US6628520B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method, apparatus, and system for cooling electronic components
Assignee: Hewlett Packard Enterprise Development LP
•
Filing: 2002-02-06
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Granted: 2003-09-30
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Expires: 2022-02-06
Abstract
Abstract An apparatus, method, and system for cooling electronic components is disclosed. The apparatus includes liquid-to-air heat exchange equipment mounted to an enclosure for cooling the electronic components housed therein. In one embodiment the apparatus is a self-contained, stand-alone unit. In another embodiment the apparatus is connected to a remote heat exchange device. The system includes several of the apparatus arranged in parallel and is controlled to balance and optimize efficiency among the several apparatus.
Inventors
- 👤 Chandrakant D. Patel
- 👤 Abdlmonem H. Beitelmal
- 👤 Cullen E. Bash
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 03:38
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20709; H05K7/20754
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
119 words
An apparatus for cooling electronic components, said apparatus comprising: means for enclosing said electronic components; means for mounting said electronic components within said means for enclosing said electronic components; and means for cooling said electronic components, said means for cooling comprising: means for exchanging heat mounted to said means for enclosing; means for communicating air through said means for enclosing, said means for communicating air comprising: means for conveying air across said means for exchanging heat to cool said air; and means for supplying said air to said electronic components, thereby cooling said electronic components and warming said air; means for moving said air through said means for communicating; and means for controlling temperature within said means for enclosing.
Claim 2
Independent Claim
119 words
An apparatus for cooling electronic components, said apparatus comprising: means for enclosing said electronic components; means for mounting said electronic components within said means for enclosing said electronic components; and means for cooling said electronic components, said means for cooling comprising: means for exchanging heat mounted to said means for enclosing; means for communicating air through said means for enclosing, said means for communicating air comprising: means for conveying air across said means for exchanging heat to cool said air; and means for supplying said air to said electronic components, thereby cooling said electronic components and warming said air; means for moving said air through said means for communicating; and means for controlling temperature within said means for enclosing.
Claim 3
Dependent Claim
17 words
The apparatus as claimed in claim 1 , wherein said means for enclosing comprises an EIA enclosure.
Claim 4
Dependent Claim
26 words
The apparatus as claimed in claim 1 , wherein said means for mounting comprises at least one mounting board to which said electronic components are mounted.
Claim 5
Dependent Claim
52 words
The apparatus as claimed in claim 3 , wherein said means for mounting said electronic components further comprises means for docking said at least one mounting board to said means for enclosing said electronic components, such that said electronic components are powered by and are in communication with said means for enclosing.
Claim 6
Dependent Claim
25 words
The apparatus as claimed in claim 1 , wherein said means for exchanging heat comprises a liquid-to-air heat exchanger mounted to said means for enclosing.
Claim 7
Dependent Claim
48 words
The apparatus as claimed in claim 5 , further comprising: a chiller located remotely external of said means for enclosing; and a fluid supply line connecting from said chiller to said liquid-to-air heat exchanger; and a fluid return line connecting from said liquid-to-air heat exchanger to said chiller.
Claim 8
Dependent Claim
57 words
The apparatus as claimed in claim 6 , further comprising at least one valve for metering fluid through said liquid-to-air heat exchanger, said at least one valve being in fluidic communication with at least one of said fluid supply and return lines, said at least one valve being in electrical communication with said means for controlling temperature.
Claim 9
Dependent Claim
45 words
The apparatus as claimed in claim 5 , further comprising: a condenser mounted to said means for enclosing; a fluid supply line connecting from said condenser to said liquid-to-air heat exchanger; and a fluid return line connecting from said liquid-to-air heat exchanger to said condenser.
Claim 10
Dependent Claim
57 words
The apparatus as claimed in claim 8 , further comprising at least one valve for metering fluid through said liquid-to-air heat exchanger, said at least one valve being in fluidic communication with at least one of said fluid supply and return lines, said at least one valve being in electrical communication with said means for controlling temperature.
Claim 11
Dependent Claim
31 words
The apparatus as claimed in claim 1 , wherein said means for moving said air comprises at least one variable speed blower in electrical communication with said means for controlling temperature.
Claim 12
Dependent Claim
37 words
The apparatus as claimed in claim 10 , wherein said means for supplying said air comprises a supply plenum being in fluidic communication with said at least one blower, said supply plenum having at least one outlet.
Claim 13
Dependent Claim
46 words
The apparatus as claimed in claim 11 , further comprising at least one variable outlet device in fluidic communication with said at least one outlet of said supply plenum, said at least one variable outlet device being in electrical communication with said means for controlling temperature.
Claim 14
Dependent Claim
36 words
The apparatus as claimed in claim 12 , wherein said at least one variable outlet device comprises: at least one nozzle; and at least one air valve in fluidic communication with said at least one nozzle.
Claim 15
Independent Claim
48 words
The apparatus as claimed in 11 , wherein said means for communicating further comprises a return plenum having at least one inlet in fluidic communication with said at least one outlet of said supply plenum, said return plenum being in fluidic communication with said means for conveying air.
Claim 16
Dependent Claim
52 words
The apparatus as claimed in claim 1 , wherein said means for controlling temperature comprises: at least one temperature sensing device mounted within said means for enclosing; and a control chip mounted to said means for enclosing, said control chip being in electrical communication with said at least one temperature sensing device.
Claim 17
Dependent Claim
58 words
The apparatus as claimed in claim 15 , wherein said control chip is responsive to input from at least one of said at least one temperature sensing device and said means for mounting to vary output to at least one of said means for exchanging heat, said means for communicating air, and said means for moving said air.
Claim 18
Independent Claim
108 words
An apparatus for cooling electronic components, said apparatus comprising: an enclosure; at least one mounting board mounted to said enclosure, said at least one mounting board having said electronic components mounted thereto; a supply plenum having at least one outlet directed toward said at least one mounting board; at least one heat exchanging device mounted to said enclosure; and at least one blower mounted to said enclosure, said at least one blower being fluidically interposed said at least one heat exchanging device and said supply plenum to move air from said at least one heat exchanging device, through said plenum, and past said at least one mounting board.
Claim 19
Independent Claim
108 words
An apparatus for cooling electronic components, said apparatus comprising: an enclosure; at least one mounting board mounted to said enclosure, said at least one mounting board having said electronic components mounted thereto; a supply plenum having at least one outlet directed toward said at least one mounting board; at least one heat exchanging device mounted to said enclosure; and at least one blower mounted to said enclosure, said at least one blower being fluidically interposed said at least one heat exchanging device and said supply plenum to move air from said at least one heat exchanging device, through said plenum, and past said at least one mounting board.
Claim 20
Dependent Claim
39 words
The apparatus as claimed in claim 17 , wherein said at least one mounting board is docked to said enclosure such that said electronic components are powered by and are in communication with said enclosure through said mounting board.
Claim 21
Dependent Claim
27 words
The apparatus as claimed in claim 17 , further comprising: a variable outlet device in fluidic communication with said at least one outlet of said supply plenum.
Claim 22
Dependent Claim
53 words
The apparatus as claimed in claim 19 , wherein said variable outlet device comprises: at least one nozzle in fluidic communication with said at least one outlet of said supply plenum; and at least one air valve mounted in fluidic communication with said at least one nozzle to vary flow of air therethrough.
Claim 23
Dependent Claim
50 words
The apparatus as claimed in claim 17 , further comprising a return plenum mounted to said enclosure, said return plenum having at least one inlet in fluidic communication with said at least one outlet of said supply plenum, said return plenum being in fluidic communication with said heat exchanging device.
Claim 24
Dependent Claim
35 words
The apparatus as claimed in claim 17 , wherein said at least one heat exchanging device comprises an evaporator mounted to said enclosure, said evaporator having a supply line and a return line connected thereto.
Claim 25
Dependent Claim
32 words
The apparatus as claimed in claim 22 , wherein said at least one heat exchanging device further comprises a remotely located chiller connected to said evaporator by said supply and return lines.
Claim 26
Dependent Claim
35 words
The apparatus as claimed in claim 23 , wherein said at least one heat exchanging device further comprises at least one valve in fluidic communication with at least one of said supply and return lines.
Claim 27
Dependent Claim
33 words
The apparatus as claimed in claim 22 , wherein said at least one heat exchanging device further comprises a compressor and a condenser connected to said evaporator by said supply and return lines.
Claim 28
Dependent Claim
35 words
The apparatus as claimed in claim 25 , wherein said at least one heat exchanging device further comprises at least one valve in fluidic communication with at least one of said supply and return lines.
Claim 29
Dependent Claim
93 words
The apparatus as claimed in claim 17 , further comprising: at least one temperature sensing device mounted within said enclosure; and a control chip mounted to said enclosure, said control chip being electronically connected to and receiving input from at least one of said at least one temperature sensing device and said mounting board, said control chip being electronically connected to and transmitting output to at least one of said at least one heat exchanging device, said at least one blower, and said at least one air valve to vary the performance thereof.
Claim 30
Dependent Claim
43 words
The apparatus as claimed in claim 27 , further comprising a vent for regulating humidity, said vent being mounted to the enclosure so as to permit air from without said enclosure to enter said enclosure, said vent being controlled by said control chip.
Claim 31
Independent Claim
110 words
A method of cooling electronic components, said method comprising the steps of: providing mounting boards having said electronic components mounted thereto; docking said mounting boards within an enclosure; sensing at least one of temperature and power draw in at least one location within said enclosure; cooling said electronic components, said cooling step comprising the steps of: exchanging heat between one medium and air within said enclosure to produce cooled air by using a heat exchanging device; and moving said cooled air into contact with said electronic components to cool said electronic components; and adjusting said steps of exchanging heat and moving said cooled air in response to said sensing step.
Claim 32
Independent Claim
110 words
A method of cooling electronic components, said method comprising the steps of: providing mounting boards having said electronic components mounted thereto; docking said mounting boards within an enclosure; sensing at least one of temperature and power draw in at least one location within said enclosure; cooling said electronic components, said cooling step comprising the steps of: exchanging heat between one medium and air within said enclosure to produce cooled air by using a heat exchanging device; and moving said cooled air into contact with said electronic components to cool said electronic components; and adjusting said steps of exchanging heat and moving said cooled air in response to said sensing step.
Claim 33
Dependent Claim
28 words
The method as claimed in claim 29 , wherein said moving step comprises blowing air from said heat exchanging device, through a plenum, and across said electronic components.
Claim 34
Dependent Claim
23 words
The method as claimed in claim 30 , wherein said moving step further comprises regulating airflow into said enclosure to regulate humidity therein.
Claim 35
Independent Claim
89 words
A method of cooling electronic components, said method comprising the steps of: providing an enclosure to house said electronic components; sensing at least one of temperature and power draw in at least one location within said enclosure; exchanging heat between one medium and air within said enclosure to produce cooled air using a heat exchanging device; moving said cooled air into contact with said electronic components to cool said electronic components; and adjusting said steps of exchanging heat and moving said cooled air in response to said sensing step.
Claim 36
Independent Claim
89 words
A method of cooling electronic components, said method comprising the steps of: providing an enclosure to house said electronic components; sensing at least one of temperature and power draw in at least one location within said enclosure; exchanging heat between one medium and air within said enclosure to produce cooled air using a heat exchanging device; moving said cooled air into contact with said electronic components to cool said electronic components; and adjusting said steps of exchanging heat and moving said cooled air in response to said sensing step.
Claim 37
Dependent Claim
29 words
The method as claimed in claim 32 , wherein said step of moving said cooled air comprises the step of regulating airflow into said enclosure to control humidity therein.
Claim 38
Independent Claim
313 words
A system for cooling electronic components, said system comprising: a plurality of enclosures, each enclosure of said plurality of enclosures comprising: at least one mounting board mounted to said each enclosure, said at least one mounting board having said electronic components mounted thereto, a supply plenum having at least one outlet directed toward said at least one mounting board; at least one heat exchanging device mounted to said each enclosure; a coolant supply line fluidically connected to said at least one heat exchanging device; at least one valve fluidically connected to said coolant supply line for varying fluid flow to said at least one heat exchanging device; at least one blower mounted to said each enclosure, said at least one blower being fluidically interposed said at least one heat exchanging device and said supply plenum to move air from said at least one heat exchanging device, through said supply plenum, and past said at least one mounting board; at least one variable outlet device in fluidic communication with said at least one outlet of said supply plenum; and at least one temperature sensing device mounted within said enclosure; at least one common coolant supply line fluidically connected to each said coolant supply line of each of said plurality of enclosures; and at least one control chip mounted to at least one of said plurality of enclosures, said at least one control chip being electronically connected to receive input from at least one of said at least one temperature sensing device and said mounting board, said control chip being electronically connected to transmit output to at least one of said at least one valve, said at least one blower, and said at least one variable outlet device to vary the performance of each enclosure of said plurality of enclosures individually and to vary the performance of said plurality of enclosures collectively as a system.
Claim 39
Independent Claim
313 words
A system for cooling electronic components, said system comprising: a plurality of enclosures, each enclosure of said plurality of enclosures comprising: at least one mounting board mounted to said each enclosure, said at least one mounting board having said electronic components mounted thereto, a supply plenum having at least one outlet directed toward said at least one mounting board; at least one heat exchanging device mounted to said each enclosure; a coolant supply line fluidically connected to said at least one heat exchanging device; at least one valve fluidically connected to said coolant supply line for varying fluid flow to said at least one heat exchanging device; at least one blower mounted to said each enclosure, said at least one blower being fluidically interposed said at least one heat exchanging device and said supply plenum to move air from said at least one heat exchanging device, through said supply plenum, and past said at least one mounting board; at least one variable outlet device in fluidic communication with said at least one outlet of said supply plenum; and at least one temperature sensing device mounted within said enclosure; at least one common coolant supply line fluidically connected to each said coolant supply line of each of said plurality of enclosures; and at least one control chip mounted to at least one of said plurality of enclosures, said at least one control chip being electronically connected to receive input from at least one of said at least one temperature sensing device and said mounting board, said control chip being electronically connected to transmit output to at least one of said at least one valve, said at least one blower, and said at least one variable outlet device to vary the performance of each enclosure of said plurality of enclosures individually and to vary the performance of said plurality of enclosures collectively as a system.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-09-29 | 2007-03-31 | 2007-09-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-09-29 | 2011-03-31 | 2011-09-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-09-29 | 2015-03-31 | 2015-09-30 | $7700.00 | Window Closed / Lapsed |