductive member is inserted into the through-hole such that the conductive member is positioned through the die and is exposed at the front-side of the die to contact an interconnect pad, which is electrically connected to the active circuitry on the die. The back-side of the die is bonded and sealed to the substrate. The interconnect pad and exposed end of the conductive member is sealed to substantially hermetically seal the resulting electrical connection from the active circuitry to the trace.
Inventors
- 👤 Jay F. Van Hoff
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:06
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/135; B41J2/14; B41J2/14016; B41J2/14072; H; H10; H10W; H10W20/00; H10W20/20; B41J2202/00; B41J2202/01; B41J2202/18; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/221; H10W72/241; H10W72/244; H10W72/251; H10W72/252; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
171 words
A method for connecting a die having active circuitry to a substrate, the die including a back-side and a front-side where the active circuitry is positioned, and the substrate includes at least one conductive trace, the method comprising: forming at least one through-hole between the front-side and back-side of the die to correspond with a trace on the substrate; inserting an insulated micro-spring in each formed through-hole, wherein one end of the insulated micro-spring is electrically connected to a trace on the substrate, and the other end of the insulated micro-spring is inserted into the through-hole such that the insulated micro-spring is positioned through the die and is exposed at the front-side of the die and electrically connected to the active circuitry via an interconnect pad; bonding and sealing the back-side of the die to the substrate about the at least one insulated micro-spring; and sealing the interconnect pad and exposed end of the insulated micro-spring to substantially hermetically seal the resulting electrical connection from the active circuitry to the trace.
Claim 2
Independent Claim
171 words
A method for connecting a die having active circuitry to a substrate, the die including a back-side and a front-side where the active circuitry is positioned, and the substrate includes at least one conductive trace, the method comprising: forming at least one through-hole between the front-side and back-side of the die to correspond with a trace on the substrate; inserting an insulated micro-spring in each formed through-hole, wherein one end of the insulated micro-spring is electrically connected to a trace on the substrate, and the other end of the insulated micro-spring is inserted into the through-hole such that the insulated micro-spring is positioned through the die and is exposed at the front-side of the die and electrically connected to the active circuitry via an interconnect pad; bonding and sealing the back-side of the die to the substrate about the at least one insulated micro-spring; and sealing the interconnect pad and exposed end of the insulated micro-spring to substantially hermetically seal the resulting electrical connection from the active circuitry to the trace.
Claim 3
Dependent Claim
25 words
The method according to claim 1 , wherein the back-side of the die is bonded and sealed to the substrate through a hard inorganic seal.
Claim 4
Dependent Claim
24 words
The method according to claim 1 , wherein the back-side of the die is bonded and sealed to the substrate through an adhesive seal.
Claim 5
Dependent Claim
24 words
The method according to claim 1 , wherein the back-side of the die is bonded and sealed to the substrate through an anodic bond.
Claim 6
Dependent Claim
17 words
The method according to claim 1 , wherein the interconnect pad is substantially hermetically sealed through passivation.
Claim 7
Dependent Claim
17 words
The method according to claim 1 , wherein the interconnect pad is substantially hermetically sealed through encapsulation.
Claim 8
Dependent Claim
18 words
The method according to claim 1 , wherein each through-hole is beveled at the back-side of the die.
Claim 9
Dependent Claim
18 words
The method according to claim 1 , wherein each through-hole is beveled at the front-side of the die.
Claim 10
Dependent Claim
18 words
The method according to claim 8 , wherein each through-hole is beveled at the front-side of the die.
Claim 11
Independent Claim
204 words
A method for connecting a die having active circuitry to a substrate, the die including a back-side and a front-side, and the substrate includes at least one conductive trace, the method comprising: forming at least one through-hole between the front-side of the die to the back-side of the die to correspond with a trace on the substrate, each said through-hole is defined by an electrically conductive side wall; providing an insulated micro-spring for each formed through-hole, wherein one end of the insulated micro-spring is electrically connected to a trace on the substrate, and the other end of the insulated micro-spring is biased against its corresponding through-hole at the back-side of the die to make contact with the electrically conductive side wall; providing an electrically conductive cap for each through-hole such that each cap makes electrical contact with the side wall of the through-hole at the front-side of the die to contact an interconnect pad is connected to the active circuitry in the die; bonding and sealing the back-side of the die to the substrate about the at least one insulated micro-spring; and sealing the interconnect pad and the cap to substantially hermetically seal the resulting electrical connection from the active circuitry to the trace.
Claim 12
Independent Claim
204 words
A method for connecting a die having active circuitry to a substrate, the die including a back-side and a front-side, and the substrate includes at least one conductive trace, the method comprising: forming at least one through-hole between the front-side of the die to the back-side of the die to correspond with a trace on the substrate, each said through-hole is defined by an electrically conductive side wall; providing an insulated micro-spring for each formed through-hole, wherein one end of the insulated micro-spring is electrically connected to a trace on the substrate, and the other end of the insulated micro-spring is biased against its corresponding through-hole at the back-side of the die to make contact with the electrically conductive side wall; providing an electrically conductive cap for each through-hole such that each cap makes electrical contact with the side wall of the through-hole at the front-side of the die to contact an interconnect pad is connected to the active circuitry in the die; bonding and sealing the back-side of the die to the substrate about the at least one insulated micro-spring; and sealing the interconnect pad and the cap to substantially hermetically seal the resulting electrical connection from the active circuitry to the trace.
Claim 13
Dependent Claim
16 words
The method according to claim 10 , wherein the insulated micro-spring is an insulated truncated micro-spring.
Claim 14
Dependent Claim
25 words
The method according to claim 10 , wherein the back-side of the die is bonded and sealed to the substrate through a hard inorganic seal.
Claim 15
Dependent Claim
15 words
The method according to claim 10 , wherein the interconnect pad is sealed by passivation.
Claim 16
Independent Claim
140 words
A method for connecting a die to a substrate that includes a conductive trace, wherein the die includes a back-side and a front-side, and wherein the die includes active circuitry that is positioned at the front-side, the method comprising: forming at least one through-hole between the front-side and the back-side of the die; inserting a conductive member in the through-hole, wherein an end of the conductive member is electrically connected to a trace on the substrate, and an other end of the conductive member is inserted into the through-hole such that a portion of the conductive member extends above the front-side of the die; electrically connecting the portion of the conductive member extending above the front-side of the die to the active circuitry positioned at the front-side of the die; and fixing the back-side of the die to the substrate.
Claim 17
Independent Claim
140 words
A method for connecting a die to a substrate that includes a conductive trace, wherein the die includes a back-side and a front-side, and wherein the die includes active circuitry that is positioned at the front-side, the method comprising: forming at least one through-hole between the front-side and the back-side of the die; inserting a conductive member in the through-hole, wherein an end of the conductive member is electrically connected to a trace on the substrate, and an other end of the conductive member is inserted into the through-hole such that a portion of the conductive member extends above the front-side of the die; electrically connecting the portion of the conductive member extending above the front-side of the die to the active circuitry positioned at the front-side of the die; and fixing the back-side of the die to the substrate.
Claim 18
Dependent Claim
17 words
The method of claim 14 , wherein the die is a constituent component of an inkjet printhead.
Claim 19
Dependent Claim
13 words
The method of claim 14 , wherein the conductive member includes a micro-spring.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-04-27 | 2007-10-27 | 2008-04-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-04-27 | 2011-10-27 | 2012-04-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-04-27 | 2015-10-27 | 2016-04-27 | $7700.00 | Window Closed / Lapsed |