US6493064B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for registration control in production by imaging
Assignee: Kodak IL Ltd
•
Filing: 2001-02-28
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Granted: 2002-12-10
•
Expires: 2021-02-28
Abstract
Abstract A method and apparatus for imaging an overlying conductive pattern over an underlying conductive pattern on a substrate, by determining deviations between the actual locations and the nominal locations of predetermined reference targets in the underlying conductive pattern on the substrate; and utilizing the determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern. Preferably, the reference targets are predetermined connection sites in the underlying conductive pattern to be precisely located with respect to connection sites in the overlying conductive pattern. The reference features may be assigned different weights according to their registration importance, and the deviations may be determined according to a threshold which varies with the weight assigned to the respective reference feature.
Inventors
- 👤 Oz Cabiri
- 👤 Effraim Mikletzki
- 👤 Yossef Atiya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:09
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4679; G; G03; G03F; G03F7/00; G03F7/70; G03F7/70383; G03F9/00; H05K1/00; H05K1/02; H05K1/0266; H05K1/0269; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09918; H05K3/0008; H05K3/0073; H05K3/0082
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
92 words
A method of imaging an overlying pattern over an underlying pattern on a substrate, each pattern being defined by image data to be applied at nominal locations according to scanning control data, said method comprising: determining deviations between the actual locations and the nominal locations of predetermined reference targets of the underlying conductive pattern on the substrate; and utilizing said determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern.
Claim 2
Independent Claim
92 words
A method of imaging an overlying pattern over an underlying pattern on a substrate, each pattern being defined by image data to be applied at nominal locations according to scanning control data, said method comprising: determining deviations between the actual locations and the nominal locations of predetermined reference targets of the underlying conductive pattern on the substrate; and utilizing said determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern.
Claim 3
Dependent Claim
24 words
The method according to claim 1 , wherein said predetermined reference targets are predetermined features in the underlying conductive pattern selected as reference targets.
Claim 4
Dependent Claim
35 words
The method according to claim 1 , wherein said predetermined reference targets are predetermined connection sites in the underlying conductive pattern to be precisely located with respect to connection sites in the overlying conductive pattern.
Claim 5
Dependent Claim
40 words
The method according to claim 1 , wherein said reference targets are assigned different weights according to their registration tolerances, and said deviations are determined according to a threshold which varies with the weight assigned to the respective reference target.
Claim 6
Dependent Claim
104 words
The method according to claim 1 , wherein each of said conductive patterns includes a global area having predetermined reference targets, and a local area having predetermined reference targets; the reference targets in the global area of the underlying conductive pattern being used for imaging the local area of the overlying conductive pattern with respect to the underlying conductive pattern; the determined deviations in the reference targets in the local area of the underlying conductive pattern being used for modifying the scanning control data to reduce misregistration of the imaged local area of the overlying conductive pattern with respect to the underlying conductive pattern.
Claim 7
Dependent Claim
34 words
The method according to claim 1 , wherein each of said conductive patterns is imaged by directly imaging a photoresist layer with imaging data applied according to scanning control data for the respective pattern.
Claim 8
Dependent Claim
44 words
The method according to claim 1 , wherein said scanning control data produces relative movement between an exposure head and the substrate along two orthogonal axes to scan the surface of the substrate for imaging the respective conductive pattern with the respective imaging data.
Claim 9
Dependent Claim
16 words
The method according to claim 7 , wherein said substrate is mounted on a flat holder.
Claim 10
Dependent Claim
16 words
The method according to claim 8 , wherein said exposure head includes one or more lasers.
Claim 11
Dependent Claim
40 words
The method according to claim 8 , wherein said flat holder is driven longitudinally, and said exposure head is driven transversely, under the control of said scanning control data to scan the surface of the substrate on said flat holder.
Claim 12
Independent Claim
136 words
A method of imaging an overlying conductive pattern over an underlying conductive pattern on a substrate, each conductive pattern being defined by image data to be applied at nominal locations according to scanning control data, said method comprising: selecting a plurality of features on said underlying conductive pattern to serve as reference targets; sensing the actual locations of said reference targets on said underlying conductive pattern while the substrate is carried by a holder; determining deviations in the sensed actual locations of said reference targets on said underlying conductive pattern with respect to the nominal locations of the reference targets in the underlying conductive pattern; and modifying said scanning control data of the overlying conductive pattern in accordance with said deviations to reduce misregistration of the overlying conductive pattern with respect to the underlying conductive pattern.
Claim 13
Independent Claim
136 words
A method of imaging an overlying conductive pattern over an underlying conductive pattern on a substrate, each conductive pattern being defined by image data to be applied at nominal locations according to scanning control data, said method comprising: selecting a plurality of features on said underlying conductive pattern to serve as reference targets; sensing the actual locations of said reference targets on said underlying conductive pattern while the substrate is carried by a holder; determining deviations in the sensed actual locations of said reference targets on said underlying conductive pattern with respect to the nominal locations of the reference targets in the underlying conductive pattern; and modifying said scanning control data of the overlying conductive pattern in accordance with said deviations to reduce misregistration of the overlying conductive pattern with respect to the underlying conductive pattern.
Claim 14
Dependent Claim
36 words
The method according to claim 11 , wherein said reference targets are connection sites on the underlying conductive pattern to be precisely aligned with, and electrically connected to, corresponding connection sites on the overlying conductive pattern.
Claim 15
Dependent Claim
40 words
The method according to claim 11 , wherein said reference targets are assigned different weights according to their registration tolerances, and said deviations are determined according to a threshold which varies with the weight assigned to the respective reference targets.
Claim 16
Dependent Claim
103 words
The method according to claim 11 , wherein each of said conductive patterns includes a global area having predetermined reference targets, and a local area having predetermined reference targets; the reference targets in the global area of the underlying conductive pattern being used for imaging the local area of the overlying conductive pattern with respect to the underlying conductive pattern; the determined deviations in the reference targets in the local area of the underlying conductive pattern being used for modifying the scanning control data to reduce misregistration of the local area of the overlying conductive pattern with respect to the underlying conductive pattern.
Claim 17
Dependent Claim
34 words
The method according to claim 11 , wherein each of said conductive patterns is imaged by directly imaging a photoresist layer with imaging data applied according to scanning control data for the respective pattern.
Claim 18
Dependent Claim
42 words
The method according to claim 11 , wherein said substrate is mounted on a flat holder, and said exposure head includes one or more lasers for imagining the conductive pattern, and a camera for sensing the actual locations of said tolerance targets.
Claim 19
Independent Claim
123 words
A method of making a PCB having a plurality of layers containing conductive patterns overlying each other and to be precisely located with respect to each other, said method comprising: applying each layer by an LDI process in which each conductive pattern is defined by image data to be applied at nominal locations according to scanning control data; determining deviations between the actual locations and the nominal locations of predetermined reference targets of each conductive pattern on a substrate before the overlying conductive pattern is applied thereover; and utilizing said determined deviations for modifying the scanning control data used for imaging the image data of each overlying conductive pattern in order to reduce misregistration thereof with respect to its respective underlying conductive pattern.
Claim 20
Independent Claim
123 words
A method of making a PCB having a plurality of layers containing conductive patterns overlying each other and to be precisely located with respect to each other, said method comprising: applying each layer by an LDI process in which each conductive pattern is defined by image data to be applied at nominal locations according to scanning control data; determining deviations between the actual locations and the nominal locations of predetermined reference targets of each conductive pattern on a substrate before the overlying conductive pattern is applied thereover; and utilizing said determined deviations for modifying the scanning control data used for imaging the image data of each overlying conductive pattern in order to reduce misregistration thereof with respect to its respective underlying conductive pattern.
Claim 21
Dependent Claim
24 words
The method according to claim 17 , wherein said predetermined reference targets are predetermined features in the underlying conductive pattern selected as reference targets.
Claim 22
Dependent Claim
35 words
The method according to claim 17 , wherein said predetermined reference targets are predetermined connection sites in the underlying conductive pattern to be precisely located with respect to connection sites in the overlying conductive pattern.
Claim 23
Dependent Claim
40 words
The method according to claim 17 , wherein said reference targets are assigned different weights according to their registration tolerances, and said deviations are determined according to a threshold which varies with the weight assigned to the respective reference target.
Claim 24
Dependent Claim
170 words
Apparatus for imaging conductive patterns on a substrate, comprising: a holder for holding the substrate; an imaging device for imaging at least two conductive patterns in overlying relationship to each other on said substrate, each conductive pattern being defined by image data to be applied at nominal locations on the substrate according to scanning control data; scanning means for effecting relative movement between the substrate and the imaging device according to the scanning control data for the respective conductive pattern; a sensor for sensing the actual locations of predetermined reference targets of an underlying conductive pattern on the substrate before an overlying conductive pattern is applied thereover; and a controller programmed to determine deviations between the actual locations and the nominal locations of predetermined reference targets of an underlying conductive pattern on the substrate and to utilize said determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern.
Claim 25
Dependent Claim
170 words
Apparatus for imaging conductive patterns on a substrate, comprising: a holder for holding the substrate; an imaging device for imaging at least two conductive patterns in overlying relationship to each other on said substrate, each conductive pattern being defined by image data to be applied at nominal locations on the substrate according to scanning control data; scanning means for effecting relative movement between the substrate and the imaging device according to the scanning control data for the respective conductive pattern; a sensor for sensing the actual locations of predetermined reference targets of an underlying conductive pattern on the substrate before an overlying conductive pattern is applied thereover; and a controller programmed to determine deviations between the actual locations and the nominal locations of predetermined reference targets of an underlying conductive pattern on the substrate and to utilize said determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern.
Claim 26
Dependent Claim
24 words
The apparatus according to claim 21 , wherein said predetermined reference targets are predetermined features in the underlying conductive pattern selected as reference targets.
Claim 27
Dependent Claim
35 words
The apparatus according to claim 21 , wherein said predetermined reference targets are predetermined connection sites in the underlying conductive pattern to be precisely located with respect to connection sites in the overlying conductive pattern.
Claim 28
Dependent Claim
41 words
The apparatus according to claim 21 , wherein said reference targets are assigned different weights according to their registration tolerances, and said controller determines said deviations according to a threshold which varies with the weight assigned to the respective reference target.
Claim 29
Dependent Claim
106 words
The apparatus according to claim 21 , wherein each of said conductive patterns includes a global area having predetermined reference targets, and a local area having predetermined reference targets; said controller utilizing the reference targets in the global area of the underlying conductive pattern for imaging the local area of the overlying conductive pattern with respect to the underlying conductive pattern; said controller utilizing the determined deviations in the reference targets in the local area of the underlying conductive pattern for modifying the scanning control data to reduce misregistration of the imaged local area of the overlying conductive pattern with respect to the underlying conductive pattern.
Claim 30
Dependent Claim
40 words
The apparatus according to claim 21 , wherein said imaging device images each of said conductive patterns directly on a photoresist layer with the imaging data of the respective pattern applied according to scanning control data for the respective pattern.
Claim 31
Dependent Claim
43 words
The apparatus according to claim 21 , wherein said scanning means produces relative movement between an exposure head and the substrate along two orthogonal axes to scan the surface of the substrate for imaging the respective conductive pattern with the respective imaging data.
Claim 32
Dependent Claim
15 words
The apparatus according to claim 27 , wherein said substrate holder is a flat holder.
Claim 33
Dependent Claim
16 words
The apparatus according to claim 28 , wherein said exposure head includes one or more lasers.
Claim 34
Dependent Claim
40 words
The apparatus according to claim 28 , wherein said flat holder is driven longitudinally, and said exposure head is driven transversely, under the control of said scanning control data to scan the surface of the substrate on said flat holder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-12-09 | 2006-06-10 | 2006-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-12-09 | 2010-06-10 | 2010-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-12-09 | 2014-06-10 | 2014-12-10 | $7700.00 | Window Closed / Lapsed |