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Radical-assisted sequential CVD

Assignee: Aixtron Inc
•
Filing: 2002-08-06
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Granted: 2003-10-07
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Expires: 2022-08-06
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Abstract

Abstract A new method for CVD deposition on a substrate is taught wherein radical species are used in alternate steps to depositions from a molecular precursor to treat the material deposited from the molecular precursor and to prepare the substrate surface with a reactive chemical in preparation for the next molecular precursor step. By repetitive cycles a composite integrated film is produced. In a preferred embodiment the depositions from the molecular precursor are metals, and the radicals in the alternate steps are used to remove ligands left from the metal precursor reactions, and to oxidize or nitridize the metal surface in subsequent layers. A variety of alternative chemistries are taught for different films, and hardware combinations to practice the invention are taught as well.

Inventors

  • 👤 Ofer Sneh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 01:09
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/448; C23C16/452; C23C16/455; C23C16/45523; C23C16/45525; C23C16/45527; C23C16/45536; C23C16/4554; H; H10; H10P; H10P14/00; H10P14/40; H10P14/42; H10P14/43; H10P14/432; H10P14/60; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/6339; H10P14/69; H10P14/692; H10P14/6938; H10P14/6939; H10P14/69391

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 104 words
A method of depositing metal on a substrate in a deposition chamber, the method comprising the following steps in the order shown: (a) preparing a surface of the substrate for chemical reactivity with a first metal-bearing precursor (b) depositing a first layer of metal on the surface by flowing the first metal-bearing precursor over the surface; (c) flowing one or more radicalized species over the layer deposited in step (b), thereby conditioning the layer for chemical reactivity with a second precursor; (d) depositing a second layer of metal on the first layer by flowing the second precursor over the layer deposited in step (b).
Claim 2
Independent Claim 104 words
A method of depositing metal on a substrate in a deposition chamber, the method comprising the following steps in the order shown: (a) preparing a surface of the substrate for chemical reactivity with a first metal-bearing precursor (b) depositing a first layer of metal on the surface by flowing the first metal-bearing precursor over the surface; (c) flowing one or more radicalized species over the layer deposited in step (b), thereby conditioning the layer for chemical reactivity with a second precursor; (d) depositing a second layer of metal on the first layer by flowing the second precursor over the layer deposited in step (b).
Claim 3
Dependent Claim 25 words
The method of claim 1 , wherein the preparing step is performed by flowing one or more radicalized species over the surface of the substrate.
Claim 4
Dependent Claim 27 words
The method of claim 2 , wherein one or more by-products are formed in the chemical reaction between the precursor and the prepared surface of the substrate.
Claim 5
Dependent Claim 17 words
The method of claim 1 , wherein the first precursor is the same as the second precursor.
Claim 6
Dependent Claim 18 words
The method of claim 1 , wherein the first precursor is not the same as the second precursor.

References Cited (Backward Citations)

US5585167A Cited
US5916365A Cited
US20030070617A1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2006-10-06 2007-04-07 2007-10-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2010-10-06 2011-04-07 2011-10-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2014-10-06 2015-04-07 2015-10-07 $7700.00 Window Closed / Lapsed

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