US6483704B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microprocessor heat sink retention module
Assignee: Intel Corp
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Filing: 2001-03-29
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Granted: 2002-11-19
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Expires: 2021-03-29
Abstract
Abstract A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.
Inventors
- 👤 Neal Ulen
- 👤 Chris H. Hanes
- 👤 Ed Unrein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:16
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20509; H05K7/14; H05K7/1422; H05K7/1427; H05K7/1429; H05K7/1431
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
86 words
A microprocessor heat sink retention module comprising: a first frame having a first side and a second side, the first side being separated from the second side by a sufficient distance to enable a microprocessor to fit within the first frame, the first and second sides each having at least one aperture for receiving a microprocessor heat sink; and a heat transfer platform integrated with the first frame, the heat transfer platform comprising a substantially flat metal slab for dissipating heat generated by a voltage regulator.
Claim 2
Dependent Claim
86 words
A microprocessor heat sink retention module comprising: a first frame having a first side and a second side, the first side being separated from the second side by a sufficient distance to enable a microprocessor to fit within the first frame, the first and second sides each having at least one aperture for receiving a microprocessor heat sink; and a heat transfer platform integrated with the first frame, the heat transfer platform comprising a substantially flat metal slab for dissipating heat generated by a voltage regulator.
Claim 3
Dependent Claim
47 words
The microprocessor heat sink retention module of claim 1 wherein the heat transfer platform is at least about 1.5 inches wide and at least about 2.5 inches long; and wherein the first side is separated from the second side by between about 3 and about 4 inches.
Claim 4
Dependent Claim
44 words
The microprocessor heat sink retention module of claim 2 further comprising a voltage regulator heat sink that is integrated with the first frame and the heat transfer platform such that the heat transfer platform separates the first frame from the voltage regulator heat sink.
Claim 5
Dependent Claim
20 words
The microprocessor heat sink retention module of claim 3 wherein the voltage regulator heat sink includes a plurality of fins.
Claim 6
Dependent Claim
84 words
The microprocessor heat sink retention module of claim 4 further comprising: a second frame having a first side and a second side, the first side being separated from the second side by a sufficient distance to enable a microprocessor to fit within the second frame, the first and second sides each having at least one aperture for receiving a microprocessor heat sink; wherein the heat transfer platform and the voltage regulator heat sink are integrated with both the first frame and the second frame.
Claim 7
Dependent Claim
28 words
The microprocessor heat sink retention module of claim 5 wherein the heat transfer platform is at least about 3 inches wide and at least about 5 inches long.
Claim 8
Dependent Claim
32 words
The microprocessor heat sink retention module of claim 6 wherein the heat transfer platform is between about 3 and about 4 inches wide and between about 5 and about 7 inches long.
Claim 9
Dependent Claim
159 words
An assembly for a computer comprising: a microprocessor heat sink retention module, that module comprising: a first frame that may slide over a microprocessor socket, the first frame having a plurality of apertures located on its periphery for receiving a microprocessor heat sink; and a heat transfer platform integrated with the first frame, the heat transfer platform comprising a substantially flat metal slab; and a first microprocessor module, which is coupled to the microprocessor heat sink retention module, the first microprocessor module comprising: a first printed circuit board that includes a top surface and a bottom surface; a first microprocessor that is coupled to the top surface of the first printed circuit board; and a first voltage regulator that is coupled to the top surface of the first printed circuit board; in which the bottom surface of the first printed circuit board includes a metal sheet that contacts the heat transfer platform of the microprocessor heat sink retention module.
Claim 10
Dependent Claim
159 words
An assembly for a computer comprising: a microprocessor heat sink retention module, that module comprising: a first frame that may slide over a microprocessor socket, the first frame having a plurality of apertures located on its periphery for receiving a microprocessor heat sink; and a heat transfer platform integrated with the first frame, the heat transfer platform comprising a substantially flat metal slab; and a first microprocessor module, which is coupled to the microprocessor heat sink retention module, the first microprocessor module comprising: a first printed circuit board that includes a top surface and a bottom surface; a first microprocessor that is coupled to the top surface of the first printed circuit board; and a first voltage regulator that is coupled to the top surface of the first printed circuit board; in which the bottom surface of the first printed circuit board includes a metal sheet that contacts the heat transfer platform of the microprocessor heat sink retention module.
Claim 11
Dependent Claim
47 words
The assembly of claim 8 wherein the microprocessor heat sink retention module further comprises a voltage regulator heat sink that is integrated with the first frame and the heat transfer platform such that the heat transfer platform separates the first frame from the voltage regulator heat sink.
Claim 12
Dependent Claim
156 words
The assembly of claim 9 wherein the microprocessor heat sink retention module further comprises: a second frame that may slide over a microprocessor socket, the second frame having a plurality of apertures located on its periphery for receiving a microprocessor heat sink, wherein the heat transfer platform is integrated with both the first frame and the second frame; and further comprising: a second microprocessor module, which is coupled to the microprocessor heat sink retention module, the second microprocessor module comprising: a second printed circuit board that includes a top surface and a bottom surface; a second microprocessor that is coupled to the top surface of the second printed circuit board; and a second voltage regulator that is coupled to the top surface of the second printed circuit board; in which the bottom surface of the second printed circuit board includes a metal sheet that contacts the heat transfer platform of the microprocessor heat sink retention module.
Claim 13
Dependent Claim
126 words
A computer system comprising: a motherboard with a first socket for receiving a first microprocessor; a first microprocessor module comprising: a first printed circuit board that includes a top surface and a bottom surface; a first microprocessor that is coupled to both the first socket and the top surface of the first printed circuit board; and a first voltage regulator that is coupled to the top surface of the first printed circuit board; and a microprocessor heat sink retention module, that module comprising: a first frame that is positioned around the periphery of the first socket, the first frame being coupled to a microprocessor heat sink; and a heat transfer platform integrated with the first frame, the heat transfer platform comprising a substantially flat metal slab.
Claim 14
Dependent Claim
126 words
A computer system comprising: a motherboard with a first socket for receiving a first microprocessor; a first microprocessor module comprising: a first printed circuit board that includes a top surface and a bottom surface; a first microprocessor that is coupled to both the first socket and the top surface of the first printed circuit board; and a first voltage regulator that is coupled to the top surface of the first printed circuit board; and a microprocessor heat sink retention module, that module comprising: a first frame that is positioned around the periphery of the first socket, the first frame being coupled to a microprocessor heat sink; and a heat transfer platform integrated with the first frame, the heat transfer platform comprising a substantially flat metal slab.
Claim 15
Dependent Claim
33 words
The computer system of claim 11 wherein the bottom surface of the first printed circuit board includes a metal sheet that contacts the heat transfer platform of the microprocessor heat sink retention module.
Claim 16
Dependent Claim
48 words
The computer system of claim 12 wherein the microprocessor heat sink retention module further comprises a voltage regulator heat sink that is integrated with the first frame and the heat transfer platform such that the heat transfer platform separates the first frame from the voltage regulator heat sink.
Claim 17
Dependent Claim
142 words
The computer system of claim 13 wherein the motherboard further comprises a second socket for receiving a second microprocessor; wherein the microprocessor heat sink retention module further comprises: a second frame that is positioned around the periphery of the second socket, the second frame being coupled to a microprocessor heat sink, wherein the heat transfer platform is integrated with both the first frame and the second frame; and further comprising: a second microprocessor module, which is coupled to both the second socket and the microprocessor heat sink retention module, the second microprocessor module comprising: a second printed circuit board that includes a top surface and a bottom surface; a second microprocessor that is coupled to the top surface of the second printed circuit board; and a second voltage regulator that is coupled to the top surface of the second printed circuit board.
Claim 18
Dependent Claim
50 words
The computer system of claim 14 wherein the bottom surface of the second printed circuit board includes a metal sheet that contacts the heat transfer platform of the microprocessor heat sink retention module; and wherein separate heat sinks are mounted on top of the first microprocessor and the second microprocessor.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-11-18 | 2006-05-20 | 2006-11-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-11-18 | 2010-05-20 | 2010-11-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-11-18 | 2014-05-20 | 2014-11-19 | $7700.00 | Window Closed / Lapsed |