US6596569B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin film transistors
Assignee: Nokia of America Corp
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Filing: 2002-03-15
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Granted: 2003-07-22
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Expires: 2022-03-15
Abstract
Abstract The specification describes a lamination method for thin film transistor TFT devices wherein each ply of the laminate is a polymer and each contains a portion of the TFT or the interconnection circuit. The plies are laminated together using a solid adhesive polymer layer on the surface of one or both of the plies. The solid adhesive polymer layer has a low elastic modulus that provides effective encapsulation of the TFT, and laminates the plies without high heat or pressure.
Inventors
- 👤 Zhenan Bao
- 👤 Peter Kian-Hoon Ho
- 👤 Yueh-Lin Loo
- 👤 John A. Rodgers
- 👤 Takao Someya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:13
CPC Classifications
B; B82; B82Y; B82Y10/00; H; H10; H10K; H10K10/00; H10K10/40; H10K10/46; H10K10/462; H10K10/464; H10K10/466; H10K19/00; H10K19/10; H10K71/00; H10K71/50; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10W; H10W10/00; H10W10/10; H10W10/181; H10K77/00; H10K77/10; H10K77/111; H10K85/00; H10K85/10; H10K85/111; H10K85/113; H10K85/30; H10K85/311; H10K85/60; H10K85/615; H10K85/621
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
85 words
A method for manufacturing a thin film transistor (TFT) device, the TFT device comprising TFT elements, comprising the steps of: a. preparing a first substrate, the substrate comprising a polymer material, by forming a solid adhesive polymer layer on the substrate, and forming at least one TFT element on the solid adhesive polymer layer layer, b. preparing a second substrate, the substrate comprising a polymer material, by forming at least one TFT element on the substrate, and c. laminating the first and second substrates together.
Claim 2
Independent Claim
85 words
A method for manufacturing a thin film transistor (TFT) device, the TFT device comprising TFT elements, comprising the steps of: a. preparing a first substrate, the substrate comprising a polymer material, by forming a solid adhesive polymer layer on the substrate, and forming at least one TFT element on the solid adhesive polymer layer layer, b. preparing a second substrate, the substrate comprising a polymer material, by forming at least one TFT element on the substrate, and c. laminating the first and second substrates together.
Claim 3
Dependent Claim
14 words
The method of claim 1 wherein the first and second substrate are continuous tapes.
Claim 4
Dependent Claim
35 words
The method of claim 1 wherein the TFT elements on the first substrate comprise source and drain electrodes and the TFT elements on the second substrate comprise TFT gates, gate dielectric layers, and semiconductor layers.
Claim 5
Dependent Claim
29 words
The method of claim 1 wherein one of the TFT elements is a gate dielectric layer and the gate dielectric and the solid adhesive polymer layer are the same.
Claim 6
Dependent Claim
33 words
The method of claim 1 additionally including the step of forming a solid adhesive polymer layer on the second substrate and forming at least one TFT element on the solid adhesive polymer layer.
Claim 7
Dependent Claim
24 words
The method of claim 2 wherein the tapes are reeled onto reels, then reeled off the reels and pressed together to laminate them together.
Claim 8
Dependent Claim
14 words
The method of claim 1 wherein the substrates are laminated together at room temperature.
Claim 9
Dependent Claim
14 words
The method of claim 1 wherein the substrates are laminated together using UV radiation.
Claim 10
Dependent Claim
13 words
The method of claim 1 wherein the solid adhesive polymer layer is PDMS.
Claim 11
Dependent Claim
14 words
The method of claim 9 wherein at least one of the substrates comprises PET.
Claim 12
Dependent Claim
19 words
The method of claim 1 wherein the substrates are laminated together using a pressure of less than 50 psi.
Claim 13
Independent Claim
63 words
A method for manufacturing a thin film transistor (TFT) device comprising: a. preparing a first substrate, the substrate comprising a polymer material, by forming a solid adhesive polymer layer on the substrate, and forming the TFT transistor on the solid adhesive polymer layer, b. preparing a second substrate, the substrate comprising a polymer material, and c. laminating the first and second substrates together.
Claim 14
Independent Claim
63 words
A method for manufacturing a thin film transistor (TFT) device comprising: a. preparing a first substrate, the substrate comprising a polymer material, by forming a solid adhesive polymer layer on the substrate, and forming the TFT transistor on the solid adhesive polymer layer, b. preparing a second substrate, the substrate comprising a polymer material, and c. laminating the first and second substrates together.
Claim 15
Dependent Claim
15 words
The method of claim 12 wherein the second substrate has a solid adhesive polymer layer.
Claim 16
Dependent Claim
19 words
The method of claim 13 wherein the substrates are laminated together using a pressure of less than 50 psi.
Claim 17
Independent Claim
61 words
A method for manufacturing a thin film transistor (TFT) device comprising: a. preparing a first substrate, the substrate comprising a polymer material, and forming the TFT device on the polymer material, b. preparing a second substrate, the substrate comprising a polymer material by forming a solid adhesive polymer layer on the substrate, and c. laminating the first and second substrates together.
Claim 18
Independent Claim
61 words
A method for manufacturing a thin film transistor (TFT) device comprising: a. preparing a first substrate, the substrate comprising a polymer material, and forming the TFT device on the polymer material, b. preparing a second substrate, the substrate comprising a polymer material by forming a solid adhesive polymer layer on the substrate, and c. laminating the first and second substrates together.
Claim 19
Dependent Claim
19 words
The method of claim 15 wherein the substrates are laminated together using a pressure of less than 50 psi.
References Cited (Backward Citations)
US6127199A
Cited
US6197663B1
Cited
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