US6522022B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mounting structure for semiconductor devices
Assignee: Shinko Electric Industries Co Ltd
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Filing: 2001-11-27
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Granted: 2003-02-18
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Expires: 2021-11-27
Abstract
Abstract A mounting structure for semiconductor devices wherein a plurality of semiconductor devices each comprised of a semiconductor chip carried on a substrate and provided with connection terminals formed in bump shapes on the substrate are stacked in multiple layers in the vertical direction and mounted on a mounting substrate by electrically connecting the adjoining semiconductor devices through the connection terminals, wherein the connection terminals of the adjoining semiconductor devices are arranged to overlap each other and the connection terminals of the adjoining semiconductor devices are arranged to be displaced from each other in planar arrangement, which thereby eases the stress acting on connection terminals when mounting semiconductor devices stacked on a mounting substrate and improves the reliability of connection between the semiconductor devices and mounting substrate.
Inventors
- 👤 Kei Murayama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 17:18
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/60; H10W74/00; H10W74/10; H10W74/15; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
153 words
A mounting structure for semiconductor devices comprising: a plurality of semiconductor devices each comprised of a semiconductor chip carried on a substrate and provided with connection terminals formed in bump shapes on the substrate, said semiconductor devices being stacked in multiple layers in the vertical direction and mounted on a mounting substrate by electrically connecting adjoining semiconductor devices through said connection terminals, wherein the connection terminals of the adjoining semiconductor devices are arranged to overlap each other, and either the connection terminals in a layer of a semiconductor device are displaced inwardly with respect to the connection terminals in an adjoining layer of a semiconductor device, or the connection terminals in a layer of a semiconductor device are displaced outwardly with respect to the connection terminals in an adjoining layer of a semiconductor device, and the connection terminals of adjoining semiconductor devices are arranged to be displaced from each other in planar arrangement.
Claim 2
Dependent Claim
153 words
A mounting structure for semiconductor devices comprising: a plurality of semiconductor devices each comprised of a semiconductor chip carried on a substrate and provided with connection terminals formed in bump shapes on the substrate, said semiconductor devices being stacked in multiple layers in the vertical direction and mounted on a mounting substrate by electrically connecting adjoining semiconductor devices through said connection terminals, wherein the connection terminals of the adjoining semiconductor devices are arranged to overlap each other, and either the connection terminals in a layer of a semiconductor device are displaced inwardly with respect to the connection terminals in an adjoining layer of a semiconductor device, or the connection terminals in a layer of a semiconductor device are displaced outwardly with respect to the connection terminals in an adjoining layer of a semiconductor device, and the connection terminals of adjoining semiconductor devices are arranged to be displaced from each other in planar arrangement.
Claim 3
Dependent Claim
48 words
A mounting structure for semiconductor devices as set forth in claim 1 , wherein said connection terminals are arranged such that the connection terminals in a layer of a semiconductor device are displaced inwardly with respect to the connection terminals in an underlying layer of a semiconductor device.
Claim 4
Dependent Claim
48 words
A mounting structure for semiconductor devices as set forth in claim 1 , wherein said connection terminals are arranged such that the connection terminals in a layer of a semiconductor device are displaced outwardly with respect to the connection terminals in an underlying layer of a semiconductor device.
Claim 5
Dependent Claim
76 words
A mounting structure for semiconductor devices as set forth in claim 1 , wherein said connection terminals are arranged such that the connection terminals in a layer of a semiconductor device are displaced inwardly with respect to the connection terminals in an underlying layer of a semiconductor device, and the connection terminals in another layer of a semiconductor device are displaced outwardly with respect to the connection terminals in an underlying layer of a semiconductor device.
Claim 6
Dependent Claim
29 words
A mounting structure for semiconductor devices as set forth in claim 1 , wherein said semiconductor chips and connection terminals are arranged on the same surface of the substrate.
Claim 7
Dependent Claim
28 words
A mounting structure for semiconductor devices as set forth in claim 1 , wherein said semiconductor chips and connection terminals are arranged on opposite surfaces of the substrate.
Claim 8
Dependent Claim
58 words
A mounting structure for semiconductor devices as set forth in any one of claims 1 to 6 , wherein each of the semiconductor devices is formed with interconnection patterns on one surface of its substrate and connection terminals of the adjoining semiconductor devices are electrically connected with said interconnection patterns through connection holes formed passing through said substrates.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-17 | 2006-08-19 | 2007-02-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-17 | 2010-08-19 | 2011-02-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-17 | 2014-08-19 | 2015-02-18 | $7700.00 | Window Closed / Lapsed |