Patent US6285805B1 successfully refreshed from Google Patents.
Patent US6516516B1 successfully refreshed from Google Patents.
US6516516B1
Expired / Lapsed
US
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Semiconductor chip package having clip-type outlead and fabrication method of same
Assignee: SK Hynix Inc
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Filing: 1998-07-23
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Granted: 2003-02-11
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Expires: 2018-07-23
Abstract
Abstract A semiconductor chip package having a clip type lead frame and fabrication thereof. The package includes a semiconductor chip having a plurality of bond pads thereon, a first package body having a recess, a plurality of inner leads each connected electrically to a corresponding one of the bond pads, a plurality of outleads each extended from a corresponding one of the inner leads for covering along sides of the first package body, and a second package body which covers the semiconductor chip, a plurality of metallic wires and the inner leads. The fabrication method includes the steps of forming a first package body having a recess therein, attaching to the first package body a plurality of inner leads and outleads extended from the inner leads thus to be coveringly exposed on sides of the first package body, attaching in the recess a semiconductor chip having a plurality of bond pads thereon, wire-bonding for electrically connecting each of the inner leads by a metallic wire to a corresponding one of the bond pads provided on the semiconductor chip, and forming a second package body for covering the semiconductor chip, the inner leads and the metallic wires.
Inventors
- 👤 Byeong-Duck Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:12
CPC Classifications
H; H10; H10W; H10W72/00; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/8506; H10H20/857; H10H20/858; H10H20/8582; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/50; H10W72/551; H10W72/552; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
93 words
A method of fabricating a chip package, comprising the steps of: forming a first package body; attaching a plurality of leads to the first package body, wherein each of the leads includes an inner portion and an outer portion, and wherein the outer portion of each lead is in contact with top, side and bottom surface portions of the first package body; attaching a chip having a plurality of bond pads to the first package body; and electrically connecting bond pads of the chip to inner portions of corresponding ones of the leads.
Claim 2
Independent Claim
93 words
A method of fabricating a chip package, comprising the steps of: forming a first package body; attaching a plurality of leads to the first package body, wherein each of the leads includes an inner portion and an outer portion, and wherein the outer portion of each lead is in contact with top, side and bottom surface portions of the first package body; attaching a chip having a plurality of bond pads to the first package body; and electrically connecting bond pads of the chip to inner portions of corresponding ones of the leads.
Claim 3
Dependent Claim
42 words
The method of claim 1 , wherein the forming step comprises forming the first package body such that it has a recess, and wherein the step of attaching a chip comprises attaching the chip to the recess of the first package body.
Claim 4
Dependent Claim
30 words
The method of claim 1 , further comprising the step of forming a second package body on the first package body such that the second package body covers the chip.
Claim 5
Dependent Claim
74 words
The method of claim 1 , wherein the step of attaching a plurality of leads further comprises attaching leads having a first bent portion, wherein the first bent portion of each lead is located on a part of the outer portion of the lead that covers a top surface of the first package body, and wherein the first bent portion extends into a depression formed on a top surface of the first package body.
Claim 6
Dependent Claim
74 words
The method of claim 4 , wherein the step of attaching a plurality of leads further comprises attaching leads having a second bent portion, wherein the second bent portion of each lead is located on a part of the outer portion of the lead that covers a bottom surface of the first package body, and wherein the second bent portion extends into a depression formed on a bottom surface of the first package body.
Claim 7
Dependent Claim
30 words
The method of claim 5 , wherein the step of attaching a plurality of leads further comprises attaching leads wherein the first and second bent portions extend towards one another.
Claim 8
Dependent Claim
53 words
The method of claim 1 , wherein the forming step further comprises forming the first package body such that a heat sink is located in a central portion of the first package body, and wherein the step of attaching a chip comprises attaching the chip to a first surface of the heat sink.
Claim 9
Dependent Claim
31 words
The method of claim 7 , wherein the forming step further comprises forming the first package body such that a second surface of the heat sink is exposed outside the package.
Claim 10
Dependent Claim
32 words
The method of claim 1 , wherein the electrically connecting step comprises attaching bond pads of the chip to inner portions of corresponding ones of the leads with a plurality of wires.
Claim 11
Independent Claim
106 words
A method of fabricating a chip package, comprising the steps of: forming a first package body; attaching a heat sink to a central portion of the first package body; attaching a plurality of leads to the first package body, wherein each of the leads includes an inner portion and an outer portion, and wherein the outer portion of each lead covers top, side and bottom surface portions of the first package body; attaching a chip having a plurality of bond pads to a first surface of the heat sink; and electrically connecting bond pads of the chip to inner portions of corresponding ones of the leads.
Claim 12
Independent Claim
106 words
A method of fabricating a chip package, comprising the steps of: forming a first package body; attaching a heat sink to a central portion of the first package body; attaching a plurality of leads to the first package body, wherein each of the leads includes an inner portion and an outer portion, and wherein the outer portion of each lead covers top, side and bottom surface portions of the first package body; attaching a chip having a plurality of bond pads to a first surface of the heat sink; and electrically connecting bond pads of the chip to inner portions of corresponding ones of the leads.
Claim 13
Dependent Claim
44 words
The method of claim 10 , wherein the step of attaching a heat sink comprises attaching the heat sink to the first package body such that the first surface of the heat sink is recessed below a top surface of the first package body.
Claim 14
Dependent Claim
35 words
The method of claim 10 , wherein the step of forming a first package body comprises forming a first package body having at least one depression in a top surface of the first package body.
Claim 15
Dependent Claim
57 words
The method of claim 12 , wherein the step of attaching a plurality of leads comprises attaching leads wherein the outer portion of each of the leads includes at least one bent portion, and wherein the at least one bent portion of each lead extends into a depression in the top surface of the first package body.
Claim 16
Dependent Claim
75 words
The method of claim 13 , wherein the step of forming a first package body further comprises forming the first package body so that it has at least one depression in a bottom surface of the first package body, and wherein the step of attaching a plurality of leads further comprises attaching the leads such that a bent portion of each lead extends into a depression in the bottom surface of the first package body.
Claim 17
Dependent Claim
44 words
The method of claim 10 , wherein the step of attaching a heat sink comprises attaching the heat sink to the first package body such that a second surface of the heat sink is exposed through a bottom surface of the first package body.
Claim 18
Dependent Claim
30 words
The method of claim 15 , further comprising a step of forming a second package body on the first package body such that the second package body covers the chip.
Claim 19
Dependent Claim
41 words
The method of claim 16 , wherein the step of forming a second package body comprises forming the second package body such that the second surface of the heat sink remains exposed through the bottom surface of the first package body.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-10 | 2006-08-12 | 2007-02-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-10 | 2010-08-12 | 2011-02-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-10 | 2014-08-12 | 2015-02-11 | $7700.00 | Window Closed / Lapsed |