Orthogonal interface for connecting circuit boards carrying differential pairs

Claim 2

An electrical connector assembly comprising: wafers having arranged in at least one differential pair on each of at least first and second wafers; a first connector housing retaining a first group of wafers; a second connector housing retaining a second group of wafers; and signal contacts joining said differential pairs of said signal traces on said first wafer with a corresponding differential pairs of said signal traces on said second wafer said first and second connector housing joining said first group of wafers in a non-parallel relationship to said second group of wafers.

Claim 3

The electrical connector assembly of claim 1 , wherein said first and second wafers are aligned orthogonal to one another.

Claim 4

The electrical connector assembly of claim 1 , wherein said signal contacts each includes a body portion with a forked arm on one end and a flexible beam on an opposite end, said forked arm receiving therein an edge of a wafer from said first group of wafers, said flexible beam contacting one side of a wafer from said second group of wafers.

Claim 5

The electrical connector assembly of claim 1 , said signal contacts further comprising first and second signal contacts arranged in a differential pair, each of said first and second signal contacts having a forked arm receiving therein an edge of a wafer from said first group of wafers and having a flexible beam, contacting only one side of a wafer from said second group of wafers.

Claim 6

The electrical connector assembly of claim 1 , wherein said signal contacts are arranged in differential pairs, each differential pair of said signal contacts joining a differential pair of said signal traces on a wafer from said first group of wafers with a corresponding differential pair of said signal traces on a wafer from said second group of wafers.

Claim 7

The electrical connector assembly of claim 1 , further comprising ground contacts joining said ground traces on said first and second groups of wafers and comprising signal contacts arranged in differential pairs wherein said signal contacts in each differential pair are separated from one another by a ground contact.

Claim 8

The electrical connector assembly of claim 1 , further comprising ground contacts joining said ground traces on said first and second groups of wafers and comprising signal contacts arranged in differential pairs, each differential pair of said signal contacts being located along a first axis with a corresponding ground contact located therebetween.

Claim 9

The electrical connector assembly of claim 1 , further comprising ground contacts joining said ground traces on said first and second groups of wafers and wherein said signal contacts are arranged in differential pairs, each differential pair of said signal contacts being stacked with a corresponding ground contact along a first axis, each differential pair of said signal contacts having beams offset from one another in a direction transverse to said first axis.

Claim 10

An electrical connector assembly comprising: first and second wafers each having signal traces arranged in differential pairs; a first connector housing adapted to retain said first wafer; a second connector housing adapted to retain said second wafer; and signal contacts joining at least one differential pairs of said signal traces on said first wafer with a corresponding differential pair of said signal traces on said second wafer, said first and second connector housings joining said first wafer in a non-parallel relationship to said second wafer.

Claim 11

An electrical connector assembly comprising: first and second wafers each having signal traces arranged in differential pairs; a first connector housing adapted to retain said first wafer; a second connector housing adapted to retain said second wafer; and signal contacts joining at least one differential pairs of said signal traces on said first wafer with a corresponding differential pair of said signal traces on said second wafer, said first and second connector housings joining said first wafer in a non-parallel relationship to said second wafer.

Claim 12

The electrical connector assembly of claim 9 , said signal contacts further comprising first and second signal contacts interconnecting said differential pair of said signal traces on said first wafer with said differential pair of said signal traces on said second wafer, said first and second wafers being aligned orthogonal to one another.

Claim 13

The electrical connector assembly of claim 9 , wherein said signal contacts each includes a body portion with a forked arm on one end and a flexible beam on an opposite end, said forked arm receiving therein an edge of said first wafer, said flexible beam contacting one side of said second wafer.

Claim 14

The electrical connector assembly of claim 9 , said signal contacts further comprising first and second signal contacts arranged in a differential pair, each of said first and second signal contacts having a forked arm receiving therein an edge of said first wafer and having a flexible beam; contacting only one side of said second wafer.

Claim 15

The electrical connector assembly of claim 9 , wherein said signal contacts are arranged in differential pairs, each differential pair of said signal contacts joining a differential pair of said signal traces on said first wafer with a corresponding differential pair of said signal traces on said second wafer.

Claim 16

The electrical connector assembly of claim 9 , further comprising ground contacts joining said ground traces on said first and second wafers, wherein said signal contacts are arranged in differential pairs, and wherein said signal contacts in each differential pair are separated from one another by a ground contact.

Claim 17

The electrical connector assembly of claim 9 , further comprising ground contacts joining ground traces on said first and second wafers and wherein said signal contacts are arranged in differential pairs, each differential pair of said signal contacts being located along a first axis with a corresponding ground contact located therebetween.

Claim 18

The electrical connector assembly of claim 9 , further comprising ground contacts joining ground traces on said first and second wafers and wherein said signal contacts are arranged in differential pairs, each differential pair of said signal contacts being stacked with a corresponding ground contact along a first axis, each differential pair of said signal contacts having beams offset from one another in a direction transverse to said first axis.

Claim 19

An electrical connector assembly comprising: a plurality of wafers having ground and signal traces, said signal traces being arranged in differential pairs; a first connector housing including channels adapted to retain a first group of wafers; a second connector housing including channels adapted to retain a second group of wafers; a wafer interface secured to one of said first and second connector housings, said wafer interface including cavities; ground and signal contacts loaded into said cavities for connection to corresponding ground and signal traces, said signal contacts being arranged in differential pairs with corresponding ground contacts located therebetween along a first axis, each ground contact and signal contact including ground beams and signal beams, respectively, each ground beam being located immediately adjacent and facing a corresponding signal beam; and said wafer interface holding said signal beams in a biased state to deflect said signal beams away from corresponding ground beams to define gaps therebetween.

Claim 20

An electrical connector assembly comprising: a plurality of wafers having ground and signal traces, said signal traces being arranged in differential pairs; a first connector housing including channels adapted to retain a first group of wafers; a second connector housing including channels adapted to retain a second group of wafers; a wafer interface secured to one of said first and second connector housings, said wafer interface including cavities; ground and signal contacts loaded into said cavities for connection to corresponding ground and signal traces, said signal contacts being arranged in differential pairs with corresponding ground contacts located therebetween along a first axis, each ground contact and signal contact including ground beams and signal beams, respectively, each ground beam being located immediately adjacent and facing a corresponding signal beam; and said wafer interface holding said signal beams in a biased state to deflect said signal beams away from corresponding ground beams to define gaps therebetween.

Claim 21

The electrical connector assembly of claim 17 , each ground contact having a pair of said ground beams offset from one another in a direction transverse to said first axis.

Claim 22

The electrical connector assembly of claim 17 , said signal beams of each differential pair of said signal contacts being offset from one another in a direction transverse to said first axis.

Claim 23

The electrical connector assembly of claim 17 , wherein said signal contacts in each differential pair are separated from one another by a single ground contact.

Claim 24

The electrical connector assembly of claim 17 , wherein each differential pair of said signal contacts joins a differential pair of said signal traces on one side of a wafer from said first group of wafers with a corresponding differential pair of said signal traces on opposite sides of a wafer from said second group of wafers.

Claim 25

The electrical connector assembly of claim 17 , wherein said signal traces in said differential pairs are separated by a first distance that is shorter than a second distance that separates adjacent signal traces of adjacent differential pairs of signal traces.

Claim 26

An electrical wafer configuration for carrying differential pairs of signals, comprising: a first wafer having a differential pair of signal traces thereon; a second wafer having a differential pair of signal traces thereon, said first and second wafers being joined in a non-parallel relationship with one another; and signal contacts joining said differential pair of signal traces on said first wafer with said differential pair of signal traces on said second wafer.

Claim 27

An electrical wafer configuration for carrying differential pairs of signals, comprising: a first wafer having a differential pair of signal traces thereon; a second wafer having a differential pair of signal traces thereon, said first and second wafers being joined in a non-parallel relationship with one another; and signal contacts joining said differential pair of signal traces on said first wafer with said differential pair of signal traces on said second wafer.

Claim 28

The electrical wafer configuration of claim 23 , further comprising at least one housing retaining said first and second wafers in said non-parallel relationship.

Claim 29

The electrical wafer configuration of claim 23 , wherein at least one of said first and second wafers include at least one ground trace.