US6556884B1 — Method and apparatus for interfacing a statistica…

Claim 1

Independent Claim 105 words

A method, comprising: defining a manufacturing model; processing semiconductor devices in a manufacturing facility as defined by said manufacturing model; performing a process control analysis on the processed semiconductor devices using a process controller, said process control analysis comprising acquiring metrology data relating to said processing of semiconductor devices; performing a statistical process control analysis on said processed semiconductor devices using an SPC controller; interfacing said process controller and said SPC controller; and modifying said manufacturing model in response to said process control analysis and said statistical process control analysis, during at least a portion of the time period when said semiconductor devices are processed.

Claim 2

Independent Claim 105 words

A method, comprising: defining a manufacturing model; processing semiconductor devices in a manufacturing facility as defined by said manufacturing model; performing a process control analysis on the processed semiconductor devices using a process controller, said process control analysis comprising acquiring metrology data relating to said processing of semiconductor devices; performing a statistical process control analysis on said processed semiconductor devices using an SPC controller; interfacing said process controller and said SPC controller; and modifying said manufacturing model in response to said process control analysis and said statistical process control analysis, during at least a portion of the time period when said semiconductor devices are processed.

Claim 3

Dependent Claim 26 words

The method described in claim 1 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes a photolithography process for semiconductor devices.

Claim 4

Dependent Claim 26 words

The method described in claim 1 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes an etching process for semiconductor devices.

Claim 5

Dependent Claim 26 words

The method described in claim 1 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes a deposition process for semiconductor devices.

Claim 6

Dependent Claim 26 words

The method described in claim 1 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes an implantation process for semiconductor devices.

Claim 7

Dependent Claim 27 words

The method described in claim 1 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes a chemical-mechanical polishing process for semiconductor devices.

Claim 8

Dependent Claim 20 words

The method described in claim 1 , wherein performing a process control analysis further comprises performing a fault detection analysis.

Claim 9

Dependent Claim 49 words

The method described in claim 7 , wherein performing a fault detection analysis further comprises: acquiring production data; performing process controller performance monitoring using said production data; modifying said manufacturing model in response to said process controller performance monitoring; and implementing said modified manufacturing model in said process controller.

Claim 10

Dependent Claim 20 words

The method described in claim 8 , wherein acquiring production data further comprises acquiring metrology data using a metrology tool.

Claim 11

Dependent Claim 62 words

The method described in claim 1 , wherein performing a statistical process control analysis further comprises: measuring a manufacturing parameter; calculating modification data based upon said manufacturing parameter; performing statistical process control analysis; performing results versus prediction analysis based upon said statistical process control analysis; and modifying said manufacturing model based upon said calculated modification data and said results versus prediction analysis.

Claim 12

Dependent Claim 20 words

The method described in claim 10 , wherein measuring manufacturing parameter further comprises measuring metrology data using a metrology tool.

Claim 13

Dependent Claim 21 words

The method described in claim 10 , wherein measuring metrology data further comprises measuring a misalignment error on a semiconductor wafer.

Claim 14

Dependent Claim 21 words

The method described in claim 10 , wherein measuring metro logy data further comprises measuring a misregistration on a semiconductor wafer.

Claim 15

Dependent Claim 21 words

The method described in claim 10 , wherein measuring metrology data further comprises measuring polish thickness error on a semiconductor wafer.

Claim 16

Dependent Claim 29 words

The method described in claim 10 , wherein performing results versus prediction analysis further comprises comparing a predicted manufacturing process behavior to a result of a measured manufacturing process.

Claim 17

Independent Claim 119 words

A system, comprising: a processing controller; a processing tool coupled with said processing controller; a metrology tool interfaced with said processing tool; a communications interface coupled with said processing controller, said communications interface being capable of sending feedback signals to said processing controller; a control modification data calculation unit interfaced with said metrology and connected to said communications interface in a feedback manner for performing feedback adjustments; a predictor function interfaced with said processing controller; an statistical process control analysis unit interfaced with said predictor function and said processing tool; and a results versus prediction analysis unit interfaced with said statistical process control analysis unit and connected to said communications interface in a feedback manner for performing feedback adjustments.

Claim 18

Independent Claim 119 words

A system, comprising: a processing controller; a processing tool coupled with said processing controller; a metrology tool interfaced with said processing tool; a communications interface coupled with said processing controller, said communications interface being capable of sending feedback signals to said processing controller; a control modification data calculation unit interfaced with said metrology and connected to said communications interface in a feedback manner for performing feedback adjustments; a predictor function interfaced with said processing controller; an statistical process control analysis unit interfaced with said predictor function and said processing tool; and a results versus prediction analysis unit interfaced with said statistical process control analysis unit and connected to said communications interface in a feedback manner for performing feedback adjustments.

Claim 19

Dependent Claim 15 words

The system described in claim 16 , wherein said processing controller is a run-to-run controller.

Claim 20

Dependent Claim 18 words

The system described in claim 16 , wherein said processing controller is an automatic process control (APC) system.

Claim 21

Dependent Claim 24 words

The system described in claim 16 , wherein said control modification data calculation unit is a computer software program integrated into said processing controller.

Claim 22

Dependent Claim 21 words

The system described in claim 16 , wherein said predictor function is a computer software program integrated into a manufacturing model.

Claim 23

Dependent Claim 19 words

The system described in claim 16 , wherein said statistical process control analysis unit is a computer software program.

Claim 24

Dependent Claim 19 words

The system described in claim 16 , wherein said results versus prediction analysis unit is a computer software program.

Claim 25

Independent Claim 105 words

An apparatus, comprising: a manufacturing facility capable of manufacturing semiconductor devices; an automatic process control manufacturing framework coupled with said manufacturing facility, said automatic process control manufacturing framework being capable of performing fine-tune adjustments to said manufacturing facility; a statistical process control manufacturing framework coupled with said manufacturing facility, said automatic process control manufacturing framework being capable of performing large scale adjustments to said manufacturing facility; and a communications interface coupled with said automatic process control manufacturing framework and said statistical process control manufacturing framework, wherein said communication interface facilitates communication between said automatic process control manufacturing framework and said statistical process control manufacturing framework.

Claim 26

Independent Claim 105 words

An apparatus, comprising: a manufacturing facility capable of manufacturing semiconductor devices; an automatic process control manufacturing framework coupled with said manufacturing facility, said automatic process control manufacturing framework being capable of performing fine-tune adjustments to said manufacturing facility; a statistical process control manufacturing framework coupled with said manufacturing facility, said automatic process control manufacturing framework being capable of performing large scale adjustments to said manufacturing facility; and a communications interface coupled with said automatic process control manufacturing framework and said statistical process control manufacturing framework, wherein said communication interface facilitates communication between said automatic process control manufacturing framework and said statistical process control manufacturing framework.

Claim 27

Independent Claim 126 words

An apparatus for monitoring controller performance using statistical process control analysis, comprising: means for defining a manufacturing model; means for processing semiconductor devices in a manufacturing facility as defined by said manufacturing model; means for performing a process control analysis on the processed semiconductor devices using a process controller, said process control analysis comprising acquiring metrology data relating to said processing of semiconductor devices; means for performing a statistical process control analysis on said processed semiconductor devices using an SPC controller; means for interfacing said process controller and said SPC controller; and means for modifying said manufacturing model in response to said process control analysis and said statistical process control analysis during at least a portion of the time period when said semiconductor devices are processed.

Claim 28

Independent Claim 126 words

An apparatus for monitoring controller performance using statistical process control analysis, comprising: means for defining a manufacturing model; means for processing semiconductor devices in a manufacturing facility as defined by said manufacturing model; means for performing a process control analysis on the processed semiconductor devices using a process controller, said process control analysis comprising acquiring metrology data relating to said processing of semiconductor devices; means for performing a statistical process control analysis on said processed semiconductor devices using an SPC controller; means for interfacing said process controller and said SPC controller; and means for modifying said manufacturing model in response to said process control analysis and said statistical process control analysis during at least a portion of the time period when said semiconductor devices are processed.

Claim 29

Dependent Claim 121 words

A computer readable program storage device encoded with instructions that, when executed by a computer, performs a method, comprising: defining a manufacturing model; processing semiconductor devices in a manufacturing facility as defined by said manufacturing model; performing a process control analysis on the processed semiconductor devices using a process controller, said process control analysis comprising acquiring metrology data relating to said processing of semiconductor devices; performing a statistical process control analysis on said processed semiconductor devices using an SPC controller; interfacing said process controller and said SPC controller; and modifying said manufacturing model in response to said process control analysis and said. statistical process control analysis, during at least a portion of the time period when said semiconductor devices are processed.

Claim 30

Dependent Claim 121 words

A computer readable program storage device encoded with instructions that, when executed by a computer, performs a method, comprising: defining a manufacturing model; processing semiconductor devices in a manufacturing facility as defined by said manufacturing model; performing a process control analysis on the processed semiconductor devices using a process controller, said process control analysis comprising acquiring metrology data relating to said processing of semiconductor devices; performing a statistical process control analysis on said processed semiconductor devices using an SPC controller; interfacing said process controller and said SPC controller; and modifying said manufacturing model in response to said process control analysis and said. statistical process control analysis, during at least a portion of the time period when said semiconductor devices are processed.

Claim 31

Dependent Claim 42 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 25 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes a photolithography process for semiconductor devices.

Claim 32

Dependent Claim 42 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 25 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes an etching process for semiconductor devices.

Claim 33

Dependent Claim 42 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 1 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes a deposition process for semiconductor devices.

Claim 34

Dependent Claim 42 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 25 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes an implantation process for semiconductor devices.

Claim 35

Dependent Claim 43 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 25 , wherein defining a manufacturing model further comprises defining a manufacturing model that describes a chemical-mechanical polishing process for semiconductor devices.

Claim 36

Dependent Claim 36 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 25 , wherein performing a process control analysis further comprises performing a fault detection analysis.

Claim 37

Dependent Claim 65 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 31 , wherein performing a fault detection analysis further comprises: acquiring production data; performing process controller performance monitoring using said production data; modifying said manufacturing model in response to said process controller performance monitoring; and implementing said modified manufacturing model in said process controller.

Claim 38

Dependent Claim 36 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 32 , wherein acquiring production data further comprises acquiring metrology data using a metrology tool.

Claim 39

Dependent Claim 78 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 25 , wherein performing a statistical process control analysis further comprises: measuring a manufacturing parameter; calculating modification data based upon said manufacturing parameter; performing statistical process control analysis; performing results versus prediction analysis based upon said statistical process control analysis; and modifying said manufacturing model based upon said calculated modification data and said results versus prediction analysis.

Claim 40

Dependent Claim 37 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 34 , wherein measuring said manufacturing parameter further comprises measuring metrology data using a metrology tool.

Claim 41

Dependent Claim 37 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 34 , wherein measuring metrology data further comprises measuring a misalignment error on a semiconductor wafer.

Claim 42

Dependent Claim 36 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 34 , wherein measuring metrology data further comprises measuring a misregistration on a semiconductor wafer.

Claim 43

Dependent Claim 37 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 34 , wherein measuring metrology data further comprises measuring polish thickness error on a semiconductor wafer.

Claim 44

Dependent Claim 45 words

The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 34 , wherein performing results versus prediction analysis further comprises comparing a predicted manufacturing process behavior to a result of a measured manufacturing process.

Claim 45

Independent Claim 73 words

A method, comprising: providing a process controller to control processing of a semiconductor wafer; processing said semiconductor wafer; providing a Statistical Process Control (SPC) controller to perform a SPC analysis; interfacing said SPC controller with said process controller; and performing substantially concurrent fault detection and process control based upon said interfacing of said SPC controller and said process controller, during at least a portion of the time during processing of a semiconductor wafer.

Claim 46

Independent Claim 73 words

A method, comprising: providing a process controller to control processing of a semiconductor wafer; processing said semiconductor wafer; providing a Statistical Process Control (SPC) controller to perform a SPC analysis; interfacing said SPC controller with said process controller; and performing substantially concurrent fault detection and process control based upon said interfacing of said SPC controller and said process controller, during at least a portion of the time during processing of a semiconductor wafer.

Claim 47

Dependent Claim 20 words

The method of claim 40 , further comprising providing a manufacturing model to control said processing of said semiconductor wafer.

Claim 48

Dependent Claim 32 words

The method of claim 41 , further comprising modifying said manufacturing model to reduce a bias in said manufacturing model based upon said interfacing of said process controller and said SPC controller.

Claim 49

Dependent Claim 50 words

The method described in claim 41 , wherein performing a fault detection analysis further comprises: acquiring production data; performing a process controller performance monitoring using said production data; modifying said manufacturing model in response to said process controller performance monitoring; and implementing said modified manufacturing model in said process controller.

Claim 50

Dependent Claim 60 words

The method described in claim 41 , wherein performing said SPC analysis further comprises: measuring a manufacturing parameter; calculating modification data based upon said manufacturing parameter; performing statistical process control analysis; performing results versus prediction analysis based upon said statistical process control analysis; and modifying said manufacturing model based upon said calculated modification data and said results versus prediction analysis.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2006-04-28	2006-10-28	2007-04-29	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2010-04-28	2010-10-28	2011-04-29	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2014-04-28	2014-10-28	2015-04-29	$7700.00	Window Closed / Lapsed

Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework

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