Patent US6620253B1 successfully refreshed from Google Patents.
US6620253B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Engagement mechanism for semiconductor substrate deposition process kit hardware
Assignee: Micron Technology Inc
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Filing: 2002-06-05
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Granted: 2003-09-16
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Expires: 2022-06-05
Abstract
Abstract The invention includes an engagement mechanism for semiconductor substrate deposition process kit hardware, including a body having a distal portion and a proximal portion. The body is sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing. At least engager is mounted to the distal portion of the body The engager is sized for movement through said passageway with the body. The engager is configured to releasably engage a component of process kit hardware received within said chamber. The invention includes methods of replacing at least a portion of semiconductor substrate deposition process kit hardware. The invention includes methods of depositing materials over a plurality of semiconductor substrates. Other implementations are contemplated.
Inventors
- 👤 Ross S. Dando
- 👤 Craig M. Carpenter
- 👤 Philip H. Campbell
- 👤 Allen P. Mardian
- 👤 Gurtej S. Sandhu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 04:04
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/4401; C23C16/54; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10S414/137
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
92 words
An engagement mechanism for semiconductor substrate deposition process kit hardware, comprising: a body having a distal portion and a proximal portion, the body being sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing; and at least one engager mounted to the distal portion of the body, the engager being sized for movement through said passageway with the body, the engager being configured to releasably engage a component of process kit hardware received within said chamber.
Claim 2
Dependent Claim
92 words
An engagement mechanism for semiconductor substrate deposition process kit hardware, comprising: a body having a distal portion and a proximal portion, the body being sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing; and at least one engager mounted to the distal portion of the body, the engager being sized for movement through said passageway with the body, the engager being configured to releasably engage a component of process kit hardware received within said chamber.
Claim 3
Dependent Claim
15 words
The mechanism of claim 1 comprising multiple of said engagers mounted to the distal portion.
Claim 4
Dependent Claim
19 words
The mechanism of claim 1 comprising two diametrically opposed engagers, one of the two comprising said at least one.
Claim 5
Dependent Claim
34 words
The mechanism of claim 1 comprising two diametrically opposed engagers, one of the two comprising said at least one, the two engagers being mechanical engagers mounted for movement towards and away from one another.
Claim 6
Dependent Claim
40 words
The mechanism of claim 1 comprising two diametrically opposed engagers, one of the two comprising said at least one, the two engagers being mechanical engagers mounted for movement towards and away from one another, and about respective axes of rotation.
Claim 7
Dependent Claim
26 words
The mechanism of claim 1 wherein the distal portion includes at least one distalmost end, the engager being mounted to extend beyond the one distalmost end.
Claim 8
Dependent Claim
19 words
The mechanism of claim 1 wherein the engager is a mechanical engager mounted for movement relative to the body.
Claim 9
Dependent Claim
20 words
The mechanism of claim 1 wherein the engager is a mechanical engager mounted for rotational movement relative to the body.
Claim 10
Dependent Claim
21 words
The mechanism of claim 1 wherein the engager is a mechanical engager mounted for eccentric rotational movement relative to the body.
Claim 11
Dependent Claim
40 words
The mechanism of claim 1 wherein the body is elongated along a longitudinal axis, the engager being a mechanical engager mounted for rotational movement relative to the body about an axis of rotation which is generally transverse the longitudinal axis.
Claim 12
Dependent Claim
28 words
The mechanism of claim 1 wherein the engager is a mechanical engager mounted for rotational movement relative to the body about an axis of rotation which is horizontal.
Claim 13
Dependent Claim
28 words
The mechanism of claim 1 wherein the engager is a mechanical engager mounted for rotational movement relative to the body about an axis of rotation which is vertical.
Claim 14
Dependent Claim
14 words
The mechanism of claim 1 wherein the process kit hardware comprises a heater cover.
Claim 15
Dependent Claim
119 words
An engagement mechanism for semiconductor substrate deposition process kit hardware, comprising: a body having a distal portion and a proximal portion, the body being sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing; a first engager mounted to the distal portion of the body, the first engager being sized for movement through said passageway with the body; a second engager mounted to the proximal portion of the body, the second engager being sized for movement through said passageway with the body; and the first and second engagers being configured to releasably engage a component of process kit hardware received within said chamber.
Claim 16
Dependent Claim
119 words
An engagement mechanism for semiconductor substrate deposition process kit hardware, comprising: a body having a distal portion and a proximal portion, the body being sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing; a first engager mounted to the distal portion of the body, the first engager being sized for movement through said passageway with the body; a second engager mounted to the proximal portion of the body, the second engager being sized for movement through said passageway with the body; and the first and second engagers being configured to releasably engage a component of process kit hardware received within said chamber.
Claim 17
Dependent Claim
21 words
The mechanism of claim 14 wherein the first and second engagers are mechanical engagers mounted for movement relative to the body.
Claim 18
Dependent Claim
23 words
The mechanism of claim 14 wherein the first and second engagers are mechanical engagers mounted for movement towards and away from one another.
Claim 19
Dependent Claim
28 words
The mechanism of claim 14 wherein the first and second engagers are mechanical engagers which are diametrically opposed and mounted for movement towards and away from one another.
Claim 20
Dependent Claim
29 words
The mechanism of claim 14 wherein the first and second engagers are mechanical engagers mounted for movement towards and away from one another, and about respective axes of rotation.
Claim 21
Dependent Claim
17 words
The mechanism of claim 14 comprising multiple of said first engagers and multiple of said second engagers.
Claim 22
Dependent Claim
16 words
The mechanism of claim 14 wherein the first and second engagers are of a common construction.
Claim 23
Dependent Claim
25 words
The mechanism of claim 14 wherein at least one of the first and second engagers is mechanically mounted for rotational movement relative to the body.
Claim 24
Dependent Claim
27 words
The mechanism of claim 14 wherein at least one of the first and second the engagers is mechanically mounted for eccentric rotational movement relative to the body.
Claim 25
Dependent Claim
14 words
The mechanism of claim 14 wherein the process kit hardware comprises a heater cover.
Claim 26
Dependent Claim
72 words
An engagement mechanism for semiconductor substrate deposition process kit hardware, comprising: a body sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing; and a plurality of suction openings associated with the body for movement through said passageway, the suction openings being configured to releasably engage a component of process kit hardware received within said chamber.
Claim 27
Dependent Claim
72 words
An engagement mechanism for semiconductor substrate deposition process kit hardware, comprising: a body sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing; and a plurality of suction openings associated with the body for movement through said passageway, the suction openings being configured to releasably engage a component of process kit hardware received within said chamber.
Claim 28
Dependent Claim
13 words
The mechanism of claim 24 wherein the suction openings comprise flexible suction cups.
Claim 29
Dependent Claim
19 words
The mechanism of claim 24 wherein the suction openings are oriented generally transverse a longitudinal orientation of the body.
Claim 30
Dependent Claim
19 words
The mechanism of claim 24 wherein the suction openings are even in number, and arranged in diametrically opposing pairs.
Claim 31
Dependent Claim
27 words
The mechanism of claim 24 wherein the body comprises a plurality of projecting arms, respective of the suction opening being received proximate distal ends of the arms.
Claim 32
Dependent Claim
27 words
The mechanism of claim 24 wherein, the suction openings comprise flexible suction cups; and the suction cups are oriented generally transverse a longitudinal orientation of the body.
Claim 33
Dependent Claim
27 words
The mechanism of claim 24 wherein, the suction openings comprise flexible suction cups; and the suction cups are even in number, and arranged in diametrically opposing pairs.
Claim 34
Dependent Claim
35 words
The mechanism of claim 24 wherein, the suction openings comprise flexible suction cups; and the body comprises a plurality of projecting arms, respective of the suction cups being received proximate distal ends of the arms.
Claim 35
Dependent Claim
14 words
The mechanism of claim 24 wherein the process kit hardware comprises a heater cover.
Claim 36
Dependent Claim
109 words
An engagement mechanism for semiconductor substrate deposition process kit hardware, comprising: a support having a first end and a second end; a plurality of arms extending outwardly of the support proximate the second end, the respective arms having a proximal portion and a distal portion; an engager mounted to the respective distal portion of the respective arms, the engagers collectively being configured to releasably engage a component of process kit hardware received within a semiconductor substrate deposition chamber; and the support, arms and engagers collectively being sized for movement through a passageway of said chamber through which semiconductor substrates pass into and out of said chamber for deposition processing.
Claim 37
Dependent Claim
109 words
An engagement mechanism for semiconductor substrate deposition process kit hardware, comprising: a support having a first end and a second end; a plurality of arms extending outwardly of the support proximate the second end, the respective arms having a proximal portion and a distal portion; an engager mounted to the respective distal portion of the respective arms, the engagers collectively being configured to releasably engage a component of process kit hardware received within a semiconductor substrate deposition chamber; and the support, arms and engagers collectively being sized for movement through a passageway of said chamber through which semiconductor substrates pass into and out of said chamber for deposition processing.
Claim 38
Dependent Claim
14 words
The mechanism of claim 33 wherein the engagers are all of a common construction.
Claim 39
Dependent Claim
18 words
The mechanism of claim 33 wherein the engagers are all of a common construction, and comprise suction openings.
Claim 40
Dependent Claim
19 words
The mechanism of claim 33 wherein the engagers are all of a common construction, and comprise flexible suction cups.
Claim 41
Dependent Claim
28 words
The mechanism of claim 33 wherein the engagers are all of a common construction, and comprise mechanical engagers mounted for mechanical movement relative to the respective distal portions.
Claim 42
Dependent Claim
25 words
The mechanism of claim 33 wherein the respective distal portions have a distal end, the respective engagers being mounted to extend beyond the distal ends.
Claim 43
Dependent Claim
14 words
The mechanism of claim 33 wherein the process kit hardware comprises a heater cover.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-09-15 | 2007-03-17 | 2007-09-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-09-15 | 2011-03-17 | 2011-09-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-09-15 | 2015-03-17 | 2015-09-16 | $7700.00 | Window Closed / Lapsed |