US6548898B2
Expired / Lapsed
US
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External connection terminal and semiconductor device
Assignee: Socionext Inc
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Filing: 2001-07-02
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Granted: 2003-04-15
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Expires: 2021-07-02
Abstract
Abstract A structure in which a phosphorus-nickel layer, a rich phosphorus nickel layer that contains phosphorus or boron higher than this phosphorus-nickel layer, a nickel-tin ally layer, a tin-rich tin alloy layer, and a tin alloy solder layer are formed in sequence on an electrode. Accordingly, adhesiveness between a metal pattern used as the electrode, the wiring, or the pad and the solder can be improved.
Inventors
- 👤 Hirohisa Matsuki
- 👤 Yutaka Makino
- 👤 Masamitsu Ikumo
- 👤 Mitsutaka Sato
- 👤 Tetsuya Fujisawa
- 👤 Yoshitaka Aiba
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:19
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H10; H10P; H10P95/00; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/0198; H10W90/00; H10W90/701; H10W70/00; H10W70/60; H10W72/013; H10W72/01331; H10W72/019; H10W72/01931; H10W72/01933; H10W72/01935; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/221; H10W72/222; H10W72/223; H10W72/241; H10W72/242; H10W72/251; H10W72/29; H10W72/50; H10W72/59; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/9415; H10W72/981; H10W72/983
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
101 words
An external connection terminal comprising: an electrode formed on a substrate; a first-element containing nickel layer formed as a barrier metal on the electrode to contain a first element consisting of any one of phosphorus and boron; a rich first-element containing nickel layer formed on the first-element containing nickel layer to contain a greater concentration of the first element than that in the first-element containing nickel layer; a nickel-tin alloy layer formed on the rich first-element containing nickel layer; a tin alloy layer formed on the nickel-tin alloy layer; and a tin alloy solder layer formed on the tin alloy layer.
Claim 2
Dependent Claim
101 words
An external connection terminal comprising: an electrode formed on a substrate; a first-element containing nickel layer formed as a barrier metal on the electrode to contain a first element consisting of any one of phosphorus and boron; a rich first-element containing nickel layer formed on the first-element containing nickel layer to contain a greater concentration of the first element than that in the first-element containing nickel layer; a nickel-tin alloy layer formed on the rich first-element containing nickel layer; a tin alloy layer formed on the nickel-tin alloy layer; and a tin alloy solder layer formed on the tin alloy layer.
Claim 3
Dependent Claim
25 words
An external connection terminal according to claim 1 , wherein copper is contained in the nickel-tin alloy layer, and the tin alloy solder layer, respectively.
Claim 4
Dependent Claim
18 words
An external connection terminal according to claim 1 , wherein the tin alloy layer is a tin-palladium layer.
Claim 5
Dependent Claim
25 words
An external connection terminal according to claim 1 , wherein the first-element containing nickel layer contains the first element by 1 to 15 wt %.
Claim 6
Dependent Claim
25 words
An external connection terminal according to claim 1 , wherein the tin alloy layer contains tin at a concentration of less than 52 wt %.
Claim 7
Dependent Claim
26 words
An external connection terminal, according to claim 1 , wherein the tin alloy solder layer contains tin at a concentration of more than 5 wt %.
Claim 8
Dependent Claim
16 words
An external connection terminal according to claim 1 , wherein the substrate is a semiconductor substrate.
Claim 9
Dependent Claim
37 words
An external connection terminal according to claim 7 , wherein a coating film made of organic insulating material or metal is formed on at least one of side surfaces and a back surface of the semiconductor substrate.
Claim 10
Dependent Claim
29 words
An external connection terminal according to claim 1 , wherein the electrode is formed of a conductor containing copper or aluminum as a principal component, or aluminum, or copper.
Claim 11
Dependent Claim
29 words
An external connection terminal according to claim 1 , wherein the electrodes are projection-like electrodes that are electrically connected to metal patterns on the substrate or the insulating film.
Claim 12
Dependent Claim
22 words
An external connection terminal according to claim 1 , wherein a thickness of the tin alloy layer is 10 to 200 nm.
Claim 13
Dependent Claim
24 words
An external connection terminal according to claim 1 , wherein a thickness of the rich first-element containing nickel layer is 50 to 500 nm.
Claim 14
Dependent Claim
27 words
An external connection terminal according to claim 1 , wherein the tin alloy solder layer has a substantially spherical or substantially cylindrical or substantially needle-like outer shape.
Claim 15
Dependent Claim
91 words
An external connection terminal comprising: an electrode formed on a substrate; a first-element containing nickel-copper layer formed as a barrier metal on the electrode to contain a first element consisting of any one of phosphorus and boron; a rich first-element containing nickel-copper layer formed on the first-element containing nickel-copper layer to contain a greater concentration of the first element than that in the first-element containing nickel-copper layer; a nickel-copper-tin alloy layer formed on the rich first-element containing nickel-copper layer; and a tin alloy solder layer formed on the nickel-copper-tin alloy layer.
Claim 16
Dependent Claim
91 words
An external connection terminal comprising: an electrode formed on a substrate; a first-element containing nickel-copper layer formed as a barrier metal on the electrode to contain a first element consisting of any one of phosphorus and boron; a rich first-element containing nickel-copper layer formed on the first-element containing nickel-copper layer to contain a greater concentration of the first element than that in the first-element containing nickel-copper layer; a nickel-copper-tin alloy layer formed on the rich first-element containing nickel-copper layer; and a tin alloy solder layer formed on the nickel-copper-tin alloy layer.
Claim 17
Dependent Claim
17 words
An external connection terminal according to claim 14 , wherein the tin alloy solder layer contains copper.
Claim 18
Dependent Claim
25 words
An external connection terminal according to claim 14 , wherein the first-element containing nickel-copper layer contains the first element by 1 to 15 wt %.
Claim 19
Dependent Claim
25 words
An external connection terminal according to claim 14 , wherein the nickel-copper-tin alloy layer contains tin at a concentration of less than 52 wt %.
Claim 20
Dependent Claim
26 words
An external connection terminal according to claim 14 , wherein the tin alloy solder layer contains tin at a concentration of more than 5 wt %.
Claim 21
Dependent Claim
16 words
An external connection terminal according to claim 14 , wherein the substrate is a semiconductor substrate.
Claim 22
Dependent Claim
35 words
An external connection terminal according to claim 19 , wherein a coating film made of organic insulating material is formed on at least one of side surfaces and a back surface of the semiconductor substrate.
Claim 23
Dependent Claim
29 words
An external connection terminal according to claim 14 , wherein the electrode is formed of a conductor containing copper or aluminum as a principal component, or aluminum, or copper.
Claim 24
Dependent Claim
103 words
An external connection terminal comprising: an insulating film formed on a substrate; a first-element containing nickel layer formed as a barrier metal on the insulating film to contain a first element consisting of any one of phosphorus and boron; a rich first-element containing nickel layer formed on the first-element containing nickel layer to contain a greater concentration of the first element than that in the first-element containing nickel layer; a nickel-tin alloy layer formed on the rich first-element containing nickel layer; a tin alloy layer formed on the nickel-tin alloy layer; and a tin alloy solder layer formed on the tin alloy layer.
Claim 25
Dependent Claim
103 words
An external connection terminal comprising: an insulating film formed on a substrate; a first-element containing nickel layer formed as a barrier metal on the insulating film to contain a first element consisting of any one of phosphorus and boron; a rich first-element containing nickel layer formed on the first-element containing nickel layer to contain a greater concentration of the first element than that in the first-element containing nickel layer; a nickel-tin alloy layer formed on the rich first-element containing nickel layer; a tin alloy layer formed on the nickel-tin alloy layer; and a tin alloy solder layer formed on the tin alloy layer.
Claim 26
Dependent Claim
16 words
An external connection terminal according to claim 1 , wherein the substrate is an insulating substrate.
Claim 27
Dependent Claim
16 words
An external connection terminal according to claim 22 , wherein the substrate is an insulating substrate.
Claim 28
Dependent Claim
93 words
An external connection terminal comprising: an insulating film formed on a substrate; a first-element containing nickel-copper layer formed as a barrier metal on the insulating film to contain a first element consisting of any one of phosphorus and boron; a rich first-element containing nickel-copper layer formed on the first-element containing nickel-copper layer to contain a greater concentration of the first element than that in the first-element containing nickel-copper layer; a nickel-copper-tin alloy layer formed on the rich first-element containing nickel-copper layer; and a tin alloy solder layer formed on the nickel-copper-tin alloy layer.
Claim 29
Dependent Claim
93 words
An external connection terminal comprising: an insulating film formed on a substrate; a first-element containing nickel-copper layer formed as a barrier metal on the insulating film to contain a first element consisting of any one of phosphorus and boron; a rich first-element containing nickel-copper layer formed on the first-element containing nickel-copper layer to contain a greater concentration of the first element than that in the first-element containing nickel-copper layer; a nickel-copper-tin alloy layer formed on the rich first-element containing nickel-copper layer; and a tin alloy solder layer formed on the nickel-copper-tin alloy layer.
Claim 30
Dependent Claim
16 words
An external connection terminal according to claim 14 , wherein the substrate is an insulating substrate.
Claim 31
Dependent Claim
16 words
An external connection terminal according to claim 25 , wherein the substrate is an insulating substrate.
Claim 32
Dependent Claim
33 words
An external connection terminal according to claim 19 , wherein a coating film made of metal is formed on at least one of side surfaces and a back surface of the semiconductor substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-04-14 | 2006-10-14 | 2007-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-04-14 | 2010-10-14 | 2011-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-04-14 | 2014-10-14 | 2015-04-15 | $7700.00 | Window Closed / Lapsed |