Patent US6634095B2 successfully refreshed from Google Patents.
US6634095B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for mounting a land grid array module
Assignee: Google LLC
•
Filing: 2001-06-27
•
Granted: 2003-10-21
•
Expires: 2021-06-27
Abstract
Abstract An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
Inventors
- 👤 John L. Colbert
- 👤 John S. Corbin, Jr.
- 👤 Roger D. Hamilton
- 👤 Danny E. Massey
- 👤 Arvind K. Sinha
- 👤 Charles C. Stratton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:03
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; Y; Y10; Y10S; Y10S269/00; Y10S269/903; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49133; Y10T29/49137; Y10T29/49139; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53178; Y10T29/532; Y10T29/53209; Y10T29/53213; Y10T29/53239; Y10T29/53265
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
275 words
An installation apparatus for mounting a land grid array (LGA) module having an upper and a lower surface thereof on a printed wiring board (PWB) having a front and a back surface thereof, the apparatus comprising: a frame member surrounding an LGA socket site, the frame having a back side adapted for fixed attachment to the PWB and a front side adapted for receiving at least one module holding member; and at least one module holding member fixedly attached to the frame for retention therewith regardless of whether there is an LGA multi-chip module in the LGA socket site or not, and for rotation about an axis from a first to a second angular position of the module holding member with respect to the frame, the module holding member having a lower surface thereof defining an inclined plane adapted for contacting the upper surface of an LGA multi-chip module located in the LGA socket site; the inclined plane of the module holding member exerting a progressively increasing clamping force against the upper surface the LGA multi-chip module for retaining the LGA multi-chip module in the LGA socket site of the frame member as the module holding member is rotated in one direction about the axis from the first to the second angular position of the module holding member, and exerting a progressively decreasing clamping force against the upper surface the LGA multi-chip module for releasing the LGA multi-chip module from the LGA socket site of the frame member as the module holding member is rotated in the other direction about the axis from the second to the first angular position of the module holding member.
Claim 2
Dependent Claim
275 words
An installation apparatus for mounting a land grid array (LGA) module having an upper and a lower surface thereof on a printed wiring board (PWB) having a front and a back surface thereof, the apparatus comprising: a frame member surrounding an LGA socket site, the frame having a back side adapted for fixed attachment to the PWB and a front side adapted for receiving at least one module holding member; and at least one module holding member fixedly attached to the frame for retention therewith regardless of whether there is an LGA multi-chip module in the LGA socket site or not, and for rotation about an axis from a first to a second angular position of the module holding member with respect to the frame, the module holding member having a lower surface thereof defining an inclined plane adapted for contacting the upper surface of an LGA multi-chip module located in the LGA socket site; the inclined plane of the module holding member exerting a progressively increasing clamping force against the upper surface the LGA multi-chip module for retaining the LGA multi-chip module in the LGA socket site of the frame member as the module holding member is rotated in one direction about the axis from the first to the second angular position of the module holding member, and exerting a progressively decreasing clamping force against the upper surface the LGA multi-chip module for releasing the LGA multi-chip module from the LGA socket site of the frame member as the module holding member is rotated in the other direction about the axis from the second to the first angular position of the module holding member.
Claim 3
Dependent Claim
12 words
The apparatus of claim 1 wherein the frame member comprises conductive plastic.
Claim 4
Dependent Claim
25 words
The apparatus of claim 1 wherein the frame member comprises a plurality of LGA socket sites to receive a plurality of LGA multi-chip module assemblies.
Claim 5
Dependent Claim
18 words
The apparatus of claim 1 wherein the frame member includes a chamfered corner to orientate the module assembly.
Claim 6
Dependent Claim
22 words
The apparatus of claim 1 wherein the at least one module holding member comprises a cam members rotatably attached to the frame.
Claim 7
Dependent Claim
25 words
The apparatus of claim 5 further comprising a cam receptors formed in the frame to receive each of the at least one the cam members.
Claim 8
Dependent Claim
19 words
The apparatus of claim 6 wherein the at least one cam member is rotatably attached to the cam receptors.
Claim 9
Dependent Claim
18 words
The apparatus of claim 5 wherein a hexagonal column is formed on the cam members to facilitate rotation.
Claim 10
Dependent Claim
24 words
The apparatus of claim 5 wherein a stop is formed on an inclined plane of the cam member to prevent over rotating the cam.
Claim 11
Dependent Claim
16 words
The apparatus of claim 1 further comprising at least one guide portion formed on the frame.
Claim 12
Dependent Claim
27 words
The apparatus of claim 1 wherein the frame further comprises at least one mounting pad adapted to receive a fastener for attaching the frame to the PWB.
Claim 13
Dependent Claim
22 words
The apparatus of claim 1 wherein a stiffening rib is formed in a wall of the frame adjacent the LGA socket site.
Claim 14
Dependent Claim
256 words
An installation apparatus for mounting a land grid array (LGA) multi-chip module having an upper and a lower surface thereof on a printed wiring board (PWB) having a front and a back surface thereof, the apparatus comprising: module mounting means defining an LGA socket site, and adapted for fixed attachment to the PWB;and at least one module holding member fixedly attached to the module mounting means for retention therewith regardless of whether there is an LGA multi-chip module in the LGA socket site or not, and for rotation about an axis from a first to a second angular position of the module holding member; the module holding member having a lower surface thereof defining an inclined plane adapted for contacting the upper surface of an LGA multi-chip module located in the LGA socket site; the inclined plane of the module holding member exerting a progressively increasing clamping force against the upper surface of an LGA multi-chip module in the LGA socket site for retaining the LGA multi-chip module in the LGA socket site as the module holding member is rotated in one direction about the axis from the first to the second angular position of the module holding member, and exerting a progressively decreasing clamping force against the upper surface the LGA multi-chip module for releasing the LGA multi-chip module from the LGA socket site of the frame member as the module holding member is rotated in the other direction about the axis from the second to the first angular position of the module holding member.
Claim 15
Dependent Claim
256 words
An installation apparatus for mounting a land grid array (LGA) multi-chip module having an upper and a lower surface thereof on a printed wiring board (PWB) having a front and a back surface thereof, the apparatus comprising: module mounting means defining an LGA socket site, and adapted for fixed attachment to the PWB;and at least one module holding member fixedly attached to the module mounting means for retention therewith regardless of whether there is an LGA multi-chip module in the LGA socket site or not, and for rotation about an axis from a first to a second angular position of the module holding member; the module holding member having a lower surface thereof defining an inclined plane adapted for contacting the upper surface of an LGA multi-chip module located in the LGA socket site; the inclined plane of the module holding member exerting a progressively increasing clamping force against the upper surface of an LGA multi-chip module in the LGA socket site for retaining the LGA multi-chip module in the LGA socket site as the module holding member is rotated in one direction about the axis from the first to the second angular position of the module holding member, and exerting a progressively decreasing clamping force against the upper surface the LGA multi-chip module for releasing the LGA multi-chip module from the LGA socket site of the frame member as the module holding member is rotated in the other direction about the axis from the second to the first angular position of the module holding member.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-10-20 | 2007-04-21 | 2007-10-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-10-20 | 2011-04-21 | 2011-10-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-10-20 | 2015-04-21 | 2015-10-21 | $7700.00 | Window Closed / Lapsed |