Patent US6473883B1 successfully refreshed from Google Patents.
US6473883B1
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Integrated circuit performance and reliability using angle measurement for a patterned bump layout on a power grid
Assignee: Oracle America Inc
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Filing: 2001-11-29
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Granted: 2002-10-29
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Expires: 2021-11-29
Abstract
Abstract A method for improving integrated circuit by using a patterned bump layout on a layer of the integrated circuit is provided. The method creates various bump structures by varying an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump. By varying the angle, a designer may generate a particular bump structure that meets the needs of a particular design. Further, a particular bump placement may be repeated across all or a portion of the metal layer in order to create a patterned bump layout.
Inventors
- 👤 Sudhakar Bobba
- 👤 Tyler Thorp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 11:18
CPC Classifications
G; G06; G06F; G06F30/00; G06F30/30; G06F30/39
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
108 words
A method for designing an integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the method comprising: defining a desired angle, wherein the desired angle represents an angle formed between a line from a reference bump to a first bump and a line from the reference bump to a second bump, wherein the first and second bumps reside on the first metal bar, and wherein the reference bump resides on the second metal bar; and using the desired angle to position the first metal bar, the first bump, and the second bump on the integrated circuit.
Claim 2
Independent Claim
108 words
A method for designing an integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the method comprising: defining a desired angle, wherein the desired angle represents an angle formed between a line from a reference bump to a first bump and a line from the reference bump to a second bump, wherein the first and second bumps reside on the first metal bar, and wherein the reference bump resides on the second metal bar; and using the desired angle to position the first metal bar, the first bump, and the second bump on the integrated circuit.
Claim 3
Dependent Claim
53 words
The method of claim 1 , wherein using the desired angle to position the first metal bar, the first bump, and the second bump creates a particular bump structure among the first bump, the second bump, and the reference bump, the method further comprising: repeating the bump structure across the top metal layer.
Claim 4
Dependent Claim
56 words
The method of claim 1 , wherein using the desired angle to position the first metal bar, the first bump, and the second bump creates a particular bump structure among the first bump, the second bump, and the reference bump, the method further comprising: repeating the bump structure across a portion of the top metal layer.
Claim 5
Dependent Claim
29 words
The method of claim 1 , wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
Claim 6
Dependent Claim
33 words
The method of claim 1 , further comprising: determining a value of the desired angle prior to positioning the first metal bar, the first bump, and the second bump on the integrated circuit.
Claim 7
Dependent Claim
53 words
The method of claim 5 , wherein determining the value of the desired angle is dependent upon at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, desired signal track availability.
Claim 8
Independent Claim
106 words
A method for designing an integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the method comprising: defining a desired angle, wherein the desired angle represents an angle formed between a line from a reference bump to a first bump and a line from the reference bump to a second bump, wherein the first and second bumps reside on the first metal bar, and wherein the reference bump resides on the second metal bar; and using the desired angle to position the first metal bar and the second metal bar on the integrated circuit.
Claim 9
Independent Claim
106 words
A method for designing an integrated circuit having a top metal layer, the top metal layer having a first metal bar and a second metal bar, the method comprising: defining a desired angle, wherein the desired angle represents an angle formed between a line from a reference bump to a first bump and a line from the reference bump to a second bump, wherein the first and second bumps reside on the first metal bar, and wherein the reference bump resides on the second metal bar; and using the desired angle to position the first metal bar and the second metal bar on the integrated circuit.
Claim 10
Dependent Claim
55 words
The method of claim 7 , wherein using the desired angle to position the first metal bar and the second metal bar on the integrated circuit creates a particular bump structure among the first bump, the second bump, and the reference bump, the method further comprising: repeating the bump structure across the top metal layer.
Claim 11
Dependent Claim
58 words
The method of claim 7 , wherein using the desired angle to position the first metal bar and the second metal bar on the integrated circuit creates a particular bump structure among the first bump, the second bump, and the reference bump, the method further comprising: repeating the bump structure across a portion of the top metal layer.
Claim 12
Dependent Claim
29 words
The method of claim 7 , wherein the first metal bar is operatively connected to a voltage source, and wherein the second metal bar is operatively connected to ground.
Claim 13
Dependent Claim
31 words
The method of claim 7 , further comprising: determining a value of the desired angle prior to positioning the first metal bar and the second metal bar on the integrated circuit.
Claim 14
Dependent Claim
52 words
The method of claim 11 , wherein determining the value the desired angle is dependent upon at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the top metal layer, desired signal track availability.
Claim 15
Dependent Claim
48 words
A computer system, comprising: a processor; a memory; and instructions, residing in the memory and executable on the processor, for determining a value of an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump.
Claim 16
Dependent Claim
48 words
A computer system, comprising: a processor; a memory; and instructions, residing in the memory and executable on the processor, for determining a value of an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump.
Claim 17
Dependent Claim
42 words
The computer system of claim 13 , wherein the reference bumps resides on a first metal bar of a metal layer of an integrated circuit, and wherein the first and second bumps reside on a second metal bar of the metal layer.
Claim 18
Dependent Claim
58 words
The computer system of claim 13 , wherein determining the value of the angle is dependent on a desired metal layer property comprising at least one selected from the group consisting of: a desired capacitance, a desired resistance, a desired inductance, a desired bump current flow, a desired bump population on the metal layer, desired signal track availability.
Claim 19
Dependent Claim
21 words
The computer system of claim 15 , further comprising: determining a metal layer design based on the desired metal layer property.
Claim 20
Dependent Claim
77 words
A computer-readable medium having instructions therein executable by processing, the instructions for: inputting a desired metal layer property; and determining a value of an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump based on the desired metal layer property, wherein the reference bump resides on a first metal bar, and wherein the first and second bumps reside on a second metal bar.
Claim 21
Dependent Claim
77 words
A computer-readable medium having instructions therein executable by processing, the instructions for: inputting a desired metal layer property; and determining a value of an angle between a line from a reference bump to a first bump and a line from the reference bump to a second bump based on the desired metal layer property, wherein the reference bump resides on a first metal bar, and wherein the first and second bumps reside on a second metal bar.
Claim 22
Dependent Claim
32 words
The computer-readable medium of claim 17 , wherein the value of the angle is used to create a particular bump placement among the first bump, the second bump, and the reference bump.
Claim 23
Dependent Claim
21 words
The computer-readable medium of claim 18 , wherein the bump placement is repeated across a metal layer of an integrated circuit.
Claim 24
Dependent Claim
24 words
The computer-readable medium of claim 18 , wherein the bump placement is repeated across a portion of a metal layer of an integrated circuit.
References Cited (Backward Citations)
US6028673A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-10-28 | 2006-04-29 | 2006-10-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-10-28 | 2010-04-29 | 2010-10-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-10-28 | 2014-04-29 | 2014-10-29 | $7700.00 | Window Closed / Lapsed |