US6703697B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic package design with improved power delivery performance
Assignee: Beijing Xiaomi Mobile Software Co Ltd
•
Filing: 2001-12-07
•
Granted: 2004-03-09
•
Expires: 2021-12-07
Abstract
Abstract An electronic package with improved power delivery performance, lowering the impedance associated with the power delivery. The electronic package includes an integrated circuit die mounted on the substrate of the electronic package and decoupling capacitors placed underneath the substrate. The package further includes stand-offs placed underneath the substrate, sized for maintaining a distance between the capacitors and another substrate.
Inventors
- 👤 Anne Leahy
- 👤 Ajit Sathe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:59
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W90/00; H10W90/401; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/023; H05K1/0231; H05K1/14; H05K1/141; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10507; H05K2201/10545; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/20; H05K2201/2036; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12389; Y10T428/12396
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
91 words
An electronic package assembly, comprising: a substrate having first and second opposing substrate surfaces; an integrated circuit die mounted on the first substrate surface; a capacitor mounted on the second substrate surface; an electrical connection element disposed on the second substrate surface; and a stand-off disposed on the second substrate surface, and being sized for maintaining a distance between the capacitor and another substrate and for allowing the electrical connection element to directly connect the second substrate surface to the other substrate when the stand-off is mounted to the other substrate.
Claim 2
Dependent Claim
91 words
An electronic package assembly, comprising: a substrate having first and second opposing substrate surfaces; an integrated circuit die mounted on the first substrate surface; a capacitor mounted on the second substrate surface; an electrical connection element disposed on the second substrate surface; and a stand-off disposed on the second substrate surface, and being sized for maintaining a distance between the capacitor and another substrate and for allowing the electrical connection element to directly connect the second substrate surface to the other substrate when the stand-off is mounted to the other substrate.
Claim 3
Dependent Claim
19 words
The electronic package assembly of claim 1 , wherein the capacitor is electrically coupled to the integrated circuit die.
Claim 4
Dependent Claim
16 words
The electronic package assembly of claim 2 , wherein the capacitor is a power decoupling capacitor.
Claim 5
Dependent Claim
15 words
The electronic package assembly of claim 1 , wherein the capacitor is a discrete capacitor.
Claim 6
Dependent Claim
19 words
The electronic package assembly of claim 1 , wherein the stand-off is electrically coupled to the integrated circuit die.
Claim 7
Dependent Claim
23 words
The electronic package assembly of claim 1 , wherein the stand-off is electrically coupled to a power terminal within the integrated circuit die.
Claim 8
Dependent Claim
17 words
The electronic package assembly of claim 1 , wherein the electrical connection element comprises a solder ball.
Claim 9
Dependent Claim
16 words
The electronic package assembly of claim 1 , wherein the integrated circuit die comprises a flip-chip.
Claim 10
Dependent Claim
83 words
The electronic package assembly of claim 1 , further comprising: a plurality of capacitors disposed on the second substrate surface; a plurality of electrical connection elements disposed on the second substrate surface; and a plurality of stand-offs disposed on the second substrate surface, each being sized for maintaining a distance between the capacitor and another substrate and for allowing the electrical connection elements to directly connect the second substrate surface to the other substrate when the stand-offs are mounted to the other substrate.
Claim 11
Dependent Claim
92 words
An electronic package assembly, comprising: a substrate having first and second opposing substrate surfaces; an integrated circuit die disposed on the first substrate surface; an electrical component disposed on the second substrate surface; an electrical connection element disposed on the second substrate surface; and a stand-off disposed on the second substrate surface, being sized for maintaining a distance between the electrical component and another substrate and for allowing the electrical connection element to directly connect the second substrate surface to the other substrate when the stand-off is mounted to the other substrate.
Claim 12
Dependent Claim
92 words
An electronic package assembly, comprising: a substrate having first and second opposing substrate surfaces; an integrated circuit die disposed on the first substrate surface; an electrical component disposed on the second substrate surface; an electrical connection element disposed on the second substrate surface; and a stand-off disposed on the second substrate surface, being sized for maintaining a distance between the electrical component and another substrate and for allowing the electrical connection element to directly connect the second substrate surface to the other substrate when the stand-off is mounted to the other substrate.
Claim 13
Dependent Claim
20 words
The electronic package assembly of claim 10 , wherein the electrical component is electrically coupled to the integrated circuit die.
Claim 14
Dependent Claim
16 words
The electronic package assembly of claim 10 , wherein the electrical component is a discrete component.
Claim 15
Dependent Claim
19 words
The electronic package assembly of claim 10 , wherein the stand-off is electrically coupled to the integrated circuit die.
Claim 16
Dependent Claim
23 words
The electronic package assembly of claim 10 , wherein the stand-off is electrically coupled to a power terminal within the integrated circuit die.
Claim 17
Dependent Claim
17 words
The electronic package assembly of claim 10 , wherein the electrical connection element comprises a solder ball.
Claim 18
Dependent Claim
16 words
The electronic package assembly of claim 10 , wherein the integrated circuit die comprises a flip-chip.
Claim 19
Dependent Claim
84 words
The electronic package assembly of claim 10 , further comprising: a plurality of electrical components disposed on the second substrate surface; and a plurality of stand-offs disposed on the second substrate surface, being sized to maintain a distance between the plurality of electrical components and another substrate when the plurality of stand-offs is mounted to the other substrate and to allow the electrical connections to directly connect the second substrate surface to the other substrate when the stand-offs are mounted to the other substrate.
Claim 20
Dependent Claim
53 words
A printed circuit board assembly, comprising: a printed circuit board; a substrate having first and second opposing substrate surfaces; an integrated circuit die disposed on the first substrate surface; a capacitor disposed on the second substrate surface; and an electrical connection element directly connecting the second substrate surface to the printed circuit board.
Claim 21
Dependent Claim
53 words
A printed circuit board assembly, comprising: a printed circuit board; a substrate having first and second opposing substrate surfaces; an integrated circuit die disposed on the first substrate surface; a capacitor disposed on the second substrate surface; and an electrical connection element directly connecting the second substrate surface to the printed circuit board.
Claim 22
Dependent Claim
36 words
The printed circuit board assembly of claim 18 , further comprising a stand-off disposed between the second substrate surface and the printed circuit board, wherein the capacitor is maintained a distance from the printed circuit board.
Claim 23
Dependent Claim
20 words
The printed circuit board assembly of claim 19 , wherein the stand-off is electrically coupled to the integrated circuit die.
Claim 24
Dependent Claim
20 words
The printed circuit board assembly of claim 18 , wherein the capacitor is electrically coupled to the integrated circuit die.
Claim 25
Dependent Claim
17 words
The printed circuit board assembly of claim 18 , wherein the capacitor is a power decoupling capacitor.
Claim 26
Dependent Claim
16 words
The printed circuit board assembly of claim 18 , wherein the capacitor is a discrete capacitor.
Claim 27
Dependent Claim
21 words
The printed circuit board assembly of claim 18 , further comprising a power supply electrically coupled to the integrated circuit die.
Claim 28
Dependent Claim
17 words
The printed circuit board assembly of claim 18 , wherein the electrical connection comprises a solder ball.
Claim 29
Dependent Claim
17 words
The printed circuit board assembly of claim 18 , wherein the integrated circuit die comprises a flip-chip.
Claim 30
Dependent Claim
21 words
The printed circuit board assembly of claim 18 , further comprising a plurality of capacitors disposed on the second substrate surface.
Claim 31
Dependent Claim
28 words
The printed circuit board assembly of claim 18 , further comprising a plurality of electrical connection elements directly connecting the second substrate surface to the printed circuit board.
Claim 32
Dependent Claim
26 words
The printed circuit board assembly of claim 18 , further comprising a plurality of stand-offs disposed between the second substrate surface and the printed circuit board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-03-09 | 2007-09-08 | 2008-03-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-03-09 | 2011-09-08 | 2012-03-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-03-09 | 2015-09-08 | 2016-03-09 | $7700.00 | Window Closed / Lapsed |