Patent US6545868B1 successfully refreshed from Google Patents.
US6545868B1
Expired / Lapsed
US
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Electronic module having canopy-type carriers
Assignee: Legacy Electronics Inc
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Filing: 2000-10-16
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Granted: 2003-04-08
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Expires: 2020-10-16
Abstract
Abstract An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A second primary embodiment of the invention utilizes a carrier substrate which has a pair of recesses for back-to-back surface mounting of the IC package pair. The two IC packages may be in contact with opposite sides of a heat sink layer embedded within the carrier substrate. Each resulting IC package unit is surface mounted to the main circuit board. A third primary embodiment of the invention incorporates features of both the first and second primary embodiments. One of the packages is mounted on a planar surface of the carrier right-side up, while the other package is mounted on the carrier in a recess upside down. Several variants of this embodiment are possible. Either the IC package that is mounted on the planar surface of the carrier, or the IC package that is mounted within the recess, may be mounted adjacent to the main circuit board. In the former case, the adjacent package of the package unit fits within a recess on the main circuit board. In the latter case, the adjacent package of the package unit mounts on a planar surface of the main circuit board. For any of the three primary main embodiments, the carrier may be equipped with its own set of interconnection leads which interface with the interconnection pads on the main circuit board or connection may be made directly between the leads of one package and the interconnection pads of the circuit board.
Inventors
- 👤 Kenneth J. Kledzik
- 👤 Jason C. Engle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:09
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10; H10W; H10W90/00; H05K1/0213; H05K1/0216; H05K1/023; H05K1/0231; H05K2201/00; H05K2201/04; H05K2201/049; H05K2201/10; H05K2201/10227; H05K2201/1034; H05K2201/10431; H05K2201/10507; H05K2201/10515; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10689; H05K2201/10734; H05K2201/10742; H05K2201/10886; H05K2201/10924; H05K3/00; H05K3/0058; H05K3/0061; H05K3/30; H05K3/32; H05K3/34; H05K3/3405; H05K3/341; H05K3/3421; H05K3/36; H05K3/368; H10W70/00; H10W70/40; H10W70/60; H10W90/20; H10W90/288
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
160 words
An electronic module comprising: first and second sets of IC packages, each set comprising at least one package, and each package having a package body containing an integrated circuit chip and a plurality of connection elements coupled to said chip; at least one IC package unit having a carrier with at least one mounting location thereon for conductively bonding thereto the connection elements of said at least one package of said first-set IC package, said carrier also having a set of carrier leads which extend outwardly and downwardly from said at least one mounting location, thereby forming a recess within which said second-set IC package may be nested; a printed circuit board having at least one surface-mount pad array thereon, said at least one pad array having conductively bonded thereto both said leads of said carrier of said at least one IC package unit and the connection elements of said at least one package of said nested second-set IC package.
Claim 2
Dependent Claim
160 words
An electronic module comprising: first and second sets of IC packages, each set comprising at least one package, and each package having a package body containing an integrated circuit chip and a plurality of connection elements coupled to said chip; at least one IC package unit having a carrier with at least one mounting location thereon for conductively bonding thereto the connection elements of said at least one package of said first-set IC package, said carrier also having a set of carrier leads which extend outwardly and downwardly from said at least one mounting location, thereby forming a recess within which said second-set IC package may be nested; a printed circuit board having at least one surface-mount pad array thereon, said at least one pad array having conductively bonded thereto both said leads of said carrier of said at least one IC package unit and the connection elements of said at least one package of said nested second-set IC package.
Claim 3
Dependent Claim
35 words
The electronic module of claim 1 , wherein said carrier comprises only a set of leads to which the connection elements of said at least one package of said first-set IC package are conductively bonded.
Claim 4
Dependent Claim
23 words
The electronic module of claim 2 , which further comprises an adhesive film strip bonded to all the leads beneath said mounting location.
Claim 5
Dependent Claim
17 words
The electronic module of claim 3 , wherein said adhesive film strip is a thermo-conductive dielectric material.
Claim 6
Dependent Claim
20 words
The electronic module of claim 4 , wherein said adhesive filmstrip is in contact with said nested second-set IC package.
Claim 7
Dependent Claim
69 words
The electronic module of claim 1 , wherein said carrier comprises a dielectric carrier body having upper and lower parallel major planar surfaces, said mounting location positioned on said upper major planar surface, said carrier leads being affixed to said lower major planar surface, electrical connection between said carrier leads and said mounting location provided by conductively plated apertures which extend between said upper and lower major planar surfaces.
Claim 8
Dependent Claim
58 words
The electronic module of claim 1 , wherein each of said first and second sets of IC packages are of a ball-grid-array type, and separate pads of said at least one surface mount pad array on the printed circuit board are employed for mounting of said at least one IC package unit and said nested second-set IC package.
Claim 9
Dependent Claim
24 words
The electronic module of claim 6 , which further comprises at least one decoupling capacitor mounted on said at least one IC package unit.
Claim 10
Dependent Claim
27 words
The electronic module of claim 1 , wherein each carrier lead includes a laminar extension which is parallel to and contiguous with said lower major planar surface.
Claim 11
Dependent Claim
42 words
The electronic module of claim 9 , wherein only those carrier leads which are designed to be at either ground potential or at supply voltage potential during operation of said first set IC package have laminar extensions which function as heat sinks.
Claim 12
Dependent Claim
17 words
The electronic module of claim 6 , wherein said dielectric body is formed from fiberglass-reinforced plastic material.
Claim 13
Dependent Claim
31 words
The electronic module of claim 1 , wherein a single surface-mount pad array is employed for bonding both said at least one IC package unit and said nested second-set IC package.
Claim 14
Dependent Claim
35 words
The electronic module of claim 12 , wherein at least one pad of said surface-mount pad array is split so that corresponding connection elements of said first-set packages and second-set packages may receive unique signals.
Claim 15
Dependent Claim
111 words
The electronic module of claim 6 , wherein a single surface-mount pad array is employed for bonding both said at least one IC package unit and said nested second-set IC package, and wherein unique signals are fed to corresponding connection elements of a first-set IC package and a second-set IC package nested within said at least one IC package unit to which said first-set IC package is bonded by routing at least one of the signals to an unused connection element position on said second-set IC package, and then rerouting the signal within the carrier body to the appropriate bonding location for a desired connection element on said first-set IC package.
Claim 16
Dependent Claim
22 words
The electronic module of claim 1 , wherein said first-set and second-set IC packages are of the same size and functionally identical.
Claim 17
Dependent Claim
165 words
An electronic module comprising: first and second sets of IC packages, each set comprising at least one package, and each package having a package body containing an integrated circuit chip and a plurality of connection elements coupled to said chip; at least one IC package unit having a carrier with a bonding location for each connection element of said at least one package of said first-set IC package, all bonding locations residing in a common plane, said carrier also having a set of carrier leads, each of which is electrically coupled to a bonding location, said leads extending downwardly from said plane, thereby forming a recess within which said second-set IC package may be nested; a printed circuit board having at least one surface-mount pad array thereon, each surface-mount pad array having conductively bonded thereto both said leads of said carrier of said at least one IC package unit and the connection elements of said at least one package of said nested second-set IC package.
Claim 18
Dependent Claim
165 words
An electronic module comprising: first and second sets of IC packages, each set comprising at least one package, and each package having a package body containing an integrated circuit chip and a plurality of connection elements coupled to said chip; at least one IC package unit having a carrier with a bonding location for each connection element of said at least one package of said first-set IC package, all bonding locations residing in a common plane, said carrier also having a set of carrier leads, each of which is electrically coupled to a bonding location, said leads extending downwardly from said plane, thereby forming a recess within which said second-set IC package may be nested; a printed circuit board having at least one surface-mount pad array thereon, each surface-mount pad array having conductively bonded thereto both said leads of said carrier of said at least one IC package unit and the connection elements of said at least one package of said nested second-set IC package.
Claim 19
Dependent Claim
36 words
The electronic circuit module of claim 16 , wherein said carrier comprises only a set of leads to which the connection elements of said at least one package of said first-set IC package are conductively bonded.
Claim 20
Dependent Claim
24 words
The electronic module of claim 17 , which further comprises an adhesive dielectric film strip bonded to all the leads beneath said mounting location.
Claim 21
Dependent Claim
16 words
The electronic module of claim 18 , wherein said. adhesive film strip is a thermo-conductive material.
Claim 22
Dependent Claim
21 words
The electronic module of claim 19 , wherein said adhesive film strip is in contact with said nested second-set IC package.
Claim 23
Dependent Claim
72 words
The electronic module of claim 16 , wherein said carrier comprises a dielectric carrier body having upper and lower parallel major planar surfaces, said bonding locations are positioned on said upper major planar surface, said carrier leads are affixed to said lower major planar surface, and electrical connection between said carrier leads and said bonding locations is effected by conductively plated apertures which extend between said upper and lower major planar surfaces.
Claim 24
Dependent Claim
56 words
The electronic module of claim 16 , wherein each of said first and second set IC packages are of a ball-grid-array type, and separate pads of said at least one surface-mount pad array on the printed circuit board are employed for mounting of said at least one IC package unit and said nested second-set IC package.
Claim 25
Dependent Claim
21 words
The electronic module of claim 21 , which further comprises at least one decoupling capacitor mounted on each IC package unit.
Claim 26
Dependent Claim
27 words
The electronic module of claim 1 , wherein each carrier lead includes a laminar extension which is parallel to and contiguous with said lower major planar surface.
Claim 27
Dependent Claim
41 words
The electronic module of claim 24 , wherein only those carrier leads which are designed to be at either ground potential or at supply voltage potential during operation of said first-set IC package have laminar extensions which function as heat sinks.
Claim 28
Dependent Claim
16 words
The carrier of claim 21 , wherein said dielectric body is formed from fiberglass-reinforced plastic material.
Claim 29
Dependent Claim
34 words
The package carrier of claim 21 , which further comprises at least one pair of capacitor mounting pads on said upper major planar surface, each pair sized and spaced to receive a decoupling capacitor.
Claim 30
Dependent Claim
32 words
The electronic circuit module of claim 16 , wherein a single surface-mount pad array is employed for bonding both said at least one IC package unit and said nested second-set IC package.
Claim 31
Dependent Claim
36 words
The electronic circuit module of claim 28 , wherein at least one pad of said surface-mount pad array is split so that corresponding connection elements of said first-set packages and second-set packages may receive unique signals.
Claim 32
Dependent Claim
111 words
The electronic module of claim 21 , wherein a single surface-mount pad array is employed for bonding both said at least one IC package unit and a nested second-set IC package, and wherein unique signals are fed to corresponding connection elements of a first-set IC package and a second-set IC package nested within said at least one IC package unit to which said first-set IC package is bonded by routing at least one of the signals to an unused connection element position on the second-set IC package, and then rerouting the signal within the carrier body to the appropriate bonding location for a desired connection element on the first-set IC package.
References Cited (Backward Citations)
US6262488B1
Cited
US5191404A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-04-07 | 2006-10-07 | 2007-04-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-04-07 | 2010-10-07 | 2011-04-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-04-07 | 2014-10-07 | 2015-04-08 | $7700.00 | Window Closed / Lapsed |