US6534855B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wireless communications system and method of making
Assignee: Round Rock Research LLC
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Filing: 1999-08-27
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Granted: 2003-03-18
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Expires: 2019-08-27
Abstract
Abstract A wireless communication system comprising a carrier having a top and a bottom surface, and a plurality of integrated circuit components for transmitting and receiving communication signals located on the top and bottom surfaces of the carrier. At least one passageway extends through the carrier, and conductive material extends through the passageway for electrically interconnecting the integrated circuit components located on the top and bottom surfaces of the carrier.
Inventors
- 👤 Kie Y. Ahn
- 👤 Leonard Forbes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:22
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/021; H10W20/023; H10W20/0261; H10W20/0265; H10W20/20; H10W20/211; H10W20/212; H10W20/2125; H10W20/2128; H10W44/00; H10W44/20; H10W44/203; H10W44/209; H10W44/212; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 51
Claim 1
Independent Claim
87 words
A wireless communication system comprising: a carrier having a top and a bottom surface; a plurality of integrated circuit components for transmitting, receiving and processing wireless communication signals, said integrated circuit components being located on the top and bottom surfaces of said carrier; at least one passageway extending through said carrier; and conductive material extending through the at least one passageway for electrically interconnecting said integrated circuit components located on the top and bottom surfaces of said carrier, wherein the conductive material forms a respective coaxial interconnect.
Claim 2
Dependent Claim
87 words
A wireless communication system comprising: a carrier having a top and a bottom surface; a plurality of integrated circuit components for transmitting, receiving and processing wireless communication signals, said integrated circuit components being located on the top and bottom surfaces of said carrier; at least one passageway extending through said carrier; and conductive material extending through the at least one passageway for electrically interconnecting said integrated circuit components located on the top and bottom surfaces of said carrier, wherein the conductive material forms a respective coaxial interconnect.
Claim 3
Dependent Claim
14 words
The system of claim 1 wherein the communication signals represent voice, data and/or images.
Claim 4
Dependent Claim
14 words
The system of claim 1 wherein the wireless communication system is a portable telephone.
Claim 5
Dependent Claim
27 words
The system of claim 1 wherein the carrier is formed of a substance selected from the group consisting of silicon, SiGe, GaAs, GaAlAs, SiC and mixtures thereof.
Claim 6
Dependent Claim
11 words
The system of claim 1 wherein the conductive material comprises aluminum.
Claim 7
Dependent Claim
20 words
The system of claim 1 wherein said at least one passageway has an aspect ratio of greater than about 50.
Claim 8
Dependent Claim
21 words
The system of claim 6 wherein said at least one passageway has an aspect ratio of not less than about 75.
Claim 9
Dependent Claim
58 words
The system of claim 1 wherein said conductive material comprises: a first conductive material disposed proximate the interior wall portion of the passageway; a layer of dielectric material disposed within the passageway over and radially inwardly of the first conductive material; and a second conductive material disposed within the passageway over and radially inwardly of the dielectric material.
Claim 10
Dependent Claim
19 words
The system of claim 8 wherein the first conductive material comprises semiconductive material doped with a conductivity enhancing impurity.
Claim 11
Dependent Claim
18 words
The system of claim 8 wherein the first conductive material is a metal-containing layer formed within said passageway.
Claim 12
Dependent Claim
15 words
The system of claim 8 wherein the layer of dielectric material comprises a nitride-containing material.
Claim 13
Dependent Claim
15 words
The system of claim 8 , wherein the second conductive material comprises an aluminum-containing material.
Claim 14
Dependent Claim
18 words
The system of claim 8 wherein said passageway has an aspect ratio of not less than about 100.
Claim 15
Dependent Claim
67 words
The system of claim 1 wherein the coaxial interconnect line comprises an outer conductive coaxial line component having a first thickness, an inner conductive coaxial line component having a second thickness, and a coaxial dielectric material between the inner and outer conductive coaxial line components, the dielectric material having a substantially uniform third thickness which is greater than at least one of the first and second thicknesses.
Claim 16
Dependent Claim
36 words
The system of claim 1 wherein at least some of said circuit components are contained in at least one integrated circuit chip which is mounted on one of said top and bottom surfaces of said carrier.
Claim 17
Dependent Claim
25 words
The system of claim 1 wherein at least some of said circuit components are fabricated on at least one of said surfaces of said carrier.
Claim 18
Dependent Claim
25 words
The system of claim 1 wherein at least some of said circuit components are fabricated in at least one of said surfaces of said carriers.
Claim 19
Dependent Claim
23 words
The system of claim 15 wherein at least one integrated circuit chip is supported on said carrier by a plurality of solder balls.
Claim 20
Dependent Claim
27 words
The system of claim 1 wherein at least some of said circuit components are provided on a substrate which is mounted on a surface of said carrier.
Claim 21
Dependent Claim
92 words
A wireless communication system comprising: a plurality of stacked carriers, each one of the carriers having a top and a bottom surface; a plurality of integrated circuit components for transmitting, receiving and processing RF wireless communication signals, said integrated circuit components being located on at least one of the top and bottom surfaces of the carriers; at least one passageway extending through at least one of the carriers; and at least one coaxial interconnect line extending through said passageway for electrically interconnecting integrated circuit components located on the surfaces of said carriers.
Claim 22
Dependent Claim
92 words
A wireless communication system comprising: a plurality of stacked carriers, each one of the carriers having a top and a bottom surface; a plurality of integrated circuit components for transmitting, receiving and processing RF wireless communication signals, said integrated circuit components being located on at least one of the top and bottom surfaces of the carriers; at least one passageway extending through at least one of the carriers; and at least one coaxial interconnect line extending through said passageway for electrically interconnecting integrated circuit components located on the surfaces of said carriers.
Claim 23
Dependent Claim
29 words
A system as in claim 20 wherein each of said carriers contains a passageway which aligns with a passageway of the other carrier to cooperatively form an interconnect line.
Claim 24
Dependent Claim
15 words
The system as in claim 21 wherein said interconnect line is a coaxial interconnect line.
Claim 25
Independent Claim
92 words
A method of forming a wireless communication system, said method comprising the steps of: providing a carrier having a top surface and a bottom surface; forming a hole through the carrier which extends between the top surface and the bottom surface; providing a plurality of integrated circuit components for transmitting, receiving and processing wireless communication signals on the top and bottom surfaces of said carrier; lining said hole with insulation; and filing the hole with conductive material to interconnect the integrated circuit components on the top and bottom surfaces of said carrier.
Claim 26
Independent Claim
92 words
A method of forming a wireless communication system, said method comprising the steps of: providing a carrier having a top surface and a bottom surface; forming a hole through the carrier which extends between the top surface and the bottom surface; providing a plurality of integrated circuit components for transmitting, receiving and processing wireless communication signals on the top and bottom surfaces of said carrier; lining said hole with insulation; and filing the hole with conductive material to interconnect the integrated circuit components on the top and bottom surfaces of said carrier.
Claim 27
Dependent Claim
21 words
The method as in claim 23 further comprising forming a conductive lining in said hole prior to forming said insulation lining.
Claim 28
Dependent Claim
27 words
The method of claim 23 , wherein at least some of said integrated circuit components are fabricated on or in said carrier after the hole is formed.
Claim 29
Dependent Claim
19 words
The method of claim 23 , wherein the hole is formed with an aspect ratio greater than about 50.
Claim 30
Dependent Claim
20 words
The method of claim 23 , wherein the hole is formed with an aspect ratio between about 75 and 80.
Claim 31
Dependent Claim
22 words
The method of claim 23 , wherein the hole is formed perpendicularly relative to the top and bottom surfaces of said circuit.
Claim 32
Dependent Claim
36 words
The method of claim 23 , wherein the step of forming the hole comprises: placing the carrier in a dipole-ring magnetron reactor; and subjecting the carrier to conditions within the reactor effective to form the hole.
Claim 33
Dependent Claim
59 words
The method of claim 23 , wherein the hole defines an interior surface which extends between the top and bottom surfaces, said method further comprising, prior to the filling of the hole with conductive material, the step of exposing the carrier to conditions which are effective to form a dielectric material layer on the interior surface of the hole.
Claim 34
Dependent Claim
31 words
The method of claim 30 , wherein the step of exposing the carrier comprises: forming a nitride-containing layer on the interior surface; and forming an oxide-containing layer over the nitride-containing layer.
Claim 35
Dependent Claim
37 words
The method of claim 30 , wherein the step of exposing the carrier comprises: chemical vapor depositing a nitride-containing layer over the interior surface of the hole; and oxidizing at least a portion of the nitride-containing layer.
Claim 36
Dependent Claim
54 words
The method of claim 32 , wherein the step of filling the hole comprises: forming a polysilicon layer within the hole; forming a metal-comprising layer over the polysilicon layer; and subjecting the carrier to conditions which are effective to cause the material of the metal-comprising layer to replace the material of the polysilicon layer.
Claim 37
Dependent Claim
37 words
The method of claim 33 , wherein the subjecting of the carrier comprises exposing the carrier to temperature conditions equal to or greater than about 500° C. for a sufficient duration of time to cause said replacement.
Claim 38
Dependent Claim
85 words
The method of claim 30 , wherein the step of exposing the carrier comprises: chemical vapor depositing a nitride-containing layer over the interior surface of the hole; and oxidizing at least a portion of the nitride-containing layer; and further wherein the step of filling the hole comprises: forming a polysilicon layer within the hole; forming an aluminum-containing layer over the polysilicon layer; and subjecting the carrier to conditions which are effective to cause material of the aluminum-containing layer to replace material of the polysilicon layer.
Claim 39
Dependent Claim
37 words
The method of claim 32 , wherein the filling of the hole comprises: forming a first material within the hole; and replacing the first material with a second conductive material which is different from the first material.
Claim 40
Dependent Claim
59 words
The method of claim 36 , wherein: the step of forming the first material comprises chemical vapor depositing polysilicon within the hole; and the step of replacing the first material comprises: forming a layer of metal-comprising material over the first material; and annealing the carrier under conditions which are effective to cause the metal-comprising material to replace the polysilicon.
Claim 41
Dependent Claim
56 words
The method of claim 32 , wherein the step of filling the hole comprises the steps of: forming a layer of a first material in the hole; forming a layer comprising a metal-comprising material over the first material layer; and subjecting the carrier to conditions effective to cause the metal-comprising material to replace the first material.
Claim 42
Dependent Claim
32 words
The method of claim 38 , wherein the subjecting step comprises annealing the carrier at a temperature, and for a time sufficient to cause the metal-comprising material to replace the first material.
Claim 43
Dependent Claim
69 words
The method of claim 38 , wherein: the step of forming the layer of first material comprises chemical vapor depositing polysilicon within the hole; the step of forming the layer of metal-comprising material comprises forming an aluminum-comprising material over the polysilicon; and the conditions of the subjecting step are annealing the carrier at a temperature, and for a time sufficient to cause the aluminum-comprising material to replace the polysilicon.
Claim 44
Dependent Claim
80 words
The method of claim 32 wherein the step of filling the hole comprises: forming a coaxial interconnect line in the hole by forming an outer conductive coaxial line component having a first thickness in the hole through the carrier; forming an inner conductive coaxial line component having a second thickness in the hole through the carrier; and providing a coaxial dielectric material between the inner and outer conductive coaxial line components, the dielectric material having a substantially uniform third thickness.
Claim 45
Dependent Claim
21 words
The method of claim 41 wherein said third thickness is greater than at least one of said first and second thickness.
Claim 46
Dependent Claim
22 words
The method of claim 41 , wherein the outer conductive coaxial line component comprises semiconductive material doped with a conductivity enhancing impurity.
Claim 47
Dependent Claim
83 words
The method of claim 41 , wherein: the step of forming the outer conductive coaxial line component takes place prior to the forming of the inner conductive coaxial line component; and the step of forming the inner conductive coaxial line component comprises: forming a first material within the hole; forming a second material over the first material, at least the second material being conductive; and exposing the substrate to conditions which are effective to cause the second material to replace the first material.
Claim 48
Dependent Claim
30 words
The method of claim 41 , wherein the outer conductive coaxial line component is formed by depositing a metal containing layer of material over the internal surface of the hole.
Claim 49
Dependent Claim
74 words
The method of claim 45 , wherein: the forming of the outer conductive coaxial line component takes place prior to the forming of the inner conductive coaxial line component; and the forming of the inner conductive coaxial line component comprises: forming a first material within the hole; forming a second material over the first material; and exposing the substrate to conditions which are effective to cause the second material to replace the first material.
Claim 50
Dependent Claim
62 words
The method of claim 41 , wherein the conductive material is formed over the dielectric material layer by the steps comprising: forming a first material within the hole; forming a second material over the first material, at least the second material being conductive; and exposing the substrate to conditions which are effective to cause the second material to replace the first material.
Claim 51
Dependent Claim
69 words
The method of claim 41 , wherein the conductive material is formed over the dielectric material layer by the steps comprising: chemical vapor depositing a layer of polysilicon within the hole; forming an aluminum-comprising layer of material over the polysilicon layer; and annealing the substrate at a temperature, and for a duration of time, which are effective to cause the aluminum-comprising layer of material to replace the polysilicon layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-03-17 | 2006-09-16 | 2007-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-03-17 | 2010-09-16 | 2011-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-03-17 | 2014-09-16 | 2015-03-18 | $7700.00 | Window Closed / Lapsed |