Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods

Claim 2

A heat transfer apparatus for coupling to a pin grid array (PGA) device including an integrated circuit and mounted within a socket, wherein the socket is mounted upon a surface of a printed circuit board (PCB) and comprises two latching projections extending from opposite side surfaces, the heat transfer apparatus comprising: a thermally conductive heat sink, comprising: an opening in an underside surface for housing the PGA device and the socket; a lip surrounding the opening for thermally coupling to the PCB about the socket; a pair of holes extending through the heat sink from an upper surface of the heat sink into the opening; a spring clip for holding the heat sink in place relative to the PGA device, wherein the spring clip comprises two side members, and wherein each side member is adapted for attaching to a different one of the latching projections of the socket; and wherein each of the pair of holes in the heat sink is adapted to receive a different one of the side members of the spring clip.

Claim 3

The heat transfer apparatus as recited in claim 1 , wherein the PGA device comprises a substrate having a substantially flat upper surface opposite the socket, and wherein the integrated circuit of the PGA device is mounted upon the upper surface of the substrate such that the integrated circuit is elevationally raised above the upper surface of the substrate.

Claim 4

The heat transfer apparatus as recited in claim 2 , wherein the opening comprises a first cavity dimensioned to receive the socket and the substrate of the PGA device, and wherein the first cavity has an upper wall, and wherein the opening further comprises a second cavity in the upper wall of the first cavity, and wherein the second cavity is dimensioned to receive the integrated circuit.

Claim 5

The heat transfer apparatus as recited in claim 3 , further comprising a thermal interface layer positioned between the integrated circuit and an upper wall of the second cavity.

Claim 6

The heat transfer apparatus as recited in claim 3 , further comprising a thermal interface layer positioned between a region of the upper surface of the substrate surrounding the integrated circuit and an adjoining portion of the upper wall of the first cavity.

Claim 7

The heat transfer apparatus as recited in claim 3 , further comprising a thermal interface layer positioned about the socket between the lip of the heat sink and the surface of the PCB.

Claim 8

The heat transfer apparatus as recited in claim 1 , wherein the holes in the heat sink are separated by a distance equal to a distance between the latching projections of the socket.

Claim 9

The heat transfer apparatus as recited in claim 1 , wherein the spring clip further comprises a joining member connected between the two side members, and wherein the joining member is made from a resilient material.

Claim 10

The heat transfer apparatus as recited in claim 8 , wherein the joining member is made from spring steel.

Claim 11

The heat transfer apparatus as recited in claim 8 , wherein the joining member has two ends and a bowed center section between the two ends, and wherein the two ends of the joining member are substantially parallel to one another.

Claim 12

The heat transfer apparatus as recited in claim 10 , wherein each side member has an upper end an a lower end, and wherein one of the two ends of the joining member is connected to the upper end of one of the side members, and wherein the other end of the joining member is connected to the upper end of the other side member, and wherein the center section of the joining member is bowed toward the lower ends of the side members such that the spring clip is substantially “M”-shaped.

Claim 13

The heat transfer apparatus as recited in claim 11 , wherein each side member has a hole in the lower end dimensioned to allow a corresponding one of the latching projections of the socket to pass therethrough.

Claim 14

The heat transfer apparatus as recited in claim 12 , wherein the latching projections of the socket are substantially rectangular.

Claim 15

The heat transfer apparatus as recited in claim 12 , wherein the spring clip is formed from a single piece of resilient material.

Claim 16

The heat transfer apparatus as recited in claim 14 , wherein the spring clip is formed from a single piece of spring steel.

Claim 17

The heat transfer apparatus as recited in claim 14 , wherein the spring clip has sharp bends at interfaces between the side members and the joining member.

Claim 18

The heat transfer apparatus as recited in claim 1 , wherein the heat sink is made from a metal.

Claim 19

The heat transfer apparatus as recited in claim 1 , wherein the heat sink includes multiple structures extending from the upper surface.

Claim 20

A heat transfer apparatus for coupling to a pin grid array (PGA) device including an integrated circuit and mounted within a socket, wherein the PGA device comprises a substrate having a substantially flat upper surface opposite the socket, and wherein the integrated circuit of the PGA device is mounted upon the upper surface of the substrate such that the integrated circuit is elevationally raised above the upper surface of the substrate, and wherein the socket is mounted upon a surface of a printed circuit board (PCB) and comprises latching projections extending from opposite side surfaces, the heat transfer apparatus comprising: a thermally conductive heat sink, comprising: a first cavity in an underside surface of the heat sink, wherein the first cavity is dimensioned to receive the socket and the substrate of the PGA device, and wherein the first cavity has an upper wall; a second cavity in the upper wall of the first cavity, wherein the second cavity is dimensioned to receive the integrated circuit; a lip surrounding the first cavity for thermally coupling to the PCB about the socket; a pair of holes extending through the heat sink from an upper surface of the heat sink into the opening; a spring clip for holding the heat sink in place relative to the PGA device, wherein the spring clip comprises two side members, and wherein each side member is adapted for attaching to a different one of the latching projections of the socket, and wherein each side member has a hole in a lower end dimensioned to allow a corresponding one of the latching projections of the socket to pass therethrough; and wherein each of the pair of holes in the heat sink is adapted to receive a different one of the side members of the spring clip.

Claim 21

A heat transfer apparatus for coupling to a pin grid array (PGA) device including an integrated circuit and mounted within a socket, wherein the PGA device comprises a substrate having a substantially flat upper surface opposite the socket, and wherein the integrated circuit of the PGA device is mounted upon the upper surface of the substrate such that the integrated circuit is elevationally raised above the upper surface of the substrate, and wherein the socket is mounted upon a surface of a printed circuit board (PCB) and comprises latching projections extending from opposite side surfaces, the heat transfer apparatus comprising: a thermally conductive heat sink, comprising: a first cavity in an underside surface of the heat sink, wherein the first cavity is dimensioned to receive the socket and the substrate of the PGA device, and wherein the first cavity has an upper wall; a second cavity in the upper wall of the first cavity, wherein the second cavity is dimensioned to receive the integrated circuit; a lip surrounding the first cavity for thermally coupling to the PCB about the socket; a pair of holes extending through the heat sink from an upper surface of the heat sink into the opening; a spring clip for holding the heat sink in place relative to the PGA device, wherein the spring clip comprises two side members, and wherein each side member is adapted for attaching to a different one of the latching projections of the socket, and wherein each side member has a hole in a lower end dimensioned to allow a corresponding one of the latching projections of the socket to pass therethrough; and wherein each of the pair of holes in the heat sink is adapted to receive a different one of the side members of the spring clip.

Claim 22

The heat transfer apparatus as recited in claim 19 , further comprising a thermal interface layer positioned between the integrated circuit and an upper wall of the second cavity.

Claim 23

The heat transfer apparatus as recited in claim 19 , further comprising a thermal interface layer positioned between a region of the upper surface of the substrate surrounding the integrated circuit and an adjoining portion of the upper wall of the first cavity.

Claim 24

The heat transfer apparatus as recited in claim 19 , further comprising a thermal interface layer positioned about the socket between the lip of the heat sink and the surface of the PCB.

Claim 25

The heat transfer apparatus as recited in claim 19 , wherein the holes in the heat sink are separated by a distance equal to a distance between the latching projections of the socket.

Claim 26

The heat transfer apparatus as recited in claim 19 , wherein the spring clip further comprises a joining member connected between the two side members, and wherein the joining member is made from a resilient material.

Claim 27

The heat transfer apparatus as recited in claim 24 , wherein the joining member has two ends and a bowed center section between the two ends, and wherein the two ends of the joining member are substantially parallel to one another.

Claim 28

The heat transfer apparatus as recited in claim 25 , wherein each side member has an upper end opposite the lower end, and wherein one of the two ends of the joining member is connected to the upper end of one of the side members, and wherein the other end of the joining member is connected to the upper end of the other side member, and wherein the center section of the joining member is bowed toward the lower ends of the side members such that the spring clip is substantially “M”-shaped.

Claim 29

The heat transfer apparatus as recited in claim 26 , wherein the spring clip is formed from a single piece of resilient material.